| PART |
Description |
Maker |
| FD120H06A5B |
Fred Die
|
International Rectifier
|
| BYP102 C67047-A2071-A2 |
FRED Diode(FRED 二极 李华明二极管（弗雷德二极管）
FRED Diode (Fast recovery epitaxial diode Soft recovery characteristics)
From old datasheet system
FRED-FET Diode
|
Siemens Semiconductor G...
SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Infineon
|
| TLE5009A16 |
Available as single die and dual die with separate supplies for each die
|
Infineon Technologies A...
|
| SAK-C505CA-4RC SAK-C505CA-LC C505CA-4RC SAA-C505CA |
8-Bit Microcontrollers - High temperature 8-Bit CMOS microcontroller (T=150°C ) with mask-programmable ROM, bare die, with CAN, (20 MHz)
8-bit Single-Chip Microcontroller (Bare Die Delivery)
|
INFINEON[Infineon Technologies AG]
|
| DSEI12-12A DSEI1212 DSEI-12 |
Fast Recovery Epitaxial Dioder (FRED)
Fast Recovery Epitaxial Diode (FRED)
Fast Recovery Diodes
|
IXYS Corporation
|
| MR18R162GAF0 MR16R162GAF0 MR18R1624AF0 MR18R1622AF |
64M X 16 RAMBUS MODULE, DMA184
TVS 500W 6.5V BIDIRECT DO-15 6Mx16显示）2/8/16）件RIMM的模块，基于256Mb阿芯片，32秒银行，16K/32ms参考，.5V
16Mx16显示）2/8/16）件RIMM的模块，基于256Mb阿芯片，32秒银行，16K/32ms参考，.5V
(MR18R1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
(MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
|
Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
|
| SIDC00D60SIC2SAWN SIDC00D60SIC2UNSAWN |
Diodes - HV Chips - 600V, 2A die sawn
Diodes - HV Chips - 600V, 2A die unsawn
|
Infineon
|
| TCU10A60-11A |
FRED
|
Nihon Inter Electronics...
|
| FSU10A40 |
FRED
|
Nihon Inter Electronics Corporation
|
| APTDF30H601G |
FRED 50-1700V
|
Microsemi
|
| MF200K06F3 |
FRED Modules
|
Jiangsu APT Semiconductor Co.,Ltd
|
