| PART |
Description |
Maker |
| LCM-S01602DSF-A SCM-S01602DSFA |
TRANSFLECTIVE
5.56mm CHARACTER HEIGHT, 5 x 8 DOT MATRIX, STN, TRANSFLECTIVE WITH LED BAKLIGHT, 16 x 2 LCD MODULE, 1/16 DUTY, 1/5 BIAS
|
LUMEX INC.
|
| LCM-S01602DSR-A LCM-S01602DSRA |
5.56mm CHARACTER HEIGHT, 5x8 DOT MATRIX, 16x2 LCD MODULE
5.56MM CHARACTER HEIGHT 5 X8 DOT MATRIX
|
LUMEX INC.
|
| BF128128E |
FSTN Transflective LCD, COF package Built-in driver HD66750
|
Bolymin, Inc
|
| LCM-E01602DSF |
16X2 CHARACTER LCD MOD, STN TRANSFLECTIVE IC INTERFACE, NT7651, WHITE LED BKLT
|
LUMEX INC.
|
| BF9864A |
FSTN Transflective LCD, COF package Built-in driver PCF8548, serial I2C data bus
|
Bolymin, Inc
|
| LCM-H01601DSR |
6.56mm CHAR, HEIGHT, 5x8 dot MATRIX, 16x1 LCD MODULE
|
LUMEX INC.
|
| LCM-S01601DSF |
6.56mm CHARACTER HEIGHT , 5x8 DOT MATRIX, 16x1 LCD MODULE
|
LUMEX INC.
|
| 1-2013620-3 |
PGA Sockets; SOCKET ASSY W/EMBOSS TAPE 56mm, rPGA988A ( Tyco Electronics )
|
Tyco Electronics
|
| 44067-1203 0440671203 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 12 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti
|
Molex Electronics Ltd.
|
| 44067-0603 0440670603 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
Molex Electronics Ltd.
|
| 44067-1602 0440671602 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
|
Molex Electronics Ltd.
|
|
