| PART |
Description |
Maker |
| MCA104 |
Multi-Chip Array Two NPN and Two PNP High Speed / Medium Power Switching Transistors
MULTI-CHIP ARRAY TWO NPN AND TWO PNP HIGH SPEED, MEDIUM POWER SWITCHING TRANSISTORS IN A HERMETICALLY SEALED CERAMIC SURFACE MOUNT PACKAGE
|
Semelab PLC
SEME-LAB[Seme LAB]
|
| 2N2907ADCSM |
Dual High Speed Medium Power PNP Switching Transistor In Hermetic Cermic Surface Mount Package For High Reliability Application(高速、中等功率、开关型双PNP晶体管（高可靠性、陶瓷表贴封装）)
DUAL HIGH SPEED, MEDIUM POWER PNP SWITCHING TRANSISTOR IN A HERMETICALLY SEALED CERAMIC SURFACE MOUNT PACKAGE FOR HIGH RELIABILITY APPLICATIONS
|
TT electronics Semelab Limited
SEME-LAB[Seme LAB]
|
| PV18-6R-CY PV18-6R-MY PV18-4R-CY PV18-4R-MY PV18-8 |
22-18 BARREL FUNNELED VINYL INSULATED RING TONGUE, .150(3.81) MAX WIRE INSULATION DIAMETER
TERM RING VNYL INS ROHS RoHS Compliant: Yes RING TERMINAL
TERM RING VINYL INS RoHS Compliant: Yes RING TERMINAL
TERM RING VINYL INS RING TERMINAL
Ring Tongue Solderless Terminal; Wire Size (AWG):22-18; Stud Size:#8; Insulator Color:Red; Mounting Hole Dia:.17"; Overall Length:0.91"; Overall Width:0.31"; Pack Quantity:1000; Stud/Tab Size:#8 RING TERMINAL
|
PANDUIT CORP.
Panduit, Corp.
|
| FS16SM-5 |
Power MOSFETs: FS Series, Medium Voltage, 250V
Nch POWER MOSFET HIGH-SPEED SWITCHING USE
|
Mitsubishi Electric Corporation
Powerex Power Semiconductors
|
| TIP31 TIP31C TIP31A TIP31B |
Medium Power Linear Switching Applications
|
SemiHow Co.,Ltd.
|
| E80276 E80271 E80276N |
TRANSISTOR MODULES MEDIUM POWER SWITCHING USE
|
Mitsubishi Electric Semiconductor
|
| QM30DY-HB QM30 |
MEDIUM POWER SWITCHING USE INSULATED TYPE
|
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| QM50HA-H |
MEDIUM POWER SWITCHING USE INSULATED TYPE
|
Mitsubishi Electric Sem...
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
| SST440107 |
NPN Medium Power Transistor (Switching)
|
Rohm
|
| CM50E3U-24H |
MEDIUM POWER SWITCHING USE INSULATED TYPE
|
Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
|
