| PART |
Description |
Maker |
| M14C16DD M14C16-DD |
M14C16 Die Description
|
SGS Thomson Microelectronics
STMICROELECTRONICS[STMicroelectronics]
|
| TLE5009A16 |
Available as single die and dual die with separate supplies for each die
|
Infineon Technologies A...
|
| HM365788H-5 HM365788K-9 HM365788K-5 HM365788N-9 HM |
x4 SRAM
ECU interface connectors; HRS No: 757-0010-2 00; Operating Temperature Range (degrees C): -30 to 105; General Description: Accessory; Retainer
Small automotive connectors; HRS No: 763-0095-7 00; Mating/Unmating Cycles: 30; Operating Temperature Range (degrees C): -30 to 105; General Description: Clamp x4的SRAM
|
TE Connectivity, Ltd.
|
| IRG4CC50WB |
IGBT Die in Wafer Form 600 V Size 5 WARP Speed
IRG4CC50WB IGBT Die in Wafer Form
|
Hittite Microwave Corporation
International Rectifier
|
| APM2301CAC |
Pin Description
|
TY Semiconductor Co., Ltd
|
| APM2301 |
Pin Description
|
TY Semiconductor Co., Ltd
|
| KA7307D |
GENERAL DESCRIPTION
|
Samsung semiconductor
|
| AOWF12N60 AOWF12N60L |
Marking Description
|
Alpha & Omega Semiconductors
|
| ANTDB1HDPXXX |
Product Description
|
List of Unclassifed Man...
|
| KS7308 |
FCM
GENERAL DESCRIPTION
|
Samsung Electronic
Samsung semiconductor
|
| BT132 |
TRANSISTOR
GENERAL DESCRIPTION
|
TY Semicondutor
TY Semiconductor Co., Ltd
|
| AOTF3N90L |
PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|
