prototype pdf Datasheet P9 Description --- IC-ON-LINE


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For prototype Found Datasheets File :: 87+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> |

					Aeroflex Circuit Technology
Part No.	5962-9211804QYA 5962-9211804QYX 5962-9211804QYC 5962-9211804VYA 5962-9211804VYC 5962-9466307QXC 5962-9466307QXA 5962-9211804VYX UT69151EFCA UT69151EFCC UT69151EFCX UT69151EFPA UT69151EFPC UT69151EFPX UT69151EGCA UT69151EGCX UT69151EGPA UT69151EGPC UT69151EGPX UT69151EWCC UT69151EWCA UT69151EWCX UT69151EWPA UT69151EWPC UT69151EWPX 5962F9466310QYA 5962F9466310QYC 5962F9466310QYX 5962F9466310VYA 5962F9466310VYC 5962F9466310VYX 5962F9466311QYC 5962F9466311QYA 5962F9466311QYX 5962F9466311VYA 5962F9466311VYC 5962F9466311VYX UT69151-DXEGCX UT69151-DXEGPC UT69151CDXEGCA UT69151CDXEGCX UT69151-DXEGCA UT69151CDXEGPC 5962-9466307QXX 5962-9466307QYA 5962-9466307QYC 5962-9466307QYX 5962-9466309QYX 5962-9466308QYX 5962-9475805QYX 5962-9475804QYX 5962-9475807QYX 5962-9475806QYX 5962-9475809QYX 5962-9475808QYX 5962F9211804QYX UT69151CWCA UT69151CWCC UT69151CWCX 5962-9466309VXA 5962-9466309VYX 5962-9466309VYA 5962R9466310QYC 5962R9466310VYA 5962R9466310VYC 5962R9466310VYX UT69151CGCC UT69151CGCX UT69151CGCA 5962F9211803VZC 5962R9211803VZC 5962-9466308VYA 5962-9466308QXA 5962R9211803QXA 5962R9211803QZC 5962R9211803VZA 5962R9211804QYC 5962R9211804VYC 5962R9211803QXC 5962R9211803VXC 5962R9211803VZX 59
Description	RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 04. Class designator Q. Lead finish solder. Radiation none. RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 04. Class designator Q. Lead finish optional. Radiation none. RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 04. Class designator Q. Lead finish gold. Radiation none. RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 04. Class designator V. Lead finish solder. Radiation none. RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 04. Class designator V. Lead finish gold. Radiation none. Non-RadHard enhanced SuMMIT LXE15 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class Q. Lead finish gold. Radiation none. Non-RadHard enhanced SuMMIT LXE15 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class Q. Lead finish solder. Radiation none. RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 04. Class designator V. Lead finish optional. Radiation none. Enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor. SMD device type 03. Lead finish solder. Enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor. SMD device type 03. Lead finish gold. Enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor. SMD device type 03. Lead finish optional. Enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor. SMD device type 03. Lead finish solder. prototype. Enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor. SMD device type 03. Lead finish gold. prototype. Enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor. SMD device type 03. Lead finish optional. prototype. RadHard enhanced SuMMIT LXE15 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class Q. Lead finish solder. Radiation 3E5(300KRad). RadHard enhanced SuMMIT LXE15 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class Q. Lead finish gold. Radiation 3E5(300KRad). RadHard enhanced SuMMIT LXE15 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class Q. Lead finish optional. Radiation 3E5(300KRad). RadHard enhanced SuMMIT LXE15 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class V. Lead finish solder. Radiation 3E5(300KRad). RadHard enhanced SuMMIT LXE15 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class V. Lead finish gold. Radiation 3E5(300KRad). RadHard enhanced SuMMIT LXE15 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class V. Lead finish optional. Radiation 3E5(300KRad). RadHard enhanced SuMMIT DXE5 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class Q. Lead finish gold. Radiation 3E5(300Krad). RadHard enhanced SuMMIT DXE5 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class Q. Lead finish solder. Radiation 3E5(300Krad). RadHard enhanced SuMMIT DXE5 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class Q. Lead finish optional. Radiation 3E5(300Krad). RadHard enhanced SuMMIT DXE5 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class V. Lead finish solder. Radiation 3E5(300Krad). RadHard enhanced SuMMIT DXE5 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class V. Lead finish gold. Radiation 3E5(300Krad). RadHard enhanced SuMMIT DXE5 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class V. Lead finish optional. Radiation 3E5(300Krad). Non-RadHard enhanced SuMMIT DXE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. SMD device type 07,08. 5V operation. Lead finish optional. Non-RadHard enhanced SuMMIT DXE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. SMD device type 07,08. 5V operation. Lead finish gold. prototype. Non-RadHard enhanced SuMMIT DXE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. SMD device type 10,11. 5V operation. Lead finish solder. Non-RadHard enhanced SuMMIT DXE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. SMD device type 10,11. 5V operation. Lead finish optional. Non-RadHard enhanced SuMMIT DXE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. SMD device type 07,08. 5V operation. Lead finish solder. Non-RadHard enhanced SuMMIT DXE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. SMD device type 10,11. 5V operation. Lead finish gold. prototype. Non-RadHard enhanced SuMMIT LXE15 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class Q. Lead finish optional. Radiation none. Non-RadHard enhanced SuMMIT LXE12 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class Q. Lead finish optional. Radiation none. Non-RadHard enhanced SuMMIT DXE5 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class Q. Lead finish optional. Radiation none. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish optional. Class Q. Device type 05 (SuMMIT XTE 5V). Radiation none. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish optional. Class Q. Device type 04 (SuMMIT XTE 5V/15V). Radiation none. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish optional. Class Q. Device type 07 (SuMMIT XTE 5V/15V). Radiation none. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish optional. Class Q. Device type 06 (SuMMIT XTE 5V/12V). Radiation none. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish optional. Class Q. Device type 09 (SuMMIT XTE 5V/12V). Radiation none. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish optional. Class Q. Device type 08 (SuMMIT XTE 5V/5V). Radiation none. RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 04. Class designator Q. Lead finish optional. Radiation 3E5(300KRad). Enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor. SMD device type 04. Lead finish solder. Enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor. SMD device type 04. Lead finish gold. Enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor. SMD device type 04. Lead finish optional. Non-RadHard enhanced SuMMIT LXE12 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class V. Lead finish solder. Radiation none. Non-RadHard enhanced SuMMIT LXE12 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class V. Lead finish optional. Radiation none. RadHard enhanced SuMMIT LXE15 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class Q. Lead finish gold. Radiation 1E5(100Krad). RadHard enhanced SuMMIT LXE15 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class V. Lead finish solder. Radiation 1E5(100Krad). RadHard enhanced SuMMIT LXE15 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class V. Lead finish gold. Radiation 1E5(100Krad). RadHard enhanced SuMMIT LXE15 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class V. Lead finish optional. Radiation 1E5(100Krad). Non-RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 03. Class designator V. Lead finish gold. Radiation 3E5(300KRad). Non-RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 03. Class designator V. Lead finish gold. Radiation 1E5(100KRad). Non-RadHard enhanced SuMMIT DXE5 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class V. Lead finish solder. Radiation none. Non-RadHard enhanced SuMMIT DXE5 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class Q. Lead finish solder. Radiation none. Non-RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 03. Class designator Q. Lead finish solder. Radiation 1E5(100KRad). Non-RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 03. Class designator Q. Lead finish gold. Radiation 1E5(100KRad). Non-RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 03. Class designator V. Lead finish solder. Radiation 1E5(100KRad). RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 04. Class designator Q. Lead finish gold. Radiation 1E5(100KRad). RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 04. Class designator V. Lead finish gold. Radiation 1E5(100KRad). Non-RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 03. Class designator V. Lead finish optional. Radiation 1E5(100KRad). RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 04. Class designator Q. Lead finish solder. Radiation 1E5(100KRad). RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 04. Class designator V. Lead finish solder. Radiation 1E5(100KRad). Non-RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 03. Class designator Q. Lead finish optional. Radiation 1E5(100KRad). RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 04. Class designator V. Lead finish optional. Radiation 1E5(100KRad). Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish solder. Class Q. Device type 05 (SuMMIT XTE 5V). Radiation none. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish gold. Class Q. Device type 05 (SuMMIT XTE 5V). Radiation none. Non-RadHard enhanced SuMMIT LXE15 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class V. Lead finish gold. Radiation none. RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 04. Class designator V. Lead finish gold. Radiation 3E5(300KRad). Non-RadHard enhanced SuMMIT LXE15 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class V. Lead finish solder. Radiation none. Non-RadHard enhanced SuMMIT LXE15 MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Class V. Lead finish optional. Radiation none. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish gold. Class Q. Device type 08 (SuMMIT XTE 5V/5V). Radiation none. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish solder. Class Q. Device type 08 (SuMMIT XTE 5V/5V). Radiation none. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. 5V/-12V operation. Lead finish optional. Radiation none. Non-RadHard enhanced SuMMIT LXE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. SMD device type 10,11. 5V/-15V operation. Lead finish optional. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish gold. Class Q. Device type 07 (SuMMIT XTE 5V/15V). Radiation none. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. 5V/-12V operation. Lead finish gold. Radiation none. Non-RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 03. Class designator V. Lead finish solder. Radiation 3E5(300KRad). Non-RadHard enhanced SuMMIT E MIL-STD-1553 dual redundant bus controller/remote terminal monitor: SMD. Device type 03. Class designator V. Lead finish optional. Radiation 3E5(300KRad). Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish solder. Class Q. Device type 09 (SuMMIT XTE 5V/12V). Radiation none. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish gold. Class Q. Device type 09 (SuMMIT XTE 5V/12V). Radiation none. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module: SMD. Lead finish gold. Class Q. Device type 04 (SuMMIT XTE 5V/15V). Radiation none. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. 5V operation. Lead finish solder. Radiation none. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. 5V operation. Lead finish optional. Radiation none. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. 5V operation. Lead finish gold. Radiation none. Enhanced SuMMIT XTE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. 5V operation. Lead finish gold. Protptype. Radiation none. Non-RadHard enhanced SuMMIT LXE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. SMD device type 10,11. 5V/-15V operation. Lead finish solder. Non-RadHard enhanced SuMMIT LXE MIL-STD-1553 dual redundant bus controller/remote terminal/monitor/transceiver multichip module. SMD device type 07,08. 5V/-15V operation. Lead finish solder.
File Size	12.85K / 3 Page	View it Online	Download Datasheet

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Part No.	UT80CRH196KDS-WCA UT80CRH196KDS-WCC UT80CRH196KDS-WCX UT80CRH196KDS-WPC 5962R0252301VXA 5962R0252301VXC 5962R0252301VXX 5962R0252302VXC 5962R0252302VXA 5962R0252302VXX 5962R0252302QXC
Description	Microcontroller. Lead finish solder. Microcontroller. Lead finish gold. Microcontroller. Lead finish optional. Microcontroller. Lead finish gold. prototype. 16-bit microcontroller: SMD. Class V, 20MHz. Lead finish solder. Total dose 1E5 rads(Si). 16-bit microcontroller: SMD. Class V, 20MHz. Lead finish gold. Total dose 1E5 rads(Si). 16-bit microcontroller: SMD. Class V, 20MHz. Lead finish optional. Total dose 1E5 rads(Si). 16-bit microcontroller: SMD. Class Q, 20MHz. Lead finish gold. Total dose 1E5 rads(Si).
File Size	178.93K / 43 Page	View it Online	Download Datasheet

					Aeroflex Circuit Technology
Part No.	5962D0053601QUA 5962D0053601TXA 5962D0053602TXA 5962D0053601TXC 5962D0053602QXA 5962D0053602TUC 5962D0053602QXC 5962D0053603QUA 5962D0053601TUA 5962D0053601QXX 5962D0053601TUC 5962D0053601TUX 5962D0053602TUX 5962D0053602QUX 5962D0053602TXX 5962D0053602QXX 5962D0053602QUA 5962D0053601QXA 5962D0053601TXX 5962D0053602QUC 5962D0053602TXC 5962D0053601QXC 5962D0053602TUA 5962D0053601QUX 5962D0053601QUC 5962D0053603QUX 5962D0053603QXA 5962D0053603QXX 5962D0053603QXC 5962D0053603QUC UT9Q512-IWX UT9Q512-IWC UT9Q512-20ICC UT9Q512-20ICX UT9Q512-20IPC UT9Q512-20IWC UT9Q512-20UCC UT9Q512-20UCA UT9Q512-20UCX UT9Q512-20UWA UT9Q512-ICA UT9Q512-IPC UT9Q512-20ICA UT9Q512-20IWA UT9Q512-20IWX UT9Q512-20UPC UT9Q512-20UWC UT9Q512-20UWX UT9Q512-ICC UT9Q512-ICX UT9Q512-IWA UT9Q512-UCA 5962D0053603TXC 5962D0053604TXC 5962L0053601TXC 5962L0053602TXC 5962L0053603TXC 5962L0053604TXC 5962P0053601TXC 5962P0053602TXC 5962P0053603TXC 5962P0053604TXC 5962L0053601QUA 5962L0053601QUC 5962L0053601QUX 5962L0053601QXA 5962L0053601QXC 5962L0053601QXX 5962L0053601TUA 5962L0053601TUC 5962L0053601TUX 5962L0053601TXX 5962L0053602QUA 5962L0053602QUC 5962L0053602QUX 5962L0053602QXA 5962L0053602QXC 5962L0053602TUA 5962L0053602
Description	512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish factory option. 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish factory option. 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. prototype flow. 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. prototype flow. 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 1E4(10krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)). 512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 3E4(30krad(Si)).
File Size	128.60K / 15 Page	View it Online	Download Datasheet

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Part No.	5962R-0323502QUA 5962R-0323501VUC 5962R-0323502QUC UT8R512K8-15UCC UT8R512K8-15UCA UT8R512K8-15UPC UT8R512K8-15UCX UT8R512K8-15UWX 5962R-0323502QUX 5962R-0323502VUA
Description	512K x 18 SRAM: SMD. 15ns access time, CMOS I/O. Class Q. Lead finish hot solder dipped. Total dose 100K rad(Si). 512K x 18 SRAM: SMD. 15ns access time, CMOS I/O. Class V. Lead finish gold. Total dose 100K rad(Si). 512K x 18 SRAM: SMD. 15ns access time, CMOS I/O. Class Q. Lead finish gold. Total dose 100K rad(Si). 512K x 18 SRAM. 15ns access time. Lead finish hot gold. 512K x 18 SRAM. 15ns access time. Lead finish hot solder dipped. 512K x 18 SRAM. 15ns access time. Lead finish gold. prototype flow. 512K x 18 SRAM. 15ns access time. Lead finish factory option. 512K x 18 SRAM: SMD. 15ns access time, CMOS I/O. Class Q. Lead finish factory option. Total dose 100K rad(Si). 512K x 18 SRAM: SMD. 15ns access time, CMOS I/O. Class V. Lead finish hot solder dipped. Total dose 100K rad(Si).
File Size	109.30K / 14 Page	View it Online	Download Datasheet

					CREE POWER
Part No.	W4NRD0X-0000 W4NRD8C-U000 W4NXD8C-0000 W4NXD8C-L000 W4NXD8D-0000 W4NXD8C-S000 W4NXD8D-S000 W4NXD8G-0000 W6NRE0X-0000 W6NRD0X-0000 W6PXD3O-0000 W6NXD3L-0000 W6NXD0K-0000 W6NXD3K-0000
Description	Diameter: 50.8mm; LCW substrates; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition Diameter: 50.8mm; ultra-low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition Diameter: 50.8mm; standatd mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition Diameter: 50.8mm; low mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition Diameter: 50.8mm; select mircopipe density; silicon carbide substrates. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition Diameter: 76.2mm; LCW type; 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition Diameter: 50.8mm; LCW type; 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition Diameter: 50.8mm; lsemi-insulating (prototype); 6H-silicon carbide. For high frequency power devices, high power devices, high temperature devices, optoelectronic devices, III-V nitride deposition
File Size	273.34K / 17 Page	View it Online	Download Datasheet

					Jewel Hill Electronic Co., Ltd. 保险
Part No.	GB082AHGAAMLA-V01 GB082AHGBANLA-V01 GB082AHYAANLA-V01 GB082AHGBBNLA-V01 GB082AHYABMLA-V01 GB082AHGAANLA-V01 GB082AHYBBNLA-V01 GB082AHGABNLA-V01 GB082AHYAAMLA-V01 GB082AHYABNLA-V01 GB082ANGAANLA-V01 GB082ANGABMLA-V01 GB082AHYBAMLA-V01 GB082AHYBBMLA-V01 GB082AHGBAMLA-V01 GB082ANGAAMLA-V01 GB082AHGABMLA-V01 GB082AHYBANLA-V01 GB082ANGABNLA-V01 GB082AHGBBMLA-V01 GB082AHGAAMLB-V01 GB082AHGAANLB-V01 GB082AHGABNLB-V01 GB082AHGBAMLB-V01 GB082AHGBBNLB-V01 GB082AHGABMLB-V01 GB082AHGBANLB-V01 GB082AHYAAMLB-V01 GB082AHYAANLB-V01 GB082ANGABMLB-V01 GB082AHYABMLB-V01 GB082AHYABNLB-V01 GB082ANGAAMLB-V01 GB082ANGAANLB-V01 GB082ANGABNLB-V01 GB082AHGBBMLB-V01 GB082AHYBAMLB-V01 GB082AHYBBNLB-V01 GB082AHYBANLB-V01 GB082AHYBBMLB-V01 GB082ASYAANLA-V01 GB082AHYBANUB-V01 GB082AHYBAMUA-V01 GB082AHYBANUA-V01 GB082AHYBANDA-V01 GB082AHYBBMUB-V01 GB082AHYBAMUB-V01 GB082AHYBBMUA-V01 GB082AHYBBMDA-V01 GB082AHYBANDB-V01 GB082AHYBAMDA-V01 GB082AHYBBMDB-V01 GB082AHYBBNDA-V01 GB082AHYBAMDB-V01 GB082AHGAANDA-V01 GB082AHGABNDB-V01 GB082AHGBANDA-V01 GB082AHGAANDB-V01 GB082AHGABNDA-V01 GB082ANYAAMLA-V01 GB082ANYAANDB-V01 GB082ANYAAMLB-V01 GB082ANYAANLA-V01 GB082ANYAANUA-V01 GB082ANYABMDB-V01 GB082ANYAAMDA-V01 GB082ANYAANL
Description	AP,RADIAL 2.2UF,100V 5mm X 11mm (10) CAP,RADIAL,47uF,16V, ! 20%,85C,6.3x11x2.5mm,(10) CAP,AXIAL 2200uF,25V, ! 20%,85C,16x26mm MOTOR,DC,1.5-9V,8500RPM,0.17A, 7G-CM,0.61W,SHFT 01.5X11mm BAT,ER14505,LITHIUM,AA,3.6V, 2400mah,3.6V LITHIUM BATTERY C CAP,AXIAL,3300uF,50V, ! 20%,85C,22x43mm CAP,AXIAL 2200UF,50V 18mm X 33mm CAP,RADIAL,100uF,35V ! 20%,85C,6.3x11x2.5mm,(10) CAP,RADIAL,47uF,35V, ! 20%,85C,5x11x2mm,(10) CAP,AXIAL 330UF,35V 10mm X 17mm CAP,RADIAL 2200uF,35V ! 20%,85C,16x25x7.5mm SOCKET,PLCC,68PIN,SMD PWR SPLY,TBL,12VDC/2000mA,F2 SPECIAL-2.5mm,UNREG LIN,TABLE JACK,DC PWR,FEMALE,3.5mm, SE TERM,PANEL MT,10.5x9.0x20.0 CAP,RADIAL,330UF,35V ! 20%,85C,8x12x3.5mm TEST LEADS,ONE BLACK,ONE RED CONN,CENTRONIC,MALE,36 POS TRANS,WALL,12VAC/500mA,F, 2.1mmx5.5mm,UL/CSA 80/CS BAT,ER26500,LITHIUM,C,3.6V, 6000mah,3.6V LITHIUM BATTERY C BAT,LITHIUM,C,3.6V/6000MAH W/ LEADS BAT,LITHIUM,1/2AA,3.6V/900MAH, W/ AXIAL LEADS BAT,LITHIUM,2/3AA,3.6V/1450MAH W/ AXIAL LEADS CAP,AXIAL 100uF,16V, ! 20%,85C,6x12.5mm CAP,AXIAL 4700UF,35V 18 X 40mm AP,RADIAL,10UF,16V 6mm x 11mm INCREMENTS of 10 CAP,AXIAL 100uF,25V, ! 20%,85C,8x15mm CAP,AXIAL 4700UF,16V 16mm X 41.5mm KNOB,1/4"SHFT,SKIRTED W/MARKER SWITCH,TOG,MINI,SPDT,ON-ON, RA PCB,125V/6A,1/4"MTNG. CABINET,COMPONENT,20 DRAWER 20-CLEAR DRAWERS,20 DIVIDERS prototype BUILDER,1.6"x2.7" PLUG,DC,PWR,FEM,2.5x5.5x9.5MM 5.0x13MM STRAIN RELIEF,BLACK TRANS,WALL,9VDC/500mA,F2 2.1mm X 5.5mm,UL/CSA,BEIGE prototype BUILDER,1.5"x3.5" TEST CLIP,MICRO,BLUE(1)1.5"L SWITCH,PB,TACT,SPST,OFF-(ON) 12VDC/50mA,ACTUATOR HT.05" TRANS,WALL,12VDC/400MA,F2 2.1mmX5.5mm,RT. ANGLE MOTOR,DC,1.5-4.5V,6850RPM,0.6A 13.9G-CM,0.9W,SHFT 02X8mm TRANS,TBL,24VDC/1200mA,F2 2.1mm X 5.5mm MOTOR,DC,1.5-3V,3700RPM,0.7A 10.5G-CM,0.4W,SHFT 02X8mm PLUG,DC,PWR,FEM,1.3x3.45X9.5MM 4.1x12MM STRAIN RELIEF,BLACK CABLE,SRL,M-F,6' DB9M-DB9F,RIBBON CABLE,GRAY CONN,DSUB,50P-M,SOLDER CUP, 22AWG FUSEHOLDER,IN-LINE,18AWGx6/6"L 1.25"X.25"FUSE,BAG IN 1 ONLY CABLE,EXT,F-F,25 LINES,6' DB25F TO DB25F BAT SNAP,10",26AWG,6 PRONG BAT,ER14250,LITHIUM,1/2AA,3.6V 900mah,3.6V LITHIUM BATTERY C MOTOR,DC,6-12V,5560RPM,0.1A 10.3G-CM,0.6W,SHFT 02X8mm USE,STD FU633 1 1/4x1/4 16A (10) PLUG,BANANA,1/4"SET SCREW, ONE BLACK,ONE RED, 1 PAIR PWR SPLY,TBL,12VDC/2000mA,M2 3.5mm NO UL LED,WHITE,WTR CLR,T1-3/4, 4.5Vf,5000mcd AP,AXIAL 47UF,35V 6.3mm x 16mm INCREMENTS of 10 PWR SPLY,TBL TOP,16VAC/4000mA 2.1mm X 5.5mm,6'/6',FEMALE PLG AP,AXIAL 6.8UF,50V MOD NET CBL,UTP,CAT5E,350MHZ, 15',BLUE,8P8C,4PR/24AWG CAP,SNAP,4700uf,50V,20% LARGECAN ALUMINUM ELECTROLYTIC CAP,RADIAL 470UF,100V 16mm x 25mm CAP,RADIAL 4700UF,35V 18mm x 35mm CAP,RADIAL,6800UF,25V 18mm x 35mm CAP,RADIAL,10UF,16V ! 20%,85C,5x11x2mm,(10) AP,RADIAL 10UF,100V 6mm x 11mm INCREMENTS of 10 MOD NET CBL,UTP,CAT5E,350MHZ, 15',RED,8P8C,4PR/24AWG CABLE ASSEMBLY,EBC-510,100' BNC-TO-BNC,75 OHM,RG-59U,BLACK CAP,150UF,63V,ELECT,RADIAL,105 10.2Dx20.8Lx4.6LS,ELECTOLYTIC USE,AGC FAST ACTING,10A 250V,.25"x1.25" (10) CAP,AXIAL 6800UF,16V 18mm X 41mm ALLIGATOR CLIP TEST LEADS 24AWG WIRE(19/36)SOLD 10/PK TEST LEADS,RED BLACK UNIVERSAL KIT CONN,CARD EDGE,22/44 CONTACTS, SOLDER EYELET HEADER REC,20 CONT,SINGLE ROW, VERTICAL MOUNT ADAPTER,PS/2 K/B-AT,PLASTIC, 2.125",6P MINI DIN F-5P DIN M CAP,AXIAL 4700uF,16V, ! 20%,85C,16x26.5mm CONN,RF,BNC,BULKHEAD SWITCH,ROT,1-LYR,3P4P,SOLDER, 3/8"MTNG,.3A@30VDC,MAKE/BREAK CAP,AXIAL 22UF,25V, ! 20%,85C,6x12.5mm, CAP,AXIAL 3300uF,35V, ! 20%,85C,18x37mm CAP,RADIAL,3300UF,16V ! 20%,85C,13x21x5mm CAP,RADIAL,4700uF,16V 20%,85C,16x25x7.5mm HOOD,D-SUB PLASTIC,15PIN 1000/CS SWITCH,TOG,SPDT,ON-ON SOLDER,125V/6A,1/4"MTNG. SWITCH,PB,SUB,SPST,OFF-(ON) RA PCB,120V/1.5A,7/32"MTNG. SWITCH,ROT,1-LYR,2P6P,SOLDER, 3/8"MTNG,.3A@30VDC,MAKE/BREAK SWITCH,ROT,1-LYR,4P3P,SOLDR, 3/8"MTNG,.3A@30VDC,MAKE/BREAK SWITCH,ROT,1-LYR,1P12P,SOLDER, 3/8"MTNG,.3A@30VDC,MAKE/BREAK FUSE,MDL SLOW BLOW,3A,250V, .25"x1.25" MIC CART,1.5-12VDC,2PIN LEADS SEN:-54db,20HZ TO 12KHZ,RoHS 规格液晶模块 CAP,RADIAL 3300uF,35V ! 20%,85C,16x30x7.5mm 规格液晶模块 CAP,RADIAL 1000uF,100V ! 20%,85C,18x41x7.5mm(10) 规格液晶模块 CAP,AXIAL 470uF,16V ! 20%,85C,8x17mm 规格液晶模块 SPECIFICATIONS FOR LCD MODULE 规格液晶模块 CAP,AXIAL 220uF,25V ! 20%,85C,8x16mm 规格液晶模块 CAP,RADIAL 22uF,100V ! 20%,85C,8x11.5x3.5mm, 规格液晶模块 CAP,MEMORY BACK-UP,.22F,5.5V, 规格液晶模块 CAP,SNAP,10000uf,50V,20%,105c LARGE CAN ALUMINUM ELECTRONIC 规格液晶模块 CAP,AXIAL 470uf,35V, ! 20%,85C,10x21mm 规格液晶模块 HOOD,D-SUB PLASTIC,9PIN 规格液晶模块 TEST LEADS,BANANA CONNECTOR BLACK DOUBLE BANANA 规格液晶模块 BAT,LITHIUM,AA,3.6V/2100MAH W/ SOLDER TABS 规格液晶模块 SWITCH,DIP,BUSSED TRI-STATE 8-WAY SWITCH,24VDC,25mA 规格液晶模块 CABLE ASSEMBLY,RG174/U,3', BNC TO BNC,50 OHM 规格液晶模块 CONN,.1",1RW,20PIN HOUSING, USE W/100765 (10) 规格液晶模块 PLUG,BNC-M TO BANANA-M 规格液晶模块 TEST LEADS,DOUBLE BANANA PLG TO ALLIGATOR CLIPS,3' 规格液晶模块 BAT HOLDER,CLIP 9VDC 规格液晶模块 CONNECTOR,HOUSING,FEMALE,DA15, USE WITH MALE PIN P/N#43369 规格液晶模块 TRANS,TBL,12VDC/1000mA, PIG TAIL SOCKET,PLCC,84PIN,SOLDERTAIL THRU-HOLE HOOD,D-SUB PLASTIC,50PIN FUSE,AGC FAST ACTING,5A,250V .25"x1.25" (10) AC RECEPTACLE,MALE,15A@250V FAST-ON Term(.25")UL/CSA/VDE CABLE,EXT,F-F,25 LINES,6' DB25F TO DB25F BIND POST DUAL BANANA RED&BLK POST CONN,D-SUB,50P-F, 22AWG,SOLDER CUP CONN,DSUB,37P-F,SOLDER CUP, 22AWG AP,AXIAL 33UF,16V 6mm x 13mm INCREMENTS of 10
File Size	259.49K / 23 Page	View it Online	Download Datasheet

					Aeroflex Circuit Technology
Part No.	5962D9960601QUA 5962D9960601QUC 5962D9960601QUX 5962D9960601TUA 5962D9960601TUC 5962D9960601TUX 5962D9960602QUA 5962D9960602QUC 5962D9960602QUX 5962D9960602TUA 5962D9960602TUX 5962D9960602TUC 5962-9960601TUA 5962-9960602TUX 5962-9960601TUC 5962P9960601TUA 5962P9960601TUC 5962P9960601TUX UT7Q512K-UPX UT7Q512K-UWC
Description	512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish gold. Total dose 1E4(10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Mil temp. Lead finish factory option. Total dose 1E4(10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. Total dose 1E4(10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish factory option. Total dose 1E4(10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Extended industrial temp. Lead finish hot solder dipped. Total dose 1E4 (10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Extended industrial temp. Lead finish gold. Total dose 1E4 (10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class Q. Extended industrial temp. Lead finish factory option. Total dose 1E4 (10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish hot solder dipped. Total dose 1E4 (10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish factory option. Total dose 1E4 (10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish gold. Total dose 1E4 (10krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. Total dose none. 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Extended industrial temp. Lead finish factory option. Total dose none. 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. Total dose none. 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish gold. Total dose 3E4(30krad(Si)). 512K x 8 SRAM: SMD. 100ns access time, 5V operation. QML class T. Mil temp. Lead finish factory option. Total dose 3E4(30krad(Si)). 512K x 8 SRAM. 100ns access time, 5V operation. prototype flow. Lead finish factory option. 512K x 8 SRAM. 100ns access time, 5V operation. Extended industrial temp rang flow. Lead finish gold.
File Size	106.53K / 16 Page	View it Online	Download Datasheet

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Price and Availability

Price & Availability of prototype

Newark

Part #	Manufacturer	Description	Price	BuyNow Qty.
PROTOTYPE 10PCS 84AC0572	Embest Info&Tech Co Ltd	Prototypes 10Pcs \|Embest PROTOTYPE 10PCS		0
PROTOTYPE 15 PIECES 29AH0849	Embest Info&Tech Co Ltd	Prototype 15 Pieces \|Embest PROTOTYPE 15 PIECES		0
NRE & PROTOTYPE FEE 65AC5291	Embest Info&Tech Co Ltd	Prototype 10Pcs Fee \|Embest NRE & PROTOTYPE FEE		0
NRE & PROTOTYPE FEE SMT 74AH3323	Embest Info&Tech Co Ltd	Prototype 10Pcs Fee \|Embest NRE & PROTOTYPE FEE SMT		0

Avnet Americas

Part #	Manufacturer	Description	Price	BuyNow Qty.
ETC PROTOTYPES ETC PROTOTYPES	ADLINK Technology Inc	- Virtual or Non-Physical Inventory (Software & Literature) (Alt: ETC PROTOTYPES)		0

Part #	Manufacturer	Description	Price	BuyNow Qty.
PROTOTYPE 73822767	SMC Corporation of America	PROTOTYPE P/N, S070 SERIES \| SMC Corporation PROTOTYPE	1: USD64.29	0
3M5557-5MM-DISC-100/PROTOTYPE 74907685	TapeCase	White Water Contact Indicator Tape 5mm Discs - 100 per roll, 3M 5557 \| TapeCase 3M5557-5MM-DISC-100/PROTOTYPE	24: USD16.54	0

TTI

Part #	Manufacturer	Description	Price	BuyNow Qty.
0638112400 63811-2400	Molex	Crimpers / Crimping Tools CRIMP TOOL	1: USD529.98 5: USD512.32 10: USD494.67	8
0638113800 63811-3800	Molex	Crimpers / Crimping Tools Hand Crimp Tool Mini-Fit Sr 14-16AWG	1: USD447.26 2: USD438.49 3: USD429.89 5: USD421.46	1
HOUSING-TOOLING 0164578 PROTOTYPE	Phoenix Contact	PROTOTYPE MOLD	1: USD17007.87	0
1004069400 100406-9400	Molex	G3 POWER CABLE - PROTOTYPE		0
PE427447 PE427447	Aptiv PLC	SRS PIGTAIL PROTOTYPE		0

Sager

Part #	Manufacturer	Description	Price	BuyNow Qty.
PROTOTYPE MOTOR 000000000002289895	Merkle-Korff Industries	Merkle-Korff		0
MOTOR PROTOTYPE 000000000001636010	Merkle-Korff Industries	Merkle-Korff		0

Perfect Parts Corporation

Part #	Manufacturer	Description	Price	BuyNow Qty.
UNO R3 PROTOTYPE BOARD	MFG UPON REQUEST			40
RF PROTOTYPE KIT- SMALL	MFG UPON REQUEST			1

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