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  micro-packaged Datasheet PDF File

For micro-packaged Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    S3C2510A S3C2510

Samsung Electronics Inc
Samsung semiconductor
Part No. S3C2510A S3C2510
Description IC,MICROPROCESSOR,32-BIT,CMOS,BGA,416PIN,PLASTIC
16/32-bit RISC micro-controller is a cost-effective, high-performance micro-controller solution for Ethernet-based systems, for example

File Size 408.95K  /  46 Page

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    TGA4509-SM-15

TriQuint Semiconductor
Part No. TGA4509-SM-15
Description Ka-Band Packaged 1W PA

File Size 311.99K  /  11 Page

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    TGA4509-SM

TriQuint Semiconductor
Part No. TGA4509-SM
Description Ka-Band Packaged 1W PA

File Size 117.15K  /  9 Page

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    XF1001-SC

Mimix Broadband
Part No. XF1001-SC
Description 1.0W Packaged HFET

File Size 658.66K  /  7 Page

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    Skyworks Solutions
Part No. APD0520-210 APD0805-219 APD0810-203 APD0505-210 APD0510-203 APD0805-203 APD2220-203 APD0520-219 APD0805-210
Description Silicon PIN Diodes, Hermetic Ceramic Packaged and Bondable for Switching Applications
Silicon PIN Diodes, Hermetic Ceramic Packaged and Bondable for Attenuator Applications

File Size 194.57K  /  8 Page

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    TGA2903-EPU-SG

TriQuint Semiconductor
Part No. TGA2903-EPU-SG
Description Packaged Ku band HPA

File Size 152.10K  /  9 Page

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    Integrated Device Techn...
Part No. ICS650-41
Description Packaged in 16-pin TSSOP

File Size 162.24K  /  11 Page

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    Bourns, Inc.
Part No. HFX6015-548
Description PACKAGED LAMP 包装的灯

File Size 197.69K  /  3 Page

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    Temex Components
Part No. QEN101
Description Ceramic SMID Packaged

File Size 70.64K  /  1 Page

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    N111201

E-SWITCH
Part No. N111201
Description Packaged : In Dispensing Tube

File Size 31.74K  /  1 Page

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