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For leadless Found Datasheets File :: 6606 Search Time::1.093ms
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				NXP Semiconductors
Part No.	BB179BLX
OCR Text	... diode in a sod882t ultra small leadless plastic smd package. the excellent matching performance is achieved by gliding matching and a direct matching assembly (dma) procedure. 1.2 features n excellent linearity n excellent matching to 2 % ...
Description	UHF variable capacitance diode
File Size	43.00K / 7 Page	View it Online	Download Datasheet

				United Monolithic Semic... UMS[United Monolithic Semiconductors] United Monolithic Semiconductors GmbH
Part No.	CHA5390TBF_24 CHA5390TBF CHA5390TBF/24
OCR Text	leadless package Description The monolithic microwave IC (MMIC) in the package is a high gain broadband fourstage monolithic medium power amplifier. It is designed for a wide range of applications, from military to commercial communication...
Description	24-30GHz Medium Power Amplifier 24 - 30GHz的中等功率放大器
File Size	167.02K / 6 Page	View it Online	Download Datasheet

				United Monolithic Semiconductors GmbH UMS[United Monolithic Semiconductors]
Part No.	CHA5093TCF_24 CHA5093TCF CHA5093TCF/24
OCR Text	leadless package Description The packaged monolithic microwave IC (MMIC) is a high gain three-stage monolithic high power amplifier. It is designed for a wide range of applications, from military to commercial communication systems. The ci...
Description	24-26GHz High Power Amplifier 24 - 26GHz高功率放大器
File Size	151.10K / 6 Page	View it Online	Download Datasheet

				United Monolithic Semicondu... UMS[United Monolithic Semiconductors] United Monolithic Semiconductors GmbH
Part No.	CHA2069RAF_24 CHA2069RAF CHA2069RAF/24
OCR Text	leadless package Description The monolithic microwave IC (MMIC) in the package is a three-stage self biased wide band monolithic low noise amplifier. The MMIC is manufactured with a standard PM-HEMT process: 0.25m gate length, via holes th...
Description	Circular Connector; No. of Contacts:100; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:23; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:23-35 RoHS Compliant: No 18-31GHz Low Noise Amplifier 18 - 31GHz之间低噪声放大器
File Size	169.36K / 7 Page	View it Online	Download Datasheet

				United Monolithic Semicondu... UMS[United Monolithic Semiconductors]
Part No.	CHA2066RBF_24 CHA2066RBF CHA2066RBF/24
OCR Text	leadless package Description The monolithic microwave IC (MMIC) in the package is a two-stage self biased wide band monolithic low noise amplifier. The MMIC is manufactured with a standard PM-HEMT process: 0.25m gate length, via holes thro...
Description	10-16GHz Self biased Low Noise Amplifier
File Size	179.82K / 8 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	MF3ICD21 MF3ICD41 MF3ICD81 MF3ICD2101DUD_04 MF3ICD4101DUD_04 MF3MOD2101DA4_04 MF3MOD4101DA4_04 MF3MOD8101DA4_04 MF3ICD8101DUD_04 MF3MOD8101DA4/04 MF3ICD2101DUD/04 MF3MOD4101DA4/04 MF3MOD2101DA4/04 MF3ICD4101DUD/04 MF3ICD8101DUD/04
OCR Text	...MC[1] PLLMC[1] PLLMC[1] plastic leadless module carrier package; 35 mm wide tape; see Ref. 5, 8K EEPROM plastic leadless module carrier package; 35 mm wide tape; see Ref. 5, 4K EEPROM plastic leadless module carrier package; 35 mm wide tape...
Description	MIFARE DESFire EV1 contactless multi-application IC
File Size	60.41K / 15 Page	View it Online	Download Datasheet

				BITECH[Bi technologies]
Part No.	BCN31ABL503G7 BCN31 BCN31ABL102G7 BCN31ABL103G7 BCN31ABL104G7 BCN31ABL253G7
OCR Text	leadless Chip Packages FEATURES * 8 bit ladder network in a 10 terminal leadless chip package * Convex termination with square edges and corners * Topside marking for easy identification * Solder plated termination with nickel barrier 4...
Description	R/2R Ladder Network 8 Bit, 2512 Size Thick Film leadless Chip Packages
File Size	63.66K / 4 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	BC857M BC857AM BC857BM BC857CM
OCR Text	...purpose transistors FEATURES * leadless ultra small plastic package (1 mm x 0.6 mm x 0.5 mm) * Board space 1.3 x 0.9 mm * Power dissipation comparable to SOT23. APPLICATIONS * General purpose small signal DC * Low and medium frequency AC a...
Description	BC857M series; PNP general purpose transistors
File Size	75.20K / 10 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors]
Part No.	BC847M BC847AM BC847BM BC847CM
OCR Text	...purpose transistors FEATURES * leadless ultra small plastic package (1 mm x 0.6 mm x 0.5 mm) * Board space 1.3 x 0.9 mm * Power dissipation comparable to SOT23. APPLICATIONS * General purpose small signal DC * Low and medium frequency AC a...
Description	NPN general purpose transistors
File Size	70.93K / 10 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	PDTA115EMB
OCR Text	leadless ultra small dfn1006b-3 (sot883b) surface-mounted device (smd) plastic package. npn complement: pdtc115emb. 1.2 features and benefits ? 20 ma output cu rrent capability ? reduces component count ? built-in bias resistors ? reduces...
Description	PNP resistor-equipped transistor; R1 = 100 kΩ, R2 = 100 kΩ
File Size	703.69K / 11 Page	View it Online	Download Datasheet

For leadless Found Datasheets File :: 6606 Search Time::1.093ms
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