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    RMPA0965

Fairchild Semiconductor
Part No. RMPA0965
OCR Text ... rapid cooling promotes a finer grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable...
Description CDMA and CDMA2000-1X Power Amplifier Module
File Size 531.97K  /  8 Page

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    RMPA0967

Fairchild Semiconductor
Part No. RMPA0967
OCR Text ... rapid cooling promotes a finer grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable...
Description CDMA and CDMA2000-1X Power Amplifier Module
File Size 528.56K  /  8 Page

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    RMPA1963

Fairchild Semiconductor
Part No. RMPA1963
OCR Text ... rapid cooling promotes a finer grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. * Solder Joint Characteristics: Proper operation of this device depends on a reliab...
Description US-PCS CDMA and CDMA2000-1X Power Amplifier Module
File Size 529.20K  /  7 Page

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    RMPA1965

Fairchild Semiconductor
Part No. RMPA1965
OCR Text ... rapid cooling promotes a finer grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable...
Description PCS 3.4V CDMA and CDMA2000-1X Power Amplifier Module
File Size 508.77K  /  8 Page

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    RMPA1967

Fairchild Semiconductor
Part No. RMPA1967
OCR Text ... rapid cooling promotes a finer grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable...
Description CDMA and CDMA2000-1X Power Amplifier Module
File Size 514.48K  /  8 Page

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    FAIRCHILD[Fairchild Semiconductor]
Part No. RMPA2266
OCR Text ... rapid cooling promotes a finer grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable...
Description WCDMA Band I Power Amplifier Module
File Size 189.22K  /  7 Page

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    RMPA096706

Fairchild Semiconductor
Part No. RMPA096706
OCR Text ... rapid cooling promotes a finer grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable...
Description Cellular CDMA, CDMA2000-1X and WCDMA Power Edg TM Power Amplifier Module
File Size 543.43K  /  8 Page

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    RMPA0966

Fairchild Semiconductor
Part No. RMPA0966
OCR Text ... rapid cooling promotes a finer grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable...
Description Cellular CDMA, CDMA2000-1X and WCDMA Power Amplifier Module
File Size 487.07K  /  7 Page

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    RMPA096607 RMPA0966

FAIRCHILD[Fairchild Semiconductor]
Part No. RMPA096607 RMPA0966
OCR Text ... rapid cooling promotes a finer grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable...
Description WCDMA Band V Power Amplifier Module
File Size 180.07K  /  7 Page

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    RMPA0963

Fairchild Semiconductor
Part No. RMPA0963
OCR Text ... rapid cooling promotes a finer grain structure and a more crack-resistant solder joint. the illustration below indicates the recommended soldering profile.  solder joint characteristics: proper operation of this device depends on a reliab...
Description Cellular CDMA CDMA2000-1X and WCDMA Power Amplifier Module
File Size 145.31K  /  7 Page

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