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  alumina Datasheet PDF File

For alumina Found Datasheets File :: 5337    Search Time::3.297ms    
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    VR61F1

Shindengen Electric Mfg...
SHINDENGEN[Shindengen Electric Mfg.Co.Ltd]
Part No. VR61F1
OCR Text ...-load, Commercial frequency, On alumina substrate Ta = 25, Sine wave, R-load, Commercial frequency, On glass-epoxy substrate 50Hz, Sine wave, Non-repetitive 10/200s, Non-repetitive 10/1000s, Non-repetitive Ratings -55150 150 0.37 0.28 7....
Description Varistor

File Size 280.17K  /  6 Page

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    VRYA15

Shindengen Electric Mfg.Co....
SHINDENGEN[Shindengen Electric Mfg.Co.Ltd]
Part No. VRYA15
OCR Text ...-load, Commercial frequency, On alumina substrate, 1 element operation Ta = 40, Sine wave, R-load, Commercial frequency, On alumina substrate, 2 elements operation Ta = 40, Sine wave, R-load, Commercial frequency, On glass-epoxy substrate, ...
Description Varistor

File Size 318.24K  /  7 Page

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    VRYA6

Shindengen Electric Mfg.Co....
SHINDENGEN[Shindengen Electric Mfg.Co.Ltd]
Shindengen Electric Manufacturing Company, Ltd.
Part No. VRYA6
OCR Text ...-load, Commercial frequency, On alumina substrate, 1 element operation Ta = 40, Sine wave, R-load, Commercial frequency, On alumina substrate, 2 elements operation Ta = 40, Sine wave, R-load, Commercial frequency, On glass-epoxy substrate, ...
Description Varistor

File Size 319.17K  /  7 Page

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    MMBTH81LT1

MOTOROLA[Motorola, Inc]
Part No. MMBTH81LT1
OCR Text ...mbient Total Device Dissipation alumina Substrate,(2) TA = 25C Derate above 25C Thermal Resistance, Junction to Ambient Junction and Storage Temperature Symbol PD Max 225 1.8 RJA PD 556 300 2.4 RJA TJ, Tstg Symbol Min 417 - 55 to +150 Unit ...
Description UHF/VHF Transistor

File Size 74.00K  /  4 Page

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    SBAV70LT1G

ON Semiconductor
Part No. SBAV70LT1G
OCR Text ...6 c/w total device dissipation alumina substrate, (note 2) t a = 25 c derate above 25 c p d 300 2.4 mw mw/ c thermal resistance, junction?to?ambient r ja 417 c/w junction and storage temperature t j , t stg ?55 to +150 c stresses ...
Description Dual Switching Diode Common Cathode

File Size 81.45K  /  4 Page

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    Micross Components
Part No. HMC292
OCR Text ... on 0.127mm (5 mil) thick alumina thin flm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin flm substrates must be used, the die should be raised 0.150mm (6 mils...
Description GaAs MMIC DOUBLE-BALANCED

File Size 985.86K  /  9 Page

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    Hittite Microwave Corpo...
Part No. HMC292-09
OCR Text ... lines on 0.127mm (5 mil) thick alumina thin fi lm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin fi lm substrates must be used, the die should be raised 0.150mm (6 mi...
Description GaAs MMIC DOUBLE-BALANCED MIXER, 18 - 32 GHz

File Size 209.85K  /  6 Page

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    HMC1105

Analog Devices
Part No. HMC1105
OCR Text ... on 0.127mm (5 mil) thick alumina thin flm substrates are recommended for bringing rf to and from the chip (figure 1). one way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) t...
Description Microwave Test Equipment

File Size 292.85K  /  6 Page

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    WILLAS ELECTRONIC CORP
Part No. 8050PLT1 8050QLT1
OCR Text .../w total device dissipation p d alumina substrate,(2) ta=25c 300 mw derate above 25c 2.4 mw/c thermal resistance,junction to ambient r ja 417 c/w junction and storage temperature t j, t s t g -55 to +150 c 1. frC5 = 1.0 x 0.75 x 0.062 in. ...
Description NPN General Purpose Transistor

File Size 849.15K  /  7 Page

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    MTLP300PWS MTLP300FWS

Vishay Siliconix
Part No. MTLP300PWS MTLP300FWS
OCR Text ...? wire bondable terminations ? alumina (99.6 %) substrate; as-fired or polished applications ? test and measurement setups ? network analyzer calibration elements ? rf bread boarding ? high frequency hybrid assemblies custom designed eleme...
Description Wire Bondable Thin Film Micro-Strip Transmission

File Size 70.72K  /  3 Page

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For alumina Found Datasheets File :: 5337    Search Time::3.297ms    
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