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Molex Electronics Ltd.
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| Part No. |
0877600838 87760-0838
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 8 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Mating Pin Length: 3.06mm (.120), Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Right Angle, Through Hole, 8 Circuits, 2.54楼矛m (100楼矛) Tin (Sn) Plating, Mating Pin Length: 3.06mm (.120), Tray, Lead-f
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| File Size |
155.18K /
4 Page |
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it Online |
Download Datasheet
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SiTime |
| Part No. |
SIT8008BC-73-33E-69.877600
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| Description |
1 to 110 MHz, Low Power Oscillator
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87760-1816 0877601816
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| Description |
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
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| File Size |
160.35K /
4 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54201-G0817LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 17 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877601618 87760-1618
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 16 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 16 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tray, Lead-free
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| File Size |
160.06K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54102-T0817LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 34 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0877601617 87760-1617
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free
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| File Size |
160.17K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54122-111081700LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-109081700LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54202-S0817LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 34 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
57102-G08-17ULF
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| Description |
Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 34 Positions - 2mm (0.079inch) - Vertical
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
108-1711-200
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| Description |
Paladin® 112Gb/s Backplane Connector, 7-Pair, Guide Module, No Key.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54201-S08-17
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 17 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
57102-G08-17LF
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| Description |
Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 34 Positions - 2mm (0.079inch) - Vertical
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Official Product Page
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Price and Availability
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