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0805L 2010B 23151 MF0MOU21 1030A 74HC109 MAX109 MGCT02
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  586-1303-101F Datasheet PDF File

For 586-1303-101F Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    2SA1303

Inchange Semiconductor Company Limited
Part No. 2SA1303
Description Silicon PNP Power Transistor

File Size 82.66K  /  2 Page

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Coilcraft Inc

Part No. 13031CL
Description Power choke, toroid, RoHS
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    2SK1303

Hitachi Semiconductor
Part No. 2SK1303
Description Silicon N Channel MOS FET

File Size 51.06K  /  9 Page

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Amphenol Communications Solutions

Part No. 130-3162-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs    

Official Product Page

    Panasonic Corporation
PANASONIC[Panasonic Semiconductor]
Part No. CNB1303
Description Reflective Photosensor

File Size 47.81K  /  2 Page

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Amphenol Communications Solutions

Part No. 130-3162-15H
Description Paladin Plus 3-Pair, 6 Column, Right Angle Receptacle, Signal Module, APP
Tech specs    

Official Product Page

    MAX1303

Maxim Integrated Products
Part No. MAX1303
Description The MAX1302/MAX1303 multirange, low-power, 16-bit, successive-approximation, analog-to-digital conve

File Size 755.55K  /  31 Page

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Amphenol Communications Solutions

Part No. 130-3182-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, APP.
Tech specs    

Official Product Page

    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. BA01303
Description Triple Band(EGSM900/DCS1800/PCS1900) InGaP HBT Front-end module

File Size 84.26K  /  3 Page

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Amphenol Communications Solutions

Part No. 130-3142-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP.
Tech specs    

Official Product Page

    71308-4230N 015-91-1303

Molex Electronics Ltd.
Part No. 71308-4230N 015-91-1303
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs

File Size 1,475.63K  /  8 Page

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Amphenol Communications Solutions

Part No. 130-3182-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs    

Official Product Page

    2SK1303

HITACHI[Hitachi Semiconductor]
Part No. 2SK1303
Description Silicon N-Channel MOS FET

File Size 49.48K  /  9 Page

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Amphenol Communications Solutions

Part No. 130-3142-15D
Description Paladin Plus 3-Pair, 4 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs    

Official Product Page

    American Electronic Com...
Part No. TMR1303
Description    TMR Omnipolar Switch

File Size 401.70K  /  6 Page

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Amphenol Communications Solutions

Part No. 130-3182-15H
Description Paladin Plus 3-Pair, 8 Column, Right Angle Receptacle, Signal Module, APP
Tech specs    

Official Product Page

    T113030

E-SWITCH
Part No. T113030
Description All Dimension In MM

File Size 61.04K  /  1 Page

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Amphenol Communications Solutions

Part No. 130-3162-15D
Description Paladin Plus 3-Pair, 6 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs    

Official Product Page

    KTD1303

KEC[KEC(Korea Electronics)]
Part No. KTD1303
Description EPITAXIAL PLANAR NPN TRANSISTOR (AUDIO MUTING)

File Size 202.36K  /  2 Page

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Amphenol Communications Solutions

Part No. 130-3142-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs    

Official Product Page

For 586-1303-101F Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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