K66X-A26S-N30 pdf Datasheet P7 Part Num --- IC-ON-LINE


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K66X-A26S-N30 Datasheet PDF File

For K66X-A26S-N30 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

					Semicoa Semiconductor
Part No.	2N3010
Description	NPN High Current General Purpose Medium Speed Amplifiers
File Size	278.49K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L177HRA26SVF
Description	Dsub, Straight, High Density, Crimp & Poke, Bright Tin Shell, 26 Socket, 4-40 Fixed Front Screwlock
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Seme LAB
Part No.	2N3036
Description	Bipolar NPN Device in a Hermetically sealed TO39
File Size	10.33K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L77HDA26SOL2
Description	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, Flash Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs				Official Product Page

					BRIGHT LED ELECTRONICS CORP
Part No.	BQ-N30DRD
Description	0.33(8.40MM) FOUR DIGIT LED DISPLAY
File Size	138.48K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L77HDA26SD1CH4R
Description	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 26 Socket, Flash Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
Tech specs				Official Product Page

					Panasonic Semiconductor
Part No.	MN3006
Description	128-STAGE ECONOMY TYPE BBD
File Size	172.57K / 5 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L77HDA26SD1CH3FC309
Description	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 26 Socket, 0.76m (30 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
Tech specs				Official Product Page

					Seme LAB
Part No.	2N3020
Description	Bipolar NPN Device in a Hermetically sealed TO39
File Size	10.31K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L177HDA26SD1CO4F
Description	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350\\), 26 Socket, 0.38um (15u\\) Gold, 4-40 Front Screwlock, Without Boardlock
Tech specs				Official Product Page

					Chinfa Electronics Ind
Part No.	DRAN30
Description	AC - DC DIN RAIL MOUNTABLE POWER SUPPLY INDUSTRIAL CONTROL EQUIPMENT
File Size	581.03K / 8 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L177HDA26SVF
Description	Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock
Tech specs				Official Product Page

					American Microsemiconductor Inc.
Part No.	1N3082
Description	1N3082
File Size	1,002.09K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L177HDA26SOL2
Description	Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs				Official Product Page

					API Technologies Corp
Part No.	TN3078
Description	RF AMPLIFIER MODEL
File Size	46.00K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L77HDA26SD1CH4F
Description	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 26 Socket, Flash Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock
Tech specs				Official Product Page

					API Technologies Corp
Part No.	TN3074
Description	RF AMPLIFIER MODEL
File Size	38.39K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L177HDA26SD1CO3F
Description	Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350\\), 26 Socket, 0.38um (15u\\) Gold, M3 Front Screwlock, Without Boardlock
Tech specs				Official Product Page

					API Technologies Corp
Part No.	TN3075
Description	RF AMPLIFIER MODEL
File Size	71.76K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	L77HDA26S
Description	Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, Flash Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs				Official Product Page

For K66X-A26S-N30 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

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