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joints Datasheet PDF File

For joints Found Datasheets File :: 1460 Search Time::1.687ms
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				ON Semiconductor
Part No.	NBSG16BAR2
OCR Text	... voiding and allows the solder joints for the smaller terminal pads to be at the same height as the larger ones. package placement onto the pcb pick and place equipment with the standard tolerance of 0.05 mm or better is recommended. th...
Description	2.5 V/3.3 V SiGe Differential Receiver/Driver with RSECL Outputs
File Size	41.41K / 4 Page	View it Online	Download Datasheet

				Omron Electronics LLC
Part No.	XS2F-D421-DC0-A
OCR Text	...s2p panel-mounting sockets 4. t-joints and y-joints used for branching and for daisy-chain connections. xs2r t-joint/y-joint plug/socket connectors t-joints y-joints 5. sensor connector assemblies used to enable using connec- tors in sens...
Description	Round Water-resistant Connectors (M12)
File Size	3,493.09K / 26 Page	View it Online	Download Datasheet

				ON SEMICONDUCTOR
Part No.	M1MA151/2AT1
OCR Text	..., the circuit boards and solder joints tend to heat first. the components on the board are then heated by con- duction. the circuit board, because it has a large surface area, absorbs the thermal energy more ef ficiently, then dis- tribu...
Description	0.1 A, 40 V, SILICON, SIGNAL DIODE
File Size	57.34K / 4 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors]
Part No.	PCF8566 PCF8566P PCF8566T
OCR Text	...g or by wave Repairing soldered joints SO and VSO Reflow soldering Wave soldering Repairing soldered joints DEFINITIONS LIFE SUPPORT APPLICATIONS PURCHASE OF PHILIPS I2C COMPONENTS 1998 May 04 2 Philips Semiconductors Product sp...
Description	Universal LCD driver for low multiplex rates
File Size	243.19K / 40 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	HSP061-4NY813
OCR Text	...t solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placemen...
Description	4-line ESD protection for high speed lines
File Size	331.37K / 9 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V.
Part No.	PCF2111CT
OCR Text	... wave 13.1.2 repairing soldered joints 13.2 plastic small outline packages 13.2.1 by wave 13.2.2 by solder paste reflow 13.2.3 repairing soldered joints (by hand-held soldering iron or pulse-heated solder tool) 14 definitions 15 life suppor...
Description	LCD drivers PCF2100CT/F1<SOT136-1 (SO28)\|<<http://www.nxp.com/packages/SOT136-1.html<1<week 23, 2005,;PCF2100CT/F1<SOT136-1 (SO28)\|<<http://www.nxp.com/packages/SOT136-1.html<1<week 23, 2005,;PCF2111CT/S410
File Size	137.49K / 24 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V.
Part No.	BT151X-800R BT151X-500R
OCR Text	... fatigue stress to the solder joints. the more extreme condition of stresses being transmitted to the die, causing it to crack, is also minimised with this package design. sot223 soldering when soldering most smt power packages, a ref...
Description	Thyristor BT151X-800R<SOT186A (SOT186A)\|<<http://www.nxp.com/packages/SOT186A.html<1<week 32, 2004,;BT151X-800R/DG<SOT186A (SOT186A)\|<<http://www.nxp.com/packages/SOT186A.html<1<,;
File Size	106.15K / 15 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	ECMF06-6AM16
OCR Text	...t solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placemen...
Description	Common mode filter with ESD protection for MIPI D-PHY and MDDI interface
File Size	263.25K / 16 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	ESDAVLC6-1BV2
OCR Text	...t solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placemen...
Description	Bidirectional device
File Size	108.35K / 9 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	MMBT2907AWT1-D
OCR Text	..., the circuit boards and solder joints tend to heat first. the components on the board are then heated by conduction. the circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes t...
Description	General Purpose Transistor PNP Silicon
File Size	48.22K / 8 Page	View it Online	Download Datasheet

For joints Found Datasheets File :: 1460 Search Time::1.687ms
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