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INTERSIL[Intersil Corporation]
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Part No. |
HI5721_03 HI5721BIB HI5721BIP HI5721-EVP HI5721-EVS
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OCR Text |
...static discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of ...SM Singlet Glitch Area, GE (Peak Glitch) Doublet Glitch Area, (Net Glitch) Output Slew Rate Output R... |
Description |
10-Bit, 125MSPS, High Speed D/A Converter
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File Size |
303.47K /
14 Page |
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IDT[Integrated Device Technology]
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Part No. |
IDT74ALVC125PY IDT74ALVC125 IDT74ALVC125DC IDT74ALVC125PG
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OCR Text |
...
DC PY PG 125
Sm all Outline IC (SO 14-1) Shrink S m all Outline Package (S O14-2) Thin Shrink Small Outline Package (SO14-3) Quadruple Bus Buffer Gate with 3-S tate Outputs, 24m A
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- 40C to +85C
CORPORATE HEADQUARTERS 2975 St... |
Description |
3.3V CMOS QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS
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File Size |
103.86K /
6 Page |
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it Online |
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SILABS[Silicon Laboratories]
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Part No. |
SI5XX-EVB
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OCR Text |
...gh frequencies. The Si55x/Si53x IC-based device is factory configurable for a wide variety of user specifications including frequency, suppl...SM,0.1UF,16V,20%,X7R,0402 CAP,SM,0.1UF,16V,20%,X7R,0603 CAP,SM,10UF,10V,10%,TANTALUM,3216 CAP,SM,100... |
Description |
EVALUATION BOARD FOR Si53X XOS AND Si55X VCXOS
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File Size |
207.91K /
8 Page |
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it Online |
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RFM[RF Monolithics, Inc]
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Part No. |
TX5002
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OCR Text |
...rounded or floating. GND2 is an IC ground pin. It should be connected to GND1 by a short, low inductance trace. No connection. Printed circuit board pad may be grounded or floating. No connection. Printed circuit board pad may be grounded o... |
Description |
418.00 MHz Hybrid Transmitter
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File Size |
42.71K /
6 Page |
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it Online |
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Price and Availability
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