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T1500 72240L5 XDMR09A ML31XX TL431D 74HC86 MB3505W 2SB1115A
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    DF100

List of Unclassifed Manufacturers
etc
Electronic Theatre Controls, Inc.
Part No. DF100
OCR Text ...too long. It is better to use a hotter iron for less time than a cool iron for longer! The 555 timer integrated circuit is not especially static sensitive but should still be inserted last. To protect the PCB pads you are strongly recommend...
Description Norfolk Amateur Radio Club DF100 direction finder project for Foxhunting
NORFOLK AMATEUR RADIO CLUB DF100 DIRECTION FINDER PROJECT FOR “FOXHUNTING”
10 A SPST / 8 A DPST POLARIZED SUBMINIATURE POWER RELAY

File Size 63.04K  /  4 Page

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    AND8199

ONSEMI[ON Semiconductor]
Part No. AND8199
OCR Text ... a small group of cells becomes hotter than the surrounding cells, they tend to conduct more current. This situation, in turn, creates more heat, which allows more current to flow. These cells can pull a large amount of current and, if not ...
Description THERMAL STABILITY OF MOSFETS

File Size 84.95K  /  4 Page

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    United Monolithic Semic...
Part No. CHR3663-QEG-11
OCR Text ...ted for a worst case where the hotter junction of the mmic is considered. (3) tcase=package back side temperature measured under the die-attach-pad (see the drawing below). 5.6 device thermal specification : chr3663-qeg 0 0,2 0,4 0,6 0,8 ...
Description 17-24GHz Integrated Down Converter

File Size 421.30K  /  18 Page

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    BCF240T

BeRex Corporation
Part No. BCF240T
OCR Text ...ould be performed with parts no hotter than 300c for less than 10 seconds. an inert forming gas (90% n 2 - 10% h 2 ) or clean, dry n 2 should be used. handling precautions : gaas fets are very sensitive to and may be damaged by ...
Description 30.4 dBm Typical Output Power

File Size 395.85K  /  6 Page

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    TS201-HARDWARE

Analog Devices
Part No. TS201-HARDWARE
OCR Text ...m `hot spots' - the redder, the hotter. In an embedded system with a memory hierarchy, where access to some memory locations is slower than access to others, this display can highlight code that executed frequently from external memory. Usi...
Description Development Tools for the ADSP-TS201S Processor

File Size 58.58K  /  1 Page

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    United Monolithic Semic...
Part No. CHA3667AQDG-15
OCR Text ...ed for a worst case where th e hotter junction of the mmic is considered. (3) tcase=package back side temperature measured un der the die-attach-pad (see the drawing below). 5.8 device thermal specification : cha3667aqdg 0 0.1 0.2 0.3 0.4...
Description 7-20GHz Medium Power Amplifier

File Size 347.20K  /  16 Page

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    BCP020T-15

BeRex Corporation
Part No. BCP020T-15
OCR Text ...ould be performed with parts no hotter than 300c for less than 10 seconds. an inert forming ga s (90% n 2 - 10% h 2 ) or clean, dry n 2 should be used. use of conductive epoxy (gold or silver filled) may also be acceptable for die - ...
Description HIGH EFFICIENCY HETEROJUNCTION POWER FET CHIP

File Size 412.48K  /  5 Page

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    BCP030T-15

BeRex Corporation
Part No. BCP030T-15
OCR Text ...ould be performed with parts no hotter than 300c for less than 10 seconds. a n inert forming gas (90% n 2 - 10% h 2 ) or clean, dry n 2 should be used. use of conductive epoxy (gold or silver filled) may also be acceptable for die - ...
Description HIGH EFFICIENCY HETEROJUNCTION POWER FET CHIP

File Size 396.38K  /  5 Page

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    BCF240T BCF240T-18

BeRex Corporation
Part No. BCF240T BCF240T-18
OCR Text ...ould be performed with parts no hotter than 300c for less than 10 seconds. an inert forming gas (90% n 2 - 10% h 2 ) or clean, dry n 2 should be used. handling precautions : gaas fets are very sensitive to and may be damaged by ...
Description HIGH EFFICIENCY HETEROJUNCTION POWER FET CHIP

File Size 432.99K  /  6 Page

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