| |
|
 |
Amphenol Communications Solutions |
| Part No. |
L177HDAG26S
|
| Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
L77HDAG26SOL2RM5C309
|
| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.76m (30 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
L177HRAG26S
|
| Description |
Dsub, Straight, High Density, Housing only, Crimp & Poke, Bright Tin Shell, 26 Socket, M3 Rear Nut
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
L77HDAG26SOL2C309
|
| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.76m (30 in) Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
L177HDAG26SOL2RM5
|
| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
L77HDAG26SOL2RM5
|
| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, Flash Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
L77HDAG26SOL2
|
| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, Flash Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
L77HDAG26SOL2RM8
|
| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, Flash Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Vanguard International ...
Vanguard International Semiconductor, Corp.
Vanguard International Semiconductor Corporation
|
| Part No. |
VG26S17400EJ-5 VG26S17400EJ-6 VG26V17400EJ-5 VG26VS17400E VG26V17400EJ-6 VG2617400EJ-6
|
| Description |
4,194,304 x 4 - Bit CMOS Dynamic RAM 4M X 4 FAST PAGE DRAM, 60 ns, PDSO24
SOCKET, 56 WAYSOCKET, 56 WAY; Ways, No. of:56; Colour:Grey; Current rating:8.5A; Dielectric strength, VAC:1800V; Resistance, insulation:5000MR; Voltage, working:125V
PLUG, 56 WAYPLUG, 56 WAY; Ways, No. of:56; Colour:Grey; Contacts, No. of:56; Current rating:8.5A; Dielectric strength, VAC:1800V; Poles, No. of:56; Resistance, insulation:5000MR; Voltage, working:125V
4/194/304 x 4 - Bit CMOS Dynamic RAM
|
| File Size |
212.35K /
25 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
L177HDAG26SOL2RM8
|
| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
L177HDAG26SOL2
|
| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38um (15u\\) Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
|
| Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|
