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Amphenol Communications Solutions |
Part No. |
75844-879-14LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
87914-3616 0879143616
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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File Size |
3,779.41K /
48 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
87914-2216 0879142216
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
87914-2815 0879142815
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
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File Size |
3,777.37K /
48 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
0879143016 87914-3016
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Bom2Buy.com
Price and Availability
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