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				TAITRON Components Incorporated
Part No.	TSLG-QR8080A08L-92-TR70 TSLG-QR8080A08L
OCR Text	...itter Note: The MCPCB should be preheated up to 40C for increasing the solderability Functional test of LED emitter Curing of thermal conductive glue Rev. A/LL www.taitroncomponents.com Page 8 of 9 High Power LED TSLG-QR8080A08L...
Description	High Power LED - 1W
File Size	375.51K / 9 Page	View it Online	Download Datasheet

				TAITRON Components Incorporated
Part No.	TSLG-TR8080A08L-92-TR70 TSLG-TR8080A08L
OCR Text	...itter Note: The MCPCB should be preheated up to 40C for increasing the solderability Functional test of LED emitter Curing of thermal conductive glue Rev. A/LL www.taitroncomponents.com Page 8 of 9 High Power LED TSLG-TR8080A08L...
Description	High Power LED - 1W
File Size	327.95K / 9 Page	View it Online	Download Datasheet

				TAITRON Components Incorporated
Part No.	TSLG-XR8080-A08L TSLG-XR8080-A08L-92-TR70
OCR Text	...itter Note: The MCPCB should be preheated up to 40C for increasing the solderability Functional test of LED emitter Curing of thermal conductive glue Rev. A/JY www.taitroncomponents.com Page 8 of 9 High Power LED TSLG-XR8080-A08...
Description	HIGH POWER LED
File Size	308.26K / 9 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC
Part No.	DN510
OCR Text	...e cycle. 3. Place assembly in a preheated oven and cure at one of the following schedules: 1/2 hr @ 150C 2 hrs @ 125C The base material of the DN510 is Beryllia which provides efficient energy transfer from the heating element located in...
Description	SUBMINIATURE PROPORTIONALLY CONTROLLED HEATER
File Size	338.95K / 2 Page	View it Online	Download Datasheet

				M/A-COM Technology Solutions, Inc.
Part No.	MA4E1310
OCR Text	...oxy Die Attach: Assembly can be preheated to 125 - 150 C. Use a minimum amount of epoxy. Cure epoxy as per manufacturer's schedule. For extended cure times, temperatures should be kept below 200 C. 4 ADVANCED: Data Sheets contain inform...
Description	GaAs Flip Chip Schottky Barrier Diode
File Size	63.56K / 5 Page	View it Online	Download Datasheet

				http:// M/A-COM Technology Solutions, Inc.
Part No.	MA4E1317 MA4E1318 MA4E1319-1 MA4E1319-2 MA4E2160
OCR Text	...xy Die Attach: Assembly can be preheated to 125 - 150C. Use a minimum amount of epoxy. Cure epoxy as per manufacturer's schedule. For extended cure times, temperatures should be kept below 200C. Handling Procedures The following precau...
Description	GaAs Flip Chip Schottky Barrier Diodes
File Size	131.86K / 7 Page	View it Online	Download Datasheet

				ETC Bay Linear List of Unclassifed Manufacturers BayLinear
Part No.	B033 B033S-X B033N-X B033D-X B033T-X B033D-1.8 B033D-2.5 B033D-3.0 B033D-25.8 B033D-3.3 B033D-5 B033D-ADJ B033N-1.8 B033N-2.5 B033N-3.0 B033N-3.3 B033N-5 B033N-ADJ B033S-1.8 B033S-2.5 B033S-3.0 B033T-3.0 B033T-5 B033T-ADJ
OCR Text	...rared reflow with the component preheated to within 65C of the soldering temperature range. 50 X 50 mm THERMAL CHARACTERISTICS The thermal resistance of B033 is 15C/W from junction to tab and 31 C/W from tab to ambient for a total of...
Description	Adjustable 1.0A low dropout voltage regulator 3.3V 1.0A low dropout voltage regulator 2.5V 1.0A low dropout voltage regulator 1.8V 1.0A low dropout voltage regulator 1.0Amp Low Dropout Voltage Regulator Adjustable & Fix (0.40Volt Dropout) 1.0Amp低压差线性稳压器可调 1.0Amp Low Dropout Voltage Regulator Adjustable & Fix (0.40Volt Dropout) 1.0 Amp Low Dropout Voltage Regulator 3.0V 1.0A low dropout voltage regulator
File Size	338.35K / 7 Page	View it Online	Download Datasheet

				Tyco Electronics
Part No.	MA4AGSW5
OCR Text	...Die Attachment Assembly can be preheated to approximately 125 C. Use a controlled thickness of approximately 2 mils for best electrical and thermal conductivity. Cure epoxy as per manufacturer's schedule. For extended cure times, temperatu...
Description	AlGaAs SP5T Reflective PIN Diode Switch
File Size	161.71K / 7 Page	View it Online	Download Datasheet

				M/A-COM Technology Solutions, Inc.
Part No.	MASW-004100-1193 MASW-004100-11930G MASW-004100-11930W
OCR Text	... Attachment Assembly should be preheated to 125C-150C. A Controlled thickness of 2 mils is recommended for best electrical and thermal conductivity. A thin epoxy fillet should be visible around the perimeter of the chip after placement to ...
Description	HMIC Silicon PIN Diode Switch HMIC垄芒 Silicon PIN Diode Switch
File Size	132.08K / 7 Page	View it Online	Download Datasheet

				Superworld Electronics
Part No.	SPI5012 SPI5012-100MZF SPI5012-150MZF SPI5012-1R0NZF SPI5012-1R5NZF SPI5012-220MZF SPI5012-2R2NZF SPI5012-330MZF SPI5012-3R3NZF SPI5012-470MZF SPI5012-4R7MZF SPI5012-6R8MZF
OCR Text	... hard, the sample shall then be preheated for about 2 minutes in a temperature of 130~150C and after it has been immersed to a depth 0.5mm below for 30.2 seconds fully in molten solder M705 with a temperature of 2455C. More than 90% of the ...
Description	SMD POWER INDUCTORS
File Size	241.46K / 5 Page	View it Online	Download Datasheet

For preheated Found Datasheets File :: 169 Search Time::1.343ms
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