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  interposer Datasheet PDF File

For interposer Found Datasheets File :: 104    Search Time::1.297ms    
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    09HSI-S042-R0-CHT

Hirose Electric
Part No. 09HSI-S042-R0-CHT
OCR Text ...e connected to each other by an interposer. The total stack height is flexible. For example, the following customer-specific heights have been made available: 17, 25, 26, 28, 32, 38 and 40 mm. Figure 1 IT3 connector Figure 2 Structure...
Description IT3 Mezzanine Connector (17mm)

File Size 2,553.77K  /  71 Page

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    09HSI-S043-R0-CHT

Hirose Electric
Part No. 09HSI-S043-R0-CHT
OCR Text ...e connected to each other by an interposer. The total stack height is flexible. For example, the following customer-specific heights have been made available: 17, 25, 26, 28, 32, 38 and 40 mm. Figure 1 IT3 connector Figure 2 Structure...
Description IT3 Mezzanine Connector (25mm)

File Size 2,561.94K  /  71 Page

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    AS4DDR32M72-10_ET AS4DDR32M72-10_IT AS4DDR32M72-10_XT AS4DDR32M72-6_IT AS4DDR32M72-75_ET AS4DDR32M72-75_XT AS4DDR32M72-8

Austin Semiconductor
Part No. AS4DDR32M72-10_ET AS4DDR32M72-10_IT AS4DDR32M72-10_XT AS4DDR32M72-6_IT AS4DDR32M72-75_ET AS4DDR32M72-75_XT AS4DDR32M72-8_ET AS4DDR32M72-8_IT AS4DDR32M72-8_XT AS4DDR32M72PBG AS4DDR32M72-75_IT AS4DDR32M72-10/ET AS4DDR32M72-10/IT AS4DDR32M72-10/XT AS4DDR32M72-6/IT AS4DDR32M72-75/ET AS4DDR32M72-75/IT AS4DDR32M72-75/XT AS4DDR32M72-8/ET AS4DDR32M72-8/IT AS4DDR32M72-8/XT
OCR Text ...liability applications Laminate interposer for optimum TCE match Configuration Addressing Parameter Configuration Refresh Count Row Address Bank Address Column Address 32 Meg x 72 8 Meg x 16 x 4 Banks 8K 8K (A0 A12) 4 (BA0 BA1) 1K (A0 A9...
Description 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit

File Size 339.97K  /  19 Page

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    L9D112G80BG4 L9D112G80BG4I10 L9D112G80BG4I6 L9D112G80BG4I75 L9D112G80BG4I8 L9D112G80BG4M10 L9D112G80BG4M6 L9D112G80BG4M7

LOGIC Devices Incorporated
Part No. L9D112G80BG4 L9D112G80BG4I10 L9D112G80BG4I6 L9D112G80BG4I75 L9D112G80BG4I8 L9D112G80BG4M10 L9D112G80BG4M6 L9D112G80BG4M75 L9D112G80BG4M8
OCR Text ...aging High TCE organic laminate interposer Suitable for High Reliability applications Upgradable to 32M x 72/80: L9D125G80BG4 *Note: This integrated product and/or its specifications are subject to change without notice. Latest document ...
Description 1.2 Gb, DDR - SDRAM Integrated Module

File Size 5,790.03K  /  45 Page

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    WEDPN8M64V-100B2C WEDPN8M64V-133B2C WEDPN8M64V-133B2I WEDPN8M64V-133B2M WEDPN8M64V-125B2C WEDPN8M64V-125B2I WEDPN8M64V-1

WEDC[White Electronic Designs Corporation]
Part No. WEDPN8M64V-100B2C WEDPN8M64V-133B2C WEDPN8M64V-133B2I WEDPN8M64V-133B2M WEDPN8M64V-125B2C WEDPN8M64V-125B2I WEDPN8M64V-125B2M WEDPN8M64V-100B2I WEDPN8M64V-100B2M WEDPN8M64V-XB2X
OCR Text ... parasitic capacitance Laminate interposer for optimum TCE match Suitable for hi-reliability applications Upgradeable to 16M x 64 density (WEDPN16M64V-XB2X) * This product is subject to change without notice. Discrete Approach 11.9 ...
Description 8Mx64 Synchronous DRAM

File Size 338.03K  /  15 Page

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    W3E64M72S-266ESC W3E64M72S-266ESI W3E64M72S-266ESM W3E64M72S-250ESC W3E64M72S-250ESI W3E64M72S-250ESM W3E64M72S-200ESC W

WEDC[White Electronic Designs Corporation]
Part No. W3E64M72S-266ESC W3E64M72S-266ESI W3E64M72S-266ESM W3E64M72S-250ESC W3E64M72S-250ESI W3E64M72S-250ESM W3E64M72S-200ESC W3E64M72S-200ESI W3E64M72S-200ESM W3E64M72S-XBX W3E64M72S-200BC W3E64M72S-200BI W3E64M72S-200BM W3E64M72S-250BC W3E64M72S-250BI W3E64M72S-250BM W3E64M72S-266BC W3E64M72S-266BI W3E64M72S-266BM W3E64M72S-333BC W3E64M72S-333BI W3E64M72S-333BM W3E64M72S-333ESC W3E64M72S-333ESI W3E64M72S-333ESM
OCR Text ...liability applications Laminate interposer for optimum TCE match GENERAL DESCRIPTION The 512MByte (4Gb) DDR SDRAM is a high-speed CMOS, dynamic random-access, memory using 9 chips containing 536,870,912 bits. Each chip is internally con...
Description 64Mx72 DDR SDRAM

File Size 585.09K  /  19 Page

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    L9D345G72BG5E19

LOGIC Devices Incorporated
Part No. L9D345G72BG5E19
OCR Text ...heat) High TCE organic laminate interposer for improved glass stability over a wide operating temperature Suitability of use in High Reliability applications requiring Mil-temp, nonhermetic device operation *Note: This integrated product...
Description 4.5 Gb, DDR3, 64 M x 72 Integrated Module (IMOD)

File Size 3,194.59K  /  155 Page

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    0476393000 47639-3000

Molex Electronics Ltd.
Part No. 0476393000 47639-3000
OCR Text ...1.27mm (.050") Pitch Removeable interposer for Dual- Piece Slimline Serial ATA Connector Assembly, Vertical, SMT, Gold (Au) Flash Plating, Leadfree Documents: 3D Model Drawing (PDF) Product Specification PS-47628-001 (PDF) RoHS Certif...
Description 1.00mm (.039), 1.27mm (.050) Pitch Removeable interposer for Dual- Piece Slimline Serial ATA Connector
1.00mm (.039"), 1.27mm (.050") Pitch Removeable interposer for Dual- Piece Slimline Serial ATA Connector
MOLEX Connector

File Size 295.33K  /  5 Page

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    L9D320G32BG6 L9D320G32BG6E25 L9D320G32BG6I25 L9D320G32BG6M25

LOGIC Devices Incorporated
Part No. L9D320G32BG6 L9D320G32BG6E25 L9D320G32BG6I25 L9D320G32BG6M25
OCR Text ...heat) High TCE organic laminate interposer for improved glass stability over a wide operating temperature Suitability of use in High Reliability applications requiring Mil-temp, nonhermetic device operation *Note: This integrated product...
Description 2.0 Gb, DDR3, 64 M x 32 Integrated Module (IMOD)

File Size 3,130.65K  /  154 Page

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    MFSYS25 MFSYS35

Intel Corporation
Part No. MFSYS25 MFSYS35
OCR Text ................. 10 2.4.2 Storage interposer Board ...................................................................................... 11 2.5 Mounting and Service Features.......................................................................
Description Technical Product Specification

File Size 2,647.55K  /  52 Page

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