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For pads Found Datasheets File :: 14861 Search Time::1.437ms
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				Mimix Broadband
Part No.	XS1000-BD0708 XS1000-BD
OCR Text	...de Metallization: Gold All Bond pads are 0.100 x 0.100 (0.004 x 0.004). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.88 mg. Bond Pad #1 (RF In) B...
Description	7.0-13.0 GHz GaAs MMIC 6-Bit Phase Shifter
File Size	446.05K / 6 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	XU1004-BD-EV1 XU1004-BD-000V XU1004-BD
OCR Text	...allization: Gold All DC/IF Bond pads are 0.100 x 0.100 (0.004 x 0.004). All RF Bond pads are 0.100 x 0.200 (0.004 x 0.008) Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002)....
Description	32.0-45.0 GHz GaAs MMIC Transmitter
File Size	190.91K / 7 Page	View it Online	Download Datasheet

				Mimix Broadband
Part No.	XX1002-BD-EV1 XX1002-BD-000V
OCR Text	...de Metallization: Gold All Bond pads are 0.200 x 0.100 (0.008 x 0.004). Bond pad centers are approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.566 mg. Bond Pad #1 (RF In) ...
Description	2.5-6.0/5.0-12.0 GHz GaAs MMIC Active Doubler
File Size	440.84K / 5 Page	View it Online	Download Datasheet

				http:// Mimix Broadband
Part No.	XX1007-BD-EV1 XX1007-BD-000V XX1007-BD
OCR Text	...face passivation above the bond pads are provided to allow wire bonding to the die's gold bond pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2% elongation to minimi...
Description	13.5-17.0/27.0-34.0 GHz GaAs MMIC Active Doubler
File Size	373.46K / 6 Page	View it Online	Download Datasheet

				Lumileds Lighting Company
Part No.	LXHL-BW03 LXHL-MWGC LXHL-NWG8 DS47
OCR Text	.... 2. Electrical interconnection pads labeled on the aluminumcore PCB with "+" and "" to denote positive and negative, respec tively. All positive pads are interconnected, as are all negative pads, allowing for flexibility in array interconn...
Description	power light source LUXEON㈢ Warm White Emitter and Star power light source LUXEON? Warm White Emitter and Star
File Size	499.62K / 13 Page	View it Online	Download Datasheet

				ZETEX[Zetex Semiconductors]
Part No.	ZXMC3AM832 ZXMC3AM832TA ZXMC3AM832TC
OCR Text	...air conditions with all exposed pads attached. The copper are is split down the centre line into two separate areas with one half connected to each half of the dual device. (b) Measured at t<5 secs for a dual device surface mounted on 8 sq ...
Description	MPPS Miniature Package Power Solutions COMPLEMENTARY 30V ENHANCEMENT MODE MOSFET MPPS⑩ Miniature Package Power Solutions COMPLEMENTARY 30V ENHANCEMENT MODE MOSFET
File Size	276.58K / 10 Page	View it Online	Download Datasheet

				Panasonic
Part No.	CT-24SX12UF CT-27SX12F CT-24SX12F
OCR Text	...acitor or resistor board solder pads may have holes through the board, however the hole diameter limits standard resistor replacement to 1/8 watt. standard capacitor may also be limited for the same reason. it is recommended that identical ...
Description	Color Television Service Manual
File Size	4,611.37K / 42 Page	View it Online	Download Datasheet

				Lumileds Lighting Company
Part No.	LXHL-MRD1 DS35 LXHL-PRD5 LXHL-BRD1 LXHL-LRD5
OCR Text	...rew. Electrical interconnection pads labeled on the aluminum-core PCB with "+" and "-" to denote positive and negative, respectively. All positive pads are interconnected, as are all negative pads, allowing for flexibility in array intercon...
Description	power light source Luxeon Dental
File Size	305.61K / 12 Page	View it Online	Download Datasheet

				Zetex Semiconductors
Part No.	ZXMC3AM832
OCR Text	...air conditions with all exposed pads attached . the copper are is split down the centre line into two separate areas with one half connected to each half of the dual device. (b) measured at t<5 secs for a dual device surface mounted on 8 s...
Description	N & P-channel MOSFET
File Size	309.20K / 10 Page	View it Online	Download Datasheet

				Winbond
Part No.	W682388
OCR Text	...-89) should have exposed copper pads to help reduce the thermal resistance of these components. The amount of copper used for the heat sink in combination with the surface area of the PCB will improve the heat dissipation of the transistor ...
Description	Pro-X⑩ CODEC Layout Guideline
File Size	348.63K / 8 Page	View it Online	Download Datasheet

For pads Found Datasheets File :: 14861 Search Time::1.437ms
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