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Kersemi Electronic Co.,...
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| Part No. |
IRF9530NL
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| OCR Text |
...f accommodating die sizes up to hex-4. it provides the highest power capability and the lowest possible on- resistance in any existing surface mount package. the d 2 pak is suitable for high current applications because of its low internal ... |
| Description |
Advanced Process Technology
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| File Size |
1,057.67K /
10 Page |
 View
it Online |
Download Datasheet
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Vishay
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| Part No. |
SIHF740S
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| OCR Text |
...of accommodating die size up to hex-4. it provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. the d 2 pak (to-263) is suitable for high current applications because of its low ... |
| Description |
Power MOSFET
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| File Size |
193.99K /
9 Page |
View
it Online |
Download Datasheet |
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Kersemi Electronic Co.,...
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| Part No. |
IRF9540NS
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| OCR Text |
...f accommodating die sizes up to hex-4. it provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. the d 2 pak is suitable for high current applications because of its low internal c... |
| Description |
Advanced Process Technology
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| File Size |
1,075.40K /
10 Page |
View
it Online |
Download Datasheet |
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Kersemi Electronic Co.,...
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| Part No. |
IRF9530NS
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| OCR Text |
...f accommodating die sizes up to hex-4. it provides the highest power capability and the lowest possible on- resistance in any existing surface mount package. the d 2 pak is suitable for high current applications because of its low internal ... |
| Description |
Advanced Process Technology
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| File Size |
1,062.74K /
10 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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