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Coilcraft Inc |
| Part No. |
132-03L
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| Description |
General Purpose Inductor, 0.028uH, 5%, 1 Element, 3823, ROHS COMPLIANT
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| Tech specs |
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Official Product Page
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Coilcraft Inc |
| Part No. |
132-03LT
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| Description |
RF inductor, molded, 5% tol, RoHS
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75844-879-14LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879144816
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 48 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.74K /
48 Page |
 View
it Online |
Download Datasheet
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Analog Devices |
| Part No. |
LTC3203BEDD#PBF
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| Description |
500mA Out C L N 2x Mode Boost
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| Tech specs |
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Official Product Page
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Analog Devices |
| Part No. |
LTC3203BEDD#TRPBF
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| Description |
500mA Out C L N 2x Mode Boost
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| Tech specs |
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Official Product Page
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Analog Devices |
| Part No. |
LTC3203EDD-1#TRPBF
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| Description |
500mA Out C L N 2x Mode Boost
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-2815 0879142815
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
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| File Size |
3,777.37K /
48 Page |
View
it Online |
Download Datasheet |
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Analog Devices |
| Part No. |
DC3203A
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| Description |
3.3V to 1.2V 6A Auto Buck in 2
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| Tech specs |
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Official Product Page
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Analog Devices |
| Part No. |
132032-HMC948LP3E
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| Description |
HMC948LP3E Evaluation PCB
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-2216 0879142216
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Analog Devices |
| Part No. |
LTC3203EDD#TRPBF
|
| Description |
500mA Out C L N 2x Mode Boost
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-3616 0879143616
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.41K /
48 Page |
View
it Online |
Download Datasheet |
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Analog Devices |
| Part No. |
LTC3203EDD#PBF
|
| Description |
500mA Out C L N 2x Mode Boost
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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