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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
XPH13016MC
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| Description |
P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF)
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75844-879-14LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Coilcraft Inc |
| Part No. |
XAL5030-161MEB
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| Description |
General Purpose Inductor, 0.16uH, 20%, 1 Element, Composite-Core, SMD, 2221, CHIP, 2221, HALOGEN FREE AND ROHS COMPLIANT
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| Tech specs |
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Official Product Page
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Coilcraft Inc |
| Part No. |
XAL1030-161ME
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| Description |
Power inductor, shielded, 20% tol, SMT, RoHS, halogen-f
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| Tech specs |
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Official Product Page
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Coilcraft Inc |
| Part No. |
XAL1030-161MEC
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| Description |
General Purpose Inductor, 0.16uH, 20%, 4439,
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-2815 0879142815
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
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| File Size |
3,777.37K /
48 Page |
 View
it Online |
Download Datasheet
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Coilcraft Inc |
| Part No. |
XAL7030-161MEC
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| Description |
General Purpose Inductor, 0.16uH, 20%, 1 Element, Composite-Core, SMD, 3030, CHIP, 3030, HALOGEN FREE AND ROHS COMPLIANT
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
|
| Part No. |
0879143416 87914-3416
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.41K /
48 Page |
View
it Online |
Download Datasheet |
| |
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Coilcraft Inc |
| Part No. |
XAL7030-161MEB
|
| Description |
General Purpose Inductor, 0.16uH, 20%, 1 Element, Composite-Core, SMD, 3030, CHIP, 3030, HALOGEN FREE AND ROHS COMPLIANT
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| Tech specs |
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Official Product Page
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Coilcraft Inc |
| Part No. |
XAL5030-161
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| Description |
Power inductor, shielded, 20% tol, SMT, RoHS, halogen-free
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143203 87914-3203
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 2.54μm (1.00μ) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 2.54渭m (1.00渭) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
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| File Size |
759.86K /
11 Page |
View
it Online |
Download Datasheet |
| |
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Coilcraft Inc |
| Part No. |
XAL1030-161MEB
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| Description |
General Purpose Inductor, 0.16uH, 20%, 4439,
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
|
| Part No. |
87914-3616 0879143616
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.41K /
48 Page |
View
it Online |
Download Datasheet |
| |
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Coilcraft Inc |
| Part No. |
XAL7030-161
|
| Description |
Power inductor, shielded, 20% tol, SMT, RoHS, halogen-free
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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