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  586-1303-101F Datasheet PDF File

For 586-1303-101F Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    SIRENZA[SIRENZA MICRODEVICES]
Part No. NGA-586
Description DC-5.5 GHZ CASCADABLE IN GAP /GAAS MMIC AMPLIFIER

File Size 400.41K  /  5 Page

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Coilcraft Inc

Part No. 13031CL
Description Power choke, toroid, RoHS
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SNA-586

Electronic Theatre Controls, Inc.
ETC[ETC]
List of Unclassifed Manufacturers
Part No. SNA-586
Description DC-5 GHz / Cascadable GaAs HBT MMIC Amplifier
DC-5 GHz, Cascadable GaAs HBT MMIC Amplifier

File Size 350.64K  /  6 Page

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Amphenol Communications Solutions

Part No. 130-3162-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs    

Official Product Page

    NGA-586

STANFORD[Stanford Microdevices]
Part No. NGA-586
Description DC-5.5 GHZ CASCADABLE IN GAP /GAAS MMIC AMPLIFIER 的DC - 5.5 GHz的级联在GAP /功率单片放大

File Size 290.60K  /  4 Page

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Amphenol Communications Solutions

Part No. 130-3162-15H
Description Paladin Plus 3-Pair, 6 Column, Right Angle Receptacle, Signal Module, APP
Tech specs    

Official Product Page

    Hypertac, Ltd.
Part No. HPD-586
Description 34 CONTACT(S), FEMALE, OTHER D TYPE CONNECTOR, SOLDER

File Size 74.28K  /  1 Page

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Amphenol Communications Solutions

Part No. 130-3182-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, APP.
Tech specs    

Official Product Page

    TQ1303-1308

TriQuint Semiconductor
Part No. TQ1303-1308
Description Splitter Family (700-2200 MHz)

File Size 49.01K  /  6 Page

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Amphenol Communications Solutions

Part No. 130-3142-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, APP.
Tech specs    

Official Product Page

    451303 4514

Renesas Electronics Corporation
Part No. 451303 4514
Description 4-BIT SINGLE-CHIP MICROCOMPUTER

File Size 1,717.28K  /  210 Page

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Amphenol Communications Solutions

Part No. 130-3182-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs    

Official Product Page

    14-44-2909 A-70475-1303

Molex Electronics Ltd.
Part No. 14-44-2909 A-70475-1303
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.76μm (30μ) Gold (Au), 9 Circuits
2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 0.76μm (30μ) Gold (Au), 9 Circuits

File Size 141.38K  /  2 Page

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Amphenol Communications Solutions

Part No. 130-3142-15D
Description Paladin Plus 3-Pair, 4 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs    

Official Product Page

    LITTELFUSE[Littelfuse]
Part No. 598 585 586
Description MINIATURE FUSEHOLDERS

File Size 319.81K  /  1 Page

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Amphenol Communications Solutions

Part No. 130-3182-15H
Description Paladin Plus 3-Pair, 8 Column, Right Angle Receptacle, Signal Module, APP
Tech specs    

Official Product Page

    2586-40

KR Electronics, Inc.
Part No. 2586-40
Description Lowpass Filter

File Size 41.88K  /  2 Page

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Amphenol Communications Solutions

Part No. 130-3162-15D
Description Paladin Plus 3-Pair, 6 Column, Right Angle Receptacle, Signal Module, NiS
Tech specs    

Official Product Page

    2586-50

KR Electronics, Inc.
Part No. 2586-50
Description Lowpass Filter

File Size 20.55K  /  2 Page

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Amphenol Communications Solutions

Part No. 130-3142-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Daughtercard Module, Nickel Sulfamate.
Tech specs    

Official Product Page

For 586-1303-101F Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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