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  56083 Datasheet PDF File

For 56083 Found Datasheets File :: 60+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 |   

    K4H561638F K4H561638F-TC_LB3 FMB857B K4H560838F-TC_LA2 K4H560838F-TC_LAA K4H560838F-TC_LB0 K4H560838F-TC_LB3 K4H561638F-

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4H561638F K4H561638F-TC_LB3 FMB857B K4H560838F-TC_LA2 K4H560838F-TC_LAA K4H560838F-TC_LB0 K4H560838F-TC_LB3 K4H561638F-TC_LA2 K4H561638F-TC_LAA K4H561638F-TC_LB0 K4H560838F-TC/LA2 K4H560838F-TC/LAA K4H560838F-TC/LB0 K4H560838F-TC/LB3 K4H561638F-TC/LA2 K4H561638F-TC/LAA K4H561638F-TC/LB0 K4H561638F-TC/LB3
Description 256Mb F-die DDR SDRAM Specification

File Size 326.57K  /  23 Page

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Amphenol Communications Solutions

Part No. 10136656-0831LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    K4C560838C-TCD3 K4C561638C-TCD3 K4C561638C-TCD4000 K4C561638C-TCDA K4C560838C-TCD4 K4C560838C-TCDA K4C561638C-TCD4

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4C560838C-TCD3 K4C561638C-TCD3 K4C561638C-TCD4000 K4C561638C-TCDA K4C560838C-TCD4 K4C560838C-TCDA K4C561638C-TCD4
Description 256Mb Network-DRAM

File Size 877.29K  /  42 Page

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Amphenol Communications Solutions

Part No. 10136656-0831NLF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Natural Color, GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    K4H560438E-ZC/LA2 K4H560838E-ZC/LA2 K4H560438E-ZC/LB0 K4H560838E-ZC/LB0 K4H560438E-ZC/LB3 K4H560838E-ZC/LB3 K4H560838E-Z

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560438E-ZC/LA2 K4H560838E-ZC/LA2 K4H560438E-ZC/LB0 K4H560838E-ZC/LB0 K4H560438E-ZC/LB3 K4H560838E-ZC/LB3 K4H560838E-ZCB3 K4H560438E-ZCB3 K4H560438E-ZLA2 K4H560838E-ZLA2 K4H560438E-ZCA2 K4H560838E-ZCB0 K4H560438E-ZCB0 K4H560838E-ZCA2 K4H560838E-ZLA20 K4H560438E-ZLA20
Description 64M X 4 DDR DRAM, 0.75 ns, PBGA60 ROHS COMPLIANT, FBGA-60
32M X 8 DDR DRAM, 0.75 ns, PBGA60 ROHS COMPLIANT, FBGA-60
CSM, CER 103PF 1000V 10% 1210
CAP, 10NF 1KV 10%, SMT, 1812
Connector Cover; Enclosure Material:Aluminum; Cable Diameter Max:25.4mm; Cable Diameter Min:20.32mm; Cable Entry:Top; For Use With:AVX/Elco 8016 Series Rack and Panel Rectangular Connectors with 90 Contacts RoHS Compliant: Yes
CONN MEMORY CARD HDR CF NORMAL
CONN EJECTOR COMPACTFLASH RIGHT
Rectangular Industrial Connector Housing; Series:C-146; No. of Contacts:10; Gender:Female; Body Material:Aluminum Alloy; Connecting Termination:Screw; For Use With:C146 Rectangular Circular Connectors; Operating Voltage:400V RoHS Compliant: Yes
COVER, SIDE ENTRY, 38WAY; For use with:8016 Series Rectangular Connectors; Material:Aluminium; Colour:Grey; Connector type:Dust Cap & Cover; Contacts, No. of:38; Ways, No. of:38 RoHS Compliant: Yes
Rectangular Industrial Connector Housing; Series:C-146; No. of Contacts:6; Gender:Female; Body Material:Aluminum Alloy; Connecting Termination:Screw; Features:Spring Cover; For Use With:C146 Rectangular Circular Connectors RoHS Compliant: Yes
256Mb E-die DDR SDRAM Specification 60 FBGA with Pb-Free (RoHS compliant)

File Size 360.28K  /  23 Page

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Amphenol Communications Solutions

Part No. 10136656-0832LF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Black Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    K4H560838E-VC/LB3 K4H560438E-VC/LB3 K4H560438E-VC/LA2 K4H560838E-VC/LA2 K4H560438E-VC/LB0 K4H560838E-VC/LB0 K4H560838E-V

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560838E-VC/LB3 K4H560438E-VC/LB3 K4H560438E-VC/LA2 K4H560838E-VC/LA2 K4H560438E-VC/LB0 K4H560838E-VC/LB0 K4H560838E-VCA2 K4H560438E-VCA2 K4H560438E-VLB3 K4H560838E-VCB3 K4H560438E-VLB0 K4H560438E-VLA2 K4H560438E-VCB3 K4H560838E-VLB0 K4H560838E-VLA2 K4H560838E-VCB0 K4H560438E-VCB0 K4H560838E-VLB3
Description 256Mb E-die DDR SDRAM Specification 54 sTSOP-II with Pb-Free (RoHS compliant) 256Mb的电子芯片DDR SDRAM内存规格54 sTSOP与铅二无(符合RoHS

File Size 299.00K  /  23 Page

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Amphenol Communications Solutions

Part No. 10136656-0832NLF
Description Minitek® Pwr 3.0, Single Row, Vertical Through Hole Header, 15u\\ Gold (Tin on Tails) plating, 8 Positions, Natural Color, Non GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    K4H561638N-LCB3T00 K4H560838N-LLB30

Samsung semiconductor
Part No. K4H561638N-LCB3T00 K4H560838N-LLB30
Description N-die DDR SDRAM
32M X 8 DDR DRAM, 0.7 ns, PDSO66

File Size 325.32K  /  24 Page

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    K4H560838E-TC/LB0 K4H560838E-TC/LA2 K4H560838E-TC/LAA K4H560838E-TC/LB3 K4H560438E-TC/LB3 K4H560438E-TC/LB0 K4H560438E-T

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4H560838E-TC/LB0 K4H560838E-TC/LA2 K4H560838E-TC/LAA K4H560838E-TC/LB3 K4H560438E-TC/LB3 K4H560438E-TC/LB0 K4H560438E-TC/LA2 K4H560438E-TC/LAA K4H560838E K4H560438E-TLAA K4H560838E-TCAA K4H560838E-TLAA K4H560438E-TCAA K4H560438E-TCB3 K4H560438E-TLB3
Description DDR SDRAM 256Mb E-die (x4, x8) 256Mb的DDR SDRAM的电子芯片(了x4,x8
Quad Wide Bandwidth High Output Drive Single Supply Op Amp 16-PDIP -40 to 125
256Mb E-die DDR SDRAM Specification 66 TSOP-II
Dual Micropower Precision Low-Voltage Operational Amplifier 8-SOIC -55 to 125
10-Bit, 32 kSPS ADC Serial Out, uProcessor Periph./Standalone, 11 Ch. 20-PLCC
10-Bit, 32 kSPS ADC Serial Out, uProcessor Periph./Standalone, 11 Ch. 20-PDIP
   DDR SDRAM 256Mb E-die (x4, x8)

File Size 216.51K  /  24 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4C561638C-TCDA K4C560838C-TCDA K4C561638C-TCD4000 K4C560838C-TCD3 K4C560838C-TCDA0 K4C560838C-TCD40
Description Aluminum Electrolytic Radial Lead High Ripple, Long Life Capacitor; Capacitance: 220uF; Voltage: 200V; Case Size: 18x31 mm; Packaging: Bulk
Aluminum Electrolytic Radial Lead High Ripple, Long Life Capacitor; Capacitance: 47uF; Voltage: 200V; Case Size: 12.5x20 mm; Packaging: Bulk 256Mb的网络内
256Mb Network-DRAM 256Mb的网络内
32M X 8 SYNCHRONOUS DRAM, 0.75 ns, PDSO66
32M X 8 SYNCHRONOUS DRAM, 0.65 ns, PDSO66

File Size 885.55K  /  42 Page

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    K4H560838D-TCC4 K4H560838D-TCCC K4H561638D-TCCC K4H56038D-TC K4H561638D-TCC4

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4H560838D-TCC4 K4H560838D-TCCC K4H561638D-TCCC K4H56038D-TC K4H561638D-TCC4
Description 256Mb D-die DDR400 SDRAM Specification 256Mb芯片支持DDR400内存规格

File Size 166.12K  /  18 Page

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    K4H560438H K4H560438H-UC_LA2 K4H560438H-UC_LB0 K4H561638H-UC_LA2 K4H561638H-UC_LB0 K4H561638H-UC_LB3 K4H561638H-UC_LCC K

SAMSUNG[Samsung semiconductor]
Part No. K4H560438H K4H560438H-UC_LA2 K4H560438H-UC_LB0 K4H561638H-UC_LA2 K4H561638H-UC_LB0 K4H561638H-UC_LB3 K4H561638H-UC_LCC K4H561638H K4H560838H-UC_LCC K4H560838H K4H560838H-UC_LA2 K4H560838H-UC_LB0 K4H560838H-UC_LB3
Description 256Mb H-die DDR SDRAM Specification

File Size 356.30K  /  24 Page

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    K4S560432E-NC75 K4S560832E-NC75 K4S560832E-NL75 K4S561632E K4S560432E-NC K4S560432E-NL75

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S560432E-NC75 K4S560832E-NC75 K4S560832E-NL75 K4S561632E K4S560432E-NC K4S560432E-NL75
Description 256Mb E-die SDRAM Specification 54pin sTSOP-II 256Mb的电子芯片内存规4pin sTSOP -

File Size 180.64K  /  13 Page

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