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  35363-0250 Datasheet PDF File

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    ATS-50250B-C2-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-50250B-C2-R0
Description Ultra High Performance BGA Cooling

File Size 267.02K  /  1 Page

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Renesas Electronics Corporation

Part No. XAH335025.000000K
Description 1000fs Automotive Quartz-based PLL Oscillator
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    PS-DA0250-01 PS-DA0250-01S

Power Systems GmbH Co.KG
Part No. PS-DA0250-01 PS-DA0250-01S
Description DC-AC INVERTER UNIT 4 W SINGLE OUTPUTS

File Size 94.26K  /  2 Page

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Renesas Electronics Corporation

Part No. 5962-93025-000
Description 54FCT2373T
Tech specs    

Official Product Page

    ATS-50250G-C2-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-50250G-C2-R0
Description Ultra High Performance BGA Cooling

File Size 266.00K  /  1 Page

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Renesas Electronics Corporation

Part No. XAH335025.000000I
Description 1000fs Automotive Quartz-based PLL Oscillator
Tech specs    

Official Product Page

    ATS-50250G-C1-R0

Advanced Thermal Solutions, Inc.
Part No. ATS-50250G-C1-R0
Description maxiFLOW maxiGRIP HS Assembly- STD, T766, BLUE-ANODIZED

File Size 292.54K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-112402500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    14-45-0606 70475-0250 A-70475-0250

Molex Electronics Ltd.
Part No. 14-45-0606 70475-0250 A-70475-0250
Description 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ) Tin (Sn), 6 Circuits
2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 26, 3.81μm (150μ) Tin (Sn), 6 Circuits

File Size 151.55K  /  2 Page

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Amphenol Communications Solutions

Part No. 77313-802-50LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 50 Positions
Tech specs    

Official Product Page

    Ecliptek, Corp.
Part No. 69008-0250 69008-0225
Description MATRITZE 2.54MM
CHANGE HEAD QF-50 变化头资 50

File Size 146.40K  /  1 Page

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Amphenol Communications Solutions

Part No. 10025026-10202TLF
Description PCI Express® GEN 3 Card Edge, Storage and Server Connector, Straddle-Mount, x8, 98 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

    63860-7500 63811-1200 57105-6000 35507-XX00 63850-7500 50212-8100 35363-XX60 50212-8000 35362-XX00 35362-XX50

Molex Electronics Ltd.
Part No. 63860-7500 63811-1200 57105-6000 35507-XX00 63850-7500 50212-8100 35363-XX60 50212-8000 35362-XX00 35362-XX50
Description 2.00mm (.079) Pitch Sherlock?/a>
2.00mm (.079") Pitch Sherlock垄芒

File Size 273.53K  /  2 Page

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Amphenol Communications Solutions

Part No. 61083-102500LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 100 Positions.
Tech specs    

Official Product Page

    AMIS-710250

ON Semiconductor
Part No. AMIS-710250
Description 200dpi CIS Module 200dpi独联体模

File Size 160.55K  /  8 Page

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Amphenol Communications Solutions

Part No. 54112-811102500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    RFP-250250-6Z50-2

ANAREN INC
Anaren Microwave
Part No. RFP-250250-6Z50-2
Description 0 MHz - 3000 MHz 50 ohm RF/MICROWAVE TERMINATION
Surface Mount Terminations 16 Watts, 50ohm

File Size 512.25K  /  2 Page

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    AMI[AMI SEMICONDUCTOR]
Part No. AMIS-710250
Description 200dpi CIS Module

File Size 160.14K  /  8 Page

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