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  1gb m-die ddr sdram 66 tsop-ii Datasheet PDF File

For 1gb m-die ddr sdram 66 tsop-ii Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    HMT351U7CFR8C-H9 HMT351U7CFR8C-RD HMT351U7CFR8C-PB HMT41GU6MFR8A HMT41GU6MFR8A-G7 HMT41GU6MFR8A-H9 HMT41GU6MFR8A-PB HMT3

Hynix Semiconductor
Part No. HMT351U7CFR8C-H9 HMT351U7CFR8C-RD HMT351U7CFR8C-PB HMT41GU6MFR8A HMT41GU6MFR8A-G7 HMT41GU6MFR8A-H9 HMT41GU6MFR8A-PB HMT351U6CFR8C-PB HMT351U6CFR8C-RD HMT351U6CFR8C-H9 HMT325U7CFR8C-H9 HMT325U7CFR8C-RD HMT325U7CFR8C-PB HMT325U6CFR8C-RD HMT325U6CFR8C-PB HMT325U6CFR8C-H9
Description ddr3 sdram Unbuffered DIMMs Based on 2Gb C-Die
ddr3L sdram Unbuffered DIMMs Based on 4Gb m-die

File Size 994.42K  /  57 Page

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    K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K4S560832E-NCL75 K4S561632E-NCL60 K4S561632E-NCL75 K4S560432E-NC K4S560432E-NCL75 K4S561632E-NC75
Description 16M x 16 sdram, LVTTL, 133MHz
256Mb E-die sdram Specification 54pin stsop-ii

File Size 205.22K  /  14 Page

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    K4S640832 K4S640832F K4S640832F-TL75 K4S640832F-TC75

SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Electronics Inc
Part No. K4S640832 K4S640832F K4S640832F-TL75 K4S640832F-TC75
Description Advanced LinCMOS(TM) Low-Noise Precision Operational Amplifier 8-SOIC 0 to 70
64Mbit sdram 2M x 8Bit x 4 Banks Synchronous DRAM LVTTL
IC,sdram,4X2MX8,CMOS,TSOP,54PIN,PLASTIC

File Size 116.51K  /  11 Page

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    K4S561632C-TC75 K4S561632C K4S561632C-L1H K4S561632C-L1L K4S561632C-L60 K4S561632C-L75 K4S561632C-L7C K4S561632C-TC K4S5

Samsung semiconductor
Part No. K4S561632C-TC75 K4S561632C K4S561632C-L1H K4S561632C-L1L K4S561632C-L60 K4S561632C-L75 K4S561632C-L7C K4S561632C-TC K4S561632C-TC7C
Description 16M X 16 SYNCHRONOUS DRAM, 5.4 ns, PDSO54
IC,sdram,4X4MX16,CMOS,TSOP,54PIN,PLASTIC
256Mbit sdram 4M x 16bit x 4 Banks Synchronous DRAM

File Size 112.98K  /  11 Page

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    408-8737

Tyco Electronics
Part No. 408-8737
Description The die assembly consists of an indenter die and nest die. Each die is held in the tool by a single screw

File Size 117.59K  /  2 Page

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    Samsung
Part No. K4S641632
Description IC,sdram,4X1MX16,CMOS,TSOP,54PIN,PLASTIC

File Size 552.71K  /  11 Page

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    Hynix
Part No. HY57V56820CT
Description IC,sdram,4X8MX8,CMOS,TSOP,54PIN,PLASTIC

File Size 153.69K  /  12 Page

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    hynix
Part No. HY57V161610ET-6
Description IC,sdram,2X512KX16,CMOS,TSOP,50PIN,PLASTIC

File Size 159.80K  /  13 Page

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    Micron Technology Inc
Part No. MT48LC4M16A2-10
Description sdram,4X1MX16,CMOS,TSOP,54PIN,PLASTIC

File Size 4,147.09K  /  55 Page

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    V55C2128164VB V55C2128164VT V55C2128164V

Mosel Vitelic Corp
MOSEL[Mosel Vitelic, Corp]
Part No. V55C2128164VB V55C2128164VT V55C2128164V
Description 128Mbit LOW-POWER sdram 2.5 VOLT, TSOP II / BGA PACKAGE 8M X 16

File Size 513.55K  /  44 Page

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For 1gb m-die ddr sdram 66 tsop-ii Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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