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  12160 Datasheet PDF File

For 12160 Found Datasheets File :: 99+       Page :: | 1 | 2 | 3 | <4> | 5 | 6 | 7 | 8 | 9 | 10 |   

    HYB25L512160AC-75 HYB25L512160AC

INFINEON[Infineon Technologies AG]
Part No. HYB25L512160AC-75 HYB25L512160AC
Description 512MBit Mobile-RAM

File Size 1,057.68K  /  50 Page

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Amphenol Communications Solutions

Part No. 61082-121602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 120 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Infineon Technologies Corporation
Part No. HYB25DC512160C
Description (HYB25DC512160C / HYB25DC512800C) 512M-Bit DDR SDRAM

File Size 3,532.72K  /  88 Page

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Amphenol Communications Solutions

Part No. 54122-810121600LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 12 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    Qimonda
Part No. HYB25DC512160B
Description 512-Mbit Double-Data-Rate SDRAM

File Size 1,168.00K  /  35 Page

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Amphenol Communications Solutions

Part No. 10131216-003LF
Description HPCE R/A Receptacle 56P
Tech specs    

Official Product Page

    HYB18T512160AF

Qimonda AG
Part No. HYB18T512160AF
Description 214-Pin Micro-DIMM-DDR2-SDRAM Modules

File Size 1,116.00K  /  44 Page

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Amphenol Communications Solutions

Part No. CE1216000110111
Description Cool Edge 0.80mm Hybrid Power and Signal Connectors, Storage and Server System, Through Hole/Surface mount, 2 power pins, 160 signal pins, Vertical
Tech specs    

Official Product Page

    015-91-2160 A713080016N 0015912160

Molex Electronics Ltd.
Part No. 015-91-2160 A713080016N 0015912160
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 16 Circuits, Tin (Sn) Plating, without PCB Locator Pegs

File Size 1,475.89K  /  8 Page

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Amphenol Communications Solutions

Part No. 10139085-12160QPLF
Description BERGSTAK 0.8MM
Tech specs    

Official Product Page

    HYI25D512160CT-5 HYI25D512160CT-6 HYI25D512160CC-5 HYI25D512160CC-6

Qimonda AG
Part No. HYI25D512160CT-5 HYI25D512160CT-6 HYI25D512160CC-5 HYI25D512160CC-6
Description 512-Mbit Double-Data-Rate SDRAM

File Size 1,043.59K  /  35 Page

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Amphenol Communications Solutions

Part No. 54121-118121600LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    HYB18M512160BFX HYB18M512160BFX-7.5

Qimonda AG
Part No. HYB18M512160BFX HYB18M512160BFX-7.5
Description DRAMs for Mobile Applications 512-Mbit DDR Mobile-RAM

File Size 1,912.69K  /  52 Page

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Amphenol Communications Solutions

Part No. 61083-121602LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 120 Positions.
Tech specs    

Official Product Page

    MNR1216082SIZE A5800583

ROHM
Part No. MNR1216082SIZE A5800583
Description Chip resistor networks
From old datasheet system

File Size 399.90K  /  5 Page

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Amphenol Communications Solutions

Part No. 61083-121609LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 120 Positions.
Tech specs    

Official Product Page

    HYB18M512160BF-6 HYB18M512160BF-7.5 HYE18M512160BF-6 HYE18M512160BF-7.5

Qimonda AG
Part No. HYB18M512160BF-6 HYB18M512160BF-7.5 HYE18M512160BF-6 HYE18M512160BF-7.5
Description DRAMs for Mobile Applications 512-Mbit DDR Mobile-RAM RoHS compliant

File Size 602.65K  /  24 Page

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Amphenol Communications Solutions

Part No. 10147613-121606LF
Description BergStak HS receptacle 120pos
Tech specs    

Official Product Page

    http://
Part No. HYB18L512160BF-7.5 HYE18L512160BF-7.5
Description DRAMs for Mobile Applications 512-Mbit Mobile-RAM

File Size 1,261.96K  /  57 Page

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Amphenol Communications Solutions

Part No. 10147614-121606LF
Description BergStak HS™ 0.80mm,Board-to-Board Connector, Header, 120 Position
Tech specs    

Official Product Page

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