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For thinnest Found Datasheets File :: 61 Search Time::1.5ms
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					Amkor Technology, Inc.
Part No.	ETCSP
OCR Text	thinnest CSP available at 0.5 mm max mounted height JEDEC Level 1 Reliability to 260 C reflow temperature Conventional process flow with proven wirebond technology Standardized footprints at 0.5 mm pitch Package stacking potential of tested...
Description	the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height.
File Size	144.90K / 2 Page	View it Online	Download Datasheet

					Hittite Microwave Corporation
Part No.	HMC208MS800 HMC208MS8
OCR Text	...t of 0.040" (1.0mm) this is the thinnest mixer package available today. LO = +13 dBm IF = 70 MHz GaAs MMIC SMT DOUBLE-BALANCED MIXER 0.7 - 2.0 GHz FEBRUARY 2000 900 MHz Performance ULTRA SMALL PACKAGE: MSOP8 CONVERSION LOSS: 8 dB ...
Description	GaAs MMIC SMT DOUBLE-BALANCED MIXER 0.7 - 2.0 GHz
File Size	112.38K / 4 Page	View it Online	Download Datasheet

					Hittite Microwave Corporation
Part No.	HMC272MS801 HMC272MS8
OCR Text	...t of 0.040" (1.0mm) this is the thinnest mixer package available today. GaAs MMIC SMT SINGLE BALANCED MIXER 1.7 - 3 GHz FEBRUARY 2001 Features ULTRA SMALL PACKAGE: MSOP8 LO/RF ISOLATION: 35 dB IP3 (INPUT): +20 dBm IDEAL FOR MMDS & W...
Description	GaAs MMIC SMT SINGLE BALANCED MIXER
File Size	165.40K / 6 Page	View it Online	Download Datasheet

					AVAGO TECHNOLOGIES LIMITED
Part No.	HSMF-C114
OCR Text	...such small packaging and be the thinnest package in the industry for tricolor package. With the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every applicatio...
Description	Surface Mount Tricolor ChipLEDs
File Size	83.90K / 8 Page	View it Online	Download Datasheet

					Agilent(Hewlett-Packard) http://
Part No.	INA-0218497 INA-02186-TR1 INA-02184-TR1 INA-02186-BLK
OCR Text	...t designs should be done on the thinnest practical substrate. The parasitic inductance of a pair of via holes passing through 0.032" thick P.C. board is approximately 0.1 nH, while that of a pair of via holes passing through 0.062" thick bo...
Description	Low Noise, Cascadable Silicon Bipolar MMIC Amplifier
File Size	53.61K / 6 Page	View it Online	Download Datasheet

					Allegro MicroSystems
Part No.	A1448EEWLT-P
OCR Text	...Allegro DFN (EW) package is the thinnest DFN in the Selection Guide Part Number A1448EEWLT-P Packing* 3000 pieces per 7-in. reel Package 1.5 mm x 2 mm , 0.40 mm maximum overall package height, 6-contact MLP/DFN with exposed therma...
Description	Low-Voltage, Full-Bridge Brushless DC Motor Driver with Integrated Hall Sensor IC, PWM Speed Control, Soft-Switching
File Size	180.27K / 7 Page	View it Online	Download Datasheet

					STMicroelectronics
Part No.	ST23YR80
OCR Text	...ted contactless micromodule for thinnest packaging solutions Security features Active shield Monitoring of environmental parameters Protection mechanisms against faults Hardware Security Enhanced DES accelerato...
Description	Dual contactless smartcard MCU with 80 Kbytes EEPROM, enhanced security, cryptoprocessor and optimized RF performance
File Size	54.11K / 4 Page	View it Online	Download Datasheet

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