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Amphenol Communications Solutions |
| Part No. |
L177HRA26SVF
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| Description |
Dsub, Straight, High Density, Crimp & Poke, Bright Tin Shell, 26 Socket, 4-40 Fixed Front Screwlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDA26SOL2
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, Flash Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDA26SD1CH4R
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 26 Socket, Flash Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDA26SD1CH3FC309
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 26 Socket, 0.76m (30 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L177HDA26SD1CO4F
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350\\), 26 Socket, 0.38um (15u\\) Gold, 4-40 Front Screwlock, Without Boardlock
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Official Product Page
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Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
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| Part No. |
LN30 LN15
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| Description |
Single Jacket Non-Armored 单夹克非装甲
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| File Size |
104.77K /
2 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
L177HDA26SVF
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L177HDA26SOL2
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDA26SD1CH4F
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 26 Socket, Flash Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L177HDA26SD1CO3F
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| Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350\\), 26 Socket, 0.38um (15u\\) Gold, M3 Front Screwlock, Without Boardlock
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDA26S
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, Flash Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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