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SCW03 1BA22 SC560C R0100 30117719 E6F22MX B1015 ST60100C
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For joints Found Datasheets File :: 1459    Search Time::1.235ms    
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    IP4338CX24LF

NXP Semiconductors
Part No. IP4338CX24LF
OCR Text ... solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classi?ed in a...
Description 10-channel integrated filter network

File Size 102.72K  /  12 Page

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    Motorola
Part No. AN555
OCR Text ...er as to place ceramic to metal joints in tension. b. the device should never be mounted in such a manner as to apply force on the strip leads in a vertical direction towards the cap. c. when the device is mounted in a printed circuit board...
Description Mounting Stripline Opposed Emitter Transistor

File Size 144.72K  /  7 Page

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    意法半导
Part No. LDP24M
OCR Text ...fied. the quality of the solder joints is very important for two reasons : (i) poor quality solder joints result directly in poor reliability and (ii) solder thickness affects the thermal resistance significantly. thus a tight control of th...
Description TRANSILTM Load Dump Protection(瞬变电压抑制器二极管)

File Size 111.32K  /  10 Page

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    IP4364CX8

NXP Semiconductors
Part No. IP4364CX8
OCR Text ... solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classi?ed in a...
Description (IP4064CX8 / IP4364CX8) Integrated SIM card passive filter array

File Size 116.61K  /  13 Page

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    ON Semi
MOTOROLA[Motorola, Inc]
Part No. PZTA64T1 PZTA64T1_D ON2784
OCR Text ...s visual inspection of soldered joints. The formed leads absorb thermal stress during soldering eliminating the possibility of damage to the die. * Available in 12 mm Tape and Reel Use PZTA64T1 to order the 7 inch/1000 unit reel. Use PZTA64...
Description From old datasheet system
SOT23 PACKAGE NPN SILICON
PNP SILICON DARLINGTON TRANSISTOR SURFACE MOUNT

File Size 169.93K  /  6 Page

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    SD-44828-001 448281162 UCP2008-0962

Molex Electronics Ltd.
Part No. SD-44828-001 448281162 UCP2008-0962
OCR Text ...ly. 5.1.4 inspection solder joints should be inspected using established conventional methods. 5.2 45560 smt cradle connector 5.2.1 pcb layout see the applicable sales drawings for illustrations of the recommended pcb pad la...
Description 0.8MM HANDYLINK SMT RECEPTACLE 16 CIRCUIT

File Size 1,220.55K  /  27 Page

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    UCP2006-2962 455931607 SD-45593-001

Molex Electronics Ltd.
Part No. UCP2006-2962 455931607 SD-45593-001
OCR Text ...ly. 5.1.4 inspection solder joints should be inspected using established conventional methods. 5.2 45560 smt cradle connector 5.2.1 pcb layout see the applicable sales drawings for illustrations of the recomm ended pcb pad layo...
Description 0.8MM HANDYLINK PLUG CONNECTOR MODULES FOR PCB TERMINATION

File Size 917.90K  /  26 Page

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    BCP68T3 BCP68T1-D

ON Semiconductor
Part No. BCP68T3 BCP68T1-D
OCR Text ...s visual inspection of soldered joints. the formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die ? available in 12 mm tape and reel use bcp68t1 to order the 7 inch/1000 unit reel. use bcp68t3...
Description NPN Silicon Epitaxial Transistor
TRANSISTOR | BJT | NPN | 20V V(BR)CEO | 1A I(C) | SOT-223

File Size 72.63K  /  8 Page

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