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  DIP14-50130 Datasheet PDF File

For DIP14-50130 Found Datasheets File :: 58+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 |   

    0850130438 85013-0438

Molex Electronics Ltd.
Part No. 0850130438 85013-0438
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, Style R Reverse, 1μm (40μ) Selective Gold (Au), 96 Circuits, Lead free

File Size 128.65K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TC74HC14AP
Description CMOS Logic IC, Hex Inverter, DIP14
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0850130385 85013-0385

Molex Electronics Ltd.
Part No. 0850130385 85013-0385
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R/2 Reverse

File Size 311.07K  /  6 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TC4069UBP
Description CMOS Logic IC, Inverter, DIP14
Tech specs    

Official Product Page

    0850130103

Molex Electronics Ltd.
Part No. 0850130103
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R Reverse, 0.6μm (24μ) Selective Gold (Au), 64 Circuits, Lead free

File Size 81.00K  /  3 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TC74HC04AP
Description CMOS Logic IC, Hex Inverter, DIP14
Tech specs    

Official Product Page

    0850130476

Molex Electronics Ltd.
Part No. 0850130476
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, C-Pin Press-Fit Style R Reverse, 1μm (40μ) Selective Gold (Au), 64 Circuits, Lead free

File Size 80.97K  /  3 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TC4001BP
Description CMOS Logic IC, 2-Input/AND, DIP14
Tech specs    

Official Product Page

    85013-0414 0850130414

Molex Electronics Ltd.
Part No. 85013-0414 0850130414
Description 2.54mm (.100) Pitch DIN 41612 Header, Vertical, Style R Reverse,1um (40 u) Selective Gold (Au)

File Size 125.70K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TC4013BP
Description CMOS Logic IC, D-Type Flip-Flop, DIP14
Tech specs    

Official Product Page

    0850130036 85013-0036

Molex Electronics Ltd.
Part No. 0850130036 85013-0036
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse,0.6um (24u) Selective Gold (Au)
MOLEX Connector

File Size 129.25K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TC4011BP
Description CMOS Logic IC, 2-Input/NAND, DIP14
Tech specs    

Official Product Page

    0850130012 85013-0012

Molex Electronics Ltd.
Part No. 0850130012 85013-0012
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 64 Circuits, 0.6μm (24μ) Selective Gold (Au), Lead free
MOLEX Connector

File Size 127.65K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TC4093BP
Description CMOS Logic IC, 2-Input/NAND, DIP14
Tech specs    

Official Product Page

    0850130024 85013-0024

Molex Electronics Ltd.
Part No. 0850130024 85013-0024
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R Reverse, 0.6μm (24μ) Selective Gold (Au), 96 Circuits
MOLEX Connector

File Size 135.50K  /  5 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TC74HC08AP
Description CMOS Logic IC, Quad 2-Input/AND, DIP14
Tech specs    

Official Product Page

    0850130074 85013-0074

Molex Electronics Ltd.
Part No. 0850130074 85013-0074
Description 2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse, 0.6μm (24μ) Selective Gold (Au), 48 Circuits, Lead free
MOLEX Connector

File Size 267.51K  /  8 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. TC74HC00AP
Description CMOS Logic IC, Quad 2-Input/NAND, DIP14
Tech specs    

Official Product Page

    0850130050 85013-0050

Molex Electronics Ltd.
Part No. 0850130050 85013-0050
Description 2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R/2 Reverse

File Size 266.38K  /  8 Page

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Amphenol Communications Solutions

Part No. 95278-501-30LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 30 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

For DIP14-50130 Found Datasheets File :: 58+       Page :: | 1 | 2 | <3> | 4 | 5 | 6 |   

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