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				AVAGO TECHNOLOGIES LIMITED
Part No.	AMMC-6232
OCR Text	...Idd=135mA, Zin = Zout = 50 , on-wafer unless noted) 40 30 20 10 0 15 20 25 30 35 Frequency (GHz) NoiseFigure (dB) 5 4 3 2 1 0 18 20 22 24 26 28 30 32 Frequency (GHz) Figure 1. Small-signal Gain 0 S21 (dB) Figure 2. Noise Figure ...
Description	18 to 32 GHz GaAs High Linearity Low Noise Amplifier
File Size	1,390.04K / 8 Page	View it Online	Download Datasheet

				Agilent(Hewlett-Packard)
Part No.	AMMC-6241 AMMC-6241-W10 AMMC-6241-W50
OCR Text	.../Large -signal data measured in wafer form TA = 25C. 4. 100% on-wafer RF test is done at frequency =30, 32, and 38 GHz. 5. Specifications are derived from measurements in a 50 test environment. Aspects of the amplifier performance may be i...
Description	26-43 GHz Low Noise Amplifier
File Size	940.52K / 8 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	IP4340CX15
OCR Text	...sulated in a 1.56 mm ? 1.56 mm wafer-level chip-scale package (wlcsp) fabricated using monolithic silicon semiconductor technology. these features make the device ideal for use in applications requiring a high degree of miniaturization,...
Description	6-channel filter for ESD protection of microSD memory card interfaces
File Size	203.20K / 14 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	HTSICH48 HTSICH56
OCR Text	... types ? sawn, gold - bumped 8? wafer ? sawn, gold - megabumped 8? wafer ? contactless chip card module moa4 ? hvson2 3. applications ? animal identification ? laundry automation ? beer keg and gas cylinder logistic ? pigeon race sports ? ...
Description	HITAG S transponder IC
File Size	254.06K / 21 Page	View it Online	Download Datasheet

				http:// MIMIX[Mimix Broadband]
Part No.	CMM1110-BD PB-CMM1110-BD CMM1110-BD-000X
OCR Text	...70 Max. 18.0 +8.5 90 100% on-wafer DC testing and 100% RF wafer qualification. wafer qualification includes sample testing from each quadrant with an 80% pass rate required. Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 770...
Description	2.0-18.0 GHz GaAs MMIC Low Noise Amplifier
File Size	270.72K / 7 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	AND8002 AND8002D
OCR Text	...ation Traceability Code Code 6. wafer Lot Traceability Code Code 7. Year Date Code Code 8. Work Week Date Code Code 2 Temperature Compensation Code Code 1 Circuit Identification Code Code 3 Family Identification Code NB100 LVEP 22...
Description	ECLinPS, ECLinPS Lite, ECLinPS Plus ECLinPS MAX, and GigaComm Marking and Ordering Information Guide
File Size	134.01K / 16 Page	View it Online	Download Datasheet

				Skyworks Solutions Inc.
Part No.	SMP1353-099 SMP1322-099 SMP1340-099
OCR Text	...099 Quantity of Good Diodes Per wafer Bonding Pad Min. Nom. 40,000 46,000 40,000 65,000 65,000 40,000 40,000 46,000 72,000 72,000 46,000 46,000 Chip Size Nominal (In.) 0.003 0.0003 0.0075 0.0003 0.003 0.0003 0.008 0.0005 0.0085 0.0005 ...
Description	PIN Diode Chips Supplied on Film Frame
File Size	184.38K / 5 Page	View it Online	Download Datasheet

				Applied Micro Circuits Corporation
Part No.	CS5920
OCR Text	....... 12 Quality Built In During wafer Fabrication and Manufacturing .......................................................................... 12 Inspection, Audit and Reliability Confirmation ..................................................
Description	Full 132 Mbytes/sec Transfer Rate
File Size	1,048.93K / 160 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IRG7CH54K10EF
OCR Text	...ty irg7ch54k10ef die on film wafer 1 irg7ch54k10ef mechanical parameter ? die size 7.55 x 7.55 mm 2 minimum street width 75 m emiter pad size (included gate pad) see die drawing mm 2 gate pad size 0.509 x 0.503 area t...
Description	Medium Power Drives
File Size	185.44K / 4 Page	View it Online	Download Datasheet

				ONSEMI[ON Semiconductor]
Part No.	EB201 EB201D
OCR Text	... it comprises almost all of the wafer thickness, its only purpose is to strengthen the wafer for its trip through wafer processing, dicing, and final assembly. The resistance added by the substrate is entirely undesirable, and low resistivi...
Description	High Cell Density MOSFETs Low On-Resistance Affords New Design Options
File Size	118.47K / 8 Page	View it Online	Download Datasheet

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Price and Availability

Price & Availability of wafer

Part #	Manufacturer	Description	Price	BuyNow Qty.
1.5WAFERSEAL4000 4657-1.5WAFERSEAL4000-ND	Kenco Label & Tag	FROSTED TRANSLUCENT 1.5" CIRCLE	500: USD17.9982 250: USD18.13456 100: USD18.4072 50: USD19.089 25: USD19.7708 10: USD20.452 1: USD22.5	1

Part #	Manufacturer	Description	Price	BuyNow Qty.
1DB45-109S-001 WAFER LOT 1DB45-109S-001 WAF	Sensitron Semiconductors	- Virtual or Non-Physical Inventory (Software & Literature) (Alt: 1DB45-109S-001 WAF)		0
1DB61-001S-001 WAFER LOT 1DB61-001S-001 WAF	Sensitron Semiconductors	- Virtual or Non-Physical Inventory (Software & Literature) (Alt: 1DB61-001S-001 WAF)		0
1DB48-109Z-001 WAFER LOT 1DB48-109Z-001 WA	Sensitron Semiconductors	- Virtual or Non-Physical Inventory (Software & Literature) (Alt: 1DB48-109Z-001 WA)		0
WAFER-ULT-I1-I5-R11-VAR WAFER-ULT-I1-I5-R11-VAR	iEi Integration Corporation	INCLUDES RS-232 CABLE,RS-422/485 CABLE,KB/MS Y CABLE - Bulk (Alt: WAFER-ULT-I1-I5-R11-VAR)		0
1DB62-003S-001 WAFER LOT ACCEPT 1DB62-003S-001 WAF	Sensitron Semiconductors	- Virtual or Non-Physical Inventory (Software & Literature) (Alt: 1DB62-003S-001 WAF)		0

Part #	Manufacturer	Description	Price	BuyNow Qty.
ZSSC3281BC2B 964-ZSSC3281BC2B	Renesas Electronics Corporation	Signal Conditioning DICE ON 725 MICRO METER WAFER NO INKING	2090: USD2.86	0
ZSSC3281BC5B 964-ZSSC3281BC5B	Renesas Electronics Corporation	Signal Conditioning DICE ON 304 MICRO METER WAFER WITH INKIN	2090: USD2.86	0
ZSSC3281BC6B 964-ZSSC3281BC6B	Renesas Electronics Corporation	Signal Conditioning DICE ON 725 MICRO METER WAFER WITH INKIN	2090: USD2.86	0
ZSSC3281BC1B 964-ZSSC3281BC1B	Renesas Electronics Corporation	Signal Conditioning DICE ON 304 MICRO METER WAFER NO INKING	2090: USD2.86	0
ZSSC3281BI1B 964-ZSSC3281BI1B	Renesas Electronics Corporation	Signal Conditioning DICE ON 304 MICRO METER WAFER NO INKING	2090: USD3.17	0

Part #	Manufacturer	Description	Price	BuyNow Qty.
AD5821-WAFER	Analog Devices Inc	BARE DIE WAFER		0

Part #	Manufacturer	Description	Price	BuyNow Qty.
SHELL SIZE 21 WAFER SP DCHSHELL SIZE 21 WAFER SP	TE Connectivity	SHELL SIZE 21 WAFER SPRING		0
SHELL SIZE 15 WAFER SP DCHSHELL SIZE 15 WAFER SP	TE Connectivity	SHELL SIZE 15 WAFER SPRING		0
SHELL SIZE 11 WAFER SP DCHSHELL SIZE 11 WAFER SP	TE Connectivity	SHELL SIZE 11 WAFER SPRING		0
SPRING WAFER DCHSPRING WAFER	TE Connectivity	SPRING WAFER		0

Part #	Manufacturer	Description	Price	BuyNow Qty.
T2-WAFER	CTS Corporation		0: USD0	5
T7-WAFER	CTS Corporation		0: USD0	5
T1-WAFER	CTS Corporation		0: USD0	1

Part #	Manufacturer	Description	Price	BuyNow Qty.
DASD 3.1 WAFERS	IBM			1

Part #	Manufacturer	Description	Price	BuyNow Qty.
0353620450 35362-0450	Molex	Headers & Wire Housings 4 Ckt Vert. Hdr. Sherlock W-T-B	23: USD0.221 25: USD0.211 50: USD0.206 100: USD0.202 250: USD0.195 500: USD0.161 1000: USD0.158	207095
0022035045 22-03-5045	Molex	Headers & Wire Housings 2.5 VERT HDR SPOX 4P shrouded	35: USD0.146 100: USD0.114 500: USD0.111 1000: USD0.099	19597
0022035025 22-03-5025	Molex	Headers & Wire Housings 2.5 VERT HDR SPOX 2P shrouded	40: USD0.125 50: USD0.119 100: USD0.117 250: USD0.115 500: USD0.105 1700: USD0.095 15900: USD0.091	46427
0022035035 22-03-5035	Molex	Headers & Wire Housings 2.5 VERT HDR SPOX 3P shrouded	41: USD0.122 50: USD0.116 100: USD0.106 619: USD0.099 1000: USD0.09	18431
0353630460 35363-0460	Molex	Headers & Wire Housings 4 Ckt R/A Hdr. Sherlock W-T-B	23: USD0.222 50: USD0.203 100: USD0.193 250: USD0.189 500: USD0.186 1000: USD0.18	16438

Part #	Manufacturer	Description	Price	BuyNow Qty.
SHELL SIZE 21 WAFER SP DCHSHELL SIZE 21 WAFER SP	TE Connectivity	SHELL SIZE 21 WAFER SPRING		0
SHELL SIZE 15 WAFER SP DCHSHELL SIZE 15 WAFER SP	TE Connectivity	SHELL SIZE 15 WAFER SPRING		0
SHELL SIZE 11 WAFER SP DCHSHELL SIZE 11 WAFER SP	TE Connectivity	SHELL SIZE 11 WAFER SPRING		0
SPRING WAFER DCHSPRING WAFER	TE Connectivity	SPRING WAFER		0

Part #	Manufacturer	Description	Price	BuyNow Qty.
MP4462 WAFER MP4462	Monolithic Power Systems	MPSMP4462 WAFER (Alt: MP4462)		0
MP4462XUWAFER MP4462XUWAFER	Monolithic Power Systems	MPSMP4462XUWAFER (Alt: MP4462XUWAFER)		0
SL3S1204CUWAFER 432225238817	NXP Semiconductors	PHSSL3S1204CUWAFER (Alt: 432225238817)		0

Part #	Manufacturer	Description	Price	BuyNow Qty.
WAFER 3 (A2+ /FQ) 07L3979	Daylight Company	Wafer 3 Lightbox (A2+ /FQ)	1: EUR140.27 3: EUR136.06 10: EUR131.39 25: EUR127.89	1
WAFER 1 (A4+ /FQ) 07L3981	Daylight Company	Wafer 1 Lightbox (A4+ /FQ)	1: EUR64.7	3

Part #	Manufacturer	Description	Price	BuyNow Qty.
WAFER-GH1.25-10PWB	XUNPU	1x10P 10P GH 1 1.25mm 10 -25��~+85�� 1A Surface Mount��Right Angle SMD,P=1.25mm,Surface Mount��Right Angle Wire To Board / Wire To Wire Connector ROHS	5: USD0.14876 50: USD0.12064 150: USD0.10868 2500: USD0.08428 5000: USD0.08026	13130
WAFER-GH1.25-4PLB	XUNPU	1x4P 4P GH 1 1.25mm 4 -25��~+85�� 1A Brick nogging SMD,P=1.25mm Wire To Board / Wire To Wire Connector ROHS	5: USD0.1079 50: USD0.08742 150: USD0.07722 2500: USD0.06292 5000: USD0.05988	38581
WAFER-GH1.25-6PWB	XUNPU	1x6P 6P GH 1 1.25mm 6 -25��~+85�� 1A Surface Mount��Right Angle SMD,P=1.25mm,Surface Mount��Right Angle Wire To Board / Wire To Wire Connector ROHS	5: USD0.1077 50: USD0.08771 150: USD0.07762 2500: USD0.06262 5000: USD0.05958	30171
WAFER-GH1.25-8PLB	XUNPU	1x8P 8P GH 1 1.25mm 8 -25~+85 1A Brick nogging SMD,P=1.25mm Wire To Board Connector ROHS	5: USD0.14955 50: USD0.12152 150: USD0.10947 2500: USD0.08379 5000: USD0.07977	4119
WAFER-HY2.0-8PWB	XUNPU	1x8P 8P 1 2mm 8 -25��~+85�� 2A Surface Mount��Right Angle SMD,P=2mm,Surface Mount��Right Angle Wire To Board / Wire To Wire Connector ROHS	5: USD0.11535 50: USD0.09379 150: USD0.08301 2500: USD0.06644 5000: USD0.06321	33230

Part #	Manufacturer	Description	Price	BuyNow Qty.
WAFER S1403A U SP001392792	Infineon Technologies AG	Radar-Chip vor Level Meter (Alt: SP001392792)		0

Part #	Manufacturer	Description	Price	BuyNow Qty.
WAFER-MX1.25-8PZZ	XUNPU	1x8P 8P 1 1.25mm 8 -25+85 1A Straight PluginP1.25mm Wire To Board Connector ROHS	10000: USD0.0297 5000: USD0.0312 1000: USD0.0342 300: USD0.0388 100: USD0.0438 10: USD0.0539	2047
WAFER-150W-3A	Dongguan Hanbo Technology Co Ltd	1x3P 3P 1 1.5mm 3 -25+85 1A Surface MountRight Angle SMDP1.5mmSurface MountRight Angle Wire To Board Connector ROHS	10500: USD0.0281 4500: USD0.0294 1500: USD0.0322 300: USD0.0387 100: USD0.0432 10: USD0.0523	2348
WAFER-GH1.25-4PWB	XUNPU	1x4P 4P GH 1 1.25mm 4 -25+85 1A Surface MountRight Angle SMDP1.25mmSurface MountRight Angle Wire To Board Connector ROHS	5000: USD0.0494 2000: USD0.0518 1000: USD0.0569 150: USD0.0636 50: USD0.072 5: USD0.0888	17236
WAFER-HY2.0-4PWB	XUNPU	1x4P 4P 1 2mm 4 -25+85 2A Surface MountRight Angle SMDP2mmSurface MountRight Angle Wire To Board Connector ROHS	4800: USD0.0437 2400: USD0.0459 800: USD0.0504 150: USD0.0572 50: USD0.0647 5: USD0.0797	12913
WAFER-HY2.0-DZ	XUNPU	- Housing Contact ROHS	48000: USD0.0059 24000: USD0.0062 12000: USD0.0069 1500: USD0.0076 500: USD0.0089 50: USD0.0111	13900

Part #	Manufacturer	Description	Price	BuyNow Qty.
WAFER-8522-1GZ-R10	iEi Integration Corporation	3.5" SBC,ULV Intel® Celeron 1GHz zero cache with VGA/LVDS,Dual GbE,USB 2.0,Audio	1: USD387	1
WAFER-BT-I1-N28071-R10	iEi Integration Corporation	3.5" SBC with Intel 22nm Atom™/Celeron on-board SoC, VGA/LVDS/ iDP, Dual PCIe GbE, USB 3.0, PCIe Mini, SATA 3Gb/s, mSATA, COM, Audio and RoHS	1: USD381.99	1
WAFER-BT-N29301-R21	iEi Integration Corporation	3.5" SBC, 22nm 4-Core Celeron N2930 1.86GHz, on-board SoC, VGA/LVDS/iDP, Dual PCIe GbE, USB 2.0, PCIe Mini, SATA 6Gb/s, mSATA , COM, Audio and RoHS	1: USD443.74	3
WAFER-8522-600-R10	iEi Integration Corporation	3.5" SBC,ULV Intel® Celeron 600MHz 512K cache with VGA/LVDS,Dual GbE,USB 2.0,Audio	1: USD355	1
WAFER-ULT5-I7-R10	iEi Integration Corporation	3.5" SBC 8th Gen (ULT) Core i7-8665UE, DDR4 SO-DIMM , 3 display Dual HDMI, LVDS, PCIe mini, SATA 6Gb/s, dual COM, Audio and RoHS	1: USD1282.31	3