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SGS Thomson Microelectronics
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| Part No. |
AN483
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| OCR Text |
...n surface to weld together. the thicker aluminum wires are bonded using the simpler ultrasonic method, where the wire is sim- ply pressed onto the surface of the chip then vi- brated rapidly to weld the wire to the pad. be- cause more vigor... |
| Description |
MIXED WIRE BONDING TECHNOLOGY FOR AUTOMOTIVE SMART POWER ICs
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| File Size |
307.34K /
4 Page |
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it Online |
Download Datasheet
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Willow Technologies Limited
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| Part No. |
UT35
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| OCR Text |
thicker film tubular type non-inductive resistors for ultra high voltage, high energy * power rating able to build up mega jouls energy system. * various models with voltage ratings upto 800kv in oil, 300kv at free air. ut series to me... |
| Description |
thicker Film Tubular type Non-Inductive Resistors for Ultra High Voltage, High Energy
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| File Size |
773.38K /
2 Page |
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it Online |
Download Datasheet |
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KEMET[Kemet Corporation]
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| Part No. |
T499 T499_1
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| OCR Text |
...the component to be redesigned (thicker dielectric) to allow for that failure rate to be achieved. Accelerated life testing of this component at 175C and with 50% nameplate voltage applied has shown the failure rate to be less than 0.5% per... |
| Description |
High Temperature ( 175) Tantalum SMT Capaci
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| File Size |
543.21K /
3 Page |
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it Online |
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Price and Availability
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