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  K66X-B44S-N30 Datasheet PDF File

For K66X-B44S-N30 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    4N30Z

Unisonic Technologies
Part No. 4N30Z
Description 4A, 300V N-CHANNEL POWER MOSFET

File Size 173.28K  /  3 Page

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Amphenol Communications Solutions

Part No. L177HDB44SVF
Description Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock
Tech specs    

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HUA FENG CIRCUIT





    Signetics
Part No. N3002
Description Central Processing Element

File Size 552.11K  /  9 Page

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Part No. L177HDB44SD1CH4R
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
Tech specs    

Official Product Page

    Nell Semiconductor Co., Ltd
Part No. 50N30
Description N-Channel Power MOSFET

File Size 332.73K  /  7 Page

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Part No. L177HDB44SVFM
Description Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38um (15u\\) Gold, Fixed M3 Front Screwlock, Without Bracket, Without Boardlock
Tech specs    

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    N3004

List of Unclassifed Manufacturers
ETC[ETC]
NIKO-SEM
Part No. N3004
Description 5 Bit Programmable Synchronous Buck Converter with Dual LDOs

File Size 163.81K  /  7 Page

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Part No. L177HDB44SOL2
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs    

Official Product Page

    K4N30

KODENSHI[KODENSHI KOREA CORP.]
Kodenshi Corp
Part No. K4N30
Description Photocoupler(These Photocouplers cosist of a Gallium Arsenide Infrared Emitting)

File Size 225.22K  /  3 Page

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Amphenol Communications Solutions

Part No. L77HDB44SD1CH4F
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 44 Socket, Flash Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock
Tech specs    

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    American Microsemiconductor Inc.
Part No. 1N306
Description

File Size 624.89K  /  1 Page

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Amphenol Communications Solutions

Part No. L177HDB44SD1CO3R
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350\\), 44 Socket, 0.38um (15u\\) Gold, M3 Rear Threaded Insert, Without Boardlock
Tech specs    

Official Product Page

    SGS Thomson Microelectronics
Part No. AN308
Description RELAY DRIVE PROTECTION

File Size 37.91K  /  4 Page

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Part No. L77HDB44S
Description Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, Flash Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs    

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    AN302

STMicroelectronics
Part No. AN302
Description The purpose of this note is to familiarize

File Size 121.75K  /  10 Page

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Amphenol Communications Solutions

Part No. L77HDB44SVFC309
Description Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.76m (30 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock
Tech specs    

Official Product Page

    SGS Thomson Microelectronics
Part No. AN302
Description THYRISTORS AND TRIACS, AN IMPORTANT PARAMETER - THE HOLDING CURRENT

File Size 67.46K  /  6 Page

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Part No. L177HDB44SD1CH3F
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
Tech specs    

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    SGS Thomson Microelectronics
Part No. AN303
Description LATCHING CURRENT

File Size 99.19K  /  10 Page

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Amphenol Communications Solutions

Part No. L177HDB44SD1CO4F
Description Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350\\), 44 Socket, 0.38um (15u\\) Gold, 4-40 Front Screwlock, Without Boardlock
Tech specs    

Official Product Page

For K66X-B44S-N30 Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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