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Freescale Semiconductor
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Part No. |
MPX2300DT1
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OCR Text |
... Diagnostics * Infusion Pumps * blood Pressure Monitors * Pressure Catheter Applications * Patient Monitoring NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Fr... |
Description |
(MPX2300DT1 / MPX2301DT1) High Volume Pressure Sensor
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File Size |
117.72K /
4 Page |
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it Online |
Download Datasheet
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Motorola
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Part No. |
MPX2301DT1 MPX2300DT1
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OCR Text |
... Diagnostics * Infusion Pumps * blood Pressure Monitors * Pressure Catheter Applications * Patient Monitoring NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Fr... |
Description |
MPX2300DT1 Chip Pak High Volume Pressure Sensor for Disposable, Backside Pressure Applications High Volume Pressure Sensor For Disposable Applications
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File Size |
58.24K /
4 Page |
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it Online |
Download Datasheet
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All Sensors Corp. All Sensors Corporation
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Part No. |
BP01-D1-MV DS-0048
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OCR Text |
...tions
Package M * Non Invasive blood Pressure
General Description
This data sheet describes two package configuration of pressure sensors for use in non invasive blood pressure maeasurement. The output voltager is ratiometric to the su... |
Description |
Millivolt Output Pressure Sensors
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File Size |
33.60K /
2 Page |
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it Online |
Download Datasheet
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FREESCALE[Freescale Semiconductor, Inc]
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Part No. |
MPX2301DT1 MPX2300DT1
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OCR Text |
... Diagnostics * Infusion Pumps * blood Pressure Monitors * Pressure Catheter Applications * Patient Monitoring NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Fr... |
Description |
High Volume Pressure Sensor For Disposable Applications
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File Size |
91.38K /
4 Page |
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it Online |
Download Datasheet
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MOTOROLA INC
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Part No. |
MPX2300DT1
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OCR Text |
... diagnostics ? infusion pumps ? blood pressure monitors ? pressure catheter applications ? patient monitoring note: the die and wire bonds are exposed on the front side of the chip pak (pressure is applied to the backside of the device). ... |
Description |
DIFFERENTIAL, PEIZORESISTIVE PRESSURE SENSOR, 0-5.8Psi, 3%, 0-3mV, RECTANGULAR, THROUGH HOLE MOUNT
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File Size |
34.96K /
3 Page |
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it Online |
Download Datasheet
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Price and Availability
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