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Amphenol Communications Solutions |
| Part No. |
75844-879-14LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
R1EX24016ATAS0G#U0
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| Description |
EEPROM, TSSOP, /Embossed Tape
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
UPD70F4016M2GJA-GAE-G
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| Description |
32-bit Microcontrollers (Non Promotion), , /
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
UPD70F4016M2GJA9-GAE-G
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| Description |
32-bit Microcontrollers (Non Promotion), , /
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143203 87914-3203
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 2.54μm (1.00μ) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 2.54渭m (1.00渭) Tin (Sn) Selective Plating, 32 Circuits, Tray Packaging,Lead-free
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| File Size |
759.86K /
11 Page |
 View
it Online |
Download Datasheet
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Renesas Electronics Corporation |
| Part No. |
R1EX24016ASAS0A#U0
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| Description |
EEPROM, SOP, /
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
R1EX24016ASAS0I#U0
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| Description |
Two-wire serial interface 16k EEPROM (2-kword × 8-bit)
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143016 87914-3016
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
R1EX24016ASA00I#S0
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| Description |
EEPROM, SOP, /Embossed Tape
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143216 87914-3216
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
UPD70F4016M1GJA9-GAE-G
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| Description |
32-bit Microcontrollers (Non Promotion), , /
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143416 87914-3416
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.41K /
48 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
R1EX24016ATAS0A#S0
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| Description |
EEPROM, TSSOP, /
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143435 87914-3435
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating, Tray Packaging, Lead-free
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| File Size |
3,776.94K /
48 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
M2004-01-666.5140T
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| Description |
Frequency Translation PLL
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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