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  87760-0817 Datasheet PDF File

For 87760-0817 Found Datasheets File :: 133+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 |   

    87760-3216

Molex Electronics Ltd.
Part No. 87760-3216
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.34K  /  4 Page

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SiTime

Part No. SIT8008BC-73-33E-69.877600
Description 1 to 110 MHz, Low Power Oscillator
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87760-3617

Molex Electronics Ltd.
Part No. 87760-3617
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 36 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.25K  /  4 Page

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Amphenol Communications Solutions

Part No. 54201-G0817LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 17 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87760-2618

Molex Electronics Ltd.
Part No. 87760-2618
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 26 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tray, Lead-free

File Size 160.05K  /  4 Page

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Amphenol Communications Solutions

Part No. 54102-T0817LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 34 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    87760-3417

Molex Electronics Ltd.
Part No. 87760-3417
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.17K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-111081700LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    87760-3616

Molex Electronics Ltd.
Part No. 87760-3616
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.34K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-109081700LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87760-3618

Molex Electronics Ltd.
Part No. 87760-3618
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 36 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tray, Lead-free

File Size 159.88K  /  4 Page

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Amphenol Communications Solutions

Part No. 54202-S0817LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 34 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87760-2617

Molex Electronics Ltd.
Part No. 87760-2617
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.17K  /  4 Page

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Amphenol Communications Solutions

Part No. 57102-G08-17ULF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 34 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    87760-5017

Molex Electronics Ltd.
Part No. 87760-5017
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.25K  /  4 Page

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Amphenol Communications Solutions

Part No. 108-1711-200
Description Paladin® 112Gb/s Backplane Connector, 7-Pair, Guide Module, No Key.
Tech specs    

Official Product Page

    87760-4216

Molex Electronics Ltd.
Part No. 87760-4216
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.34K  /  4 Page

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Amphenol Communications Solutions

Part No. 54201-S08-17
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 17 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87760-2218

Molex Electronics Ltd.
Part No. 87760-2218
Description 2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 22 Circuits, 2.54μm (100μ) Tin (Sn) Plating, Tray, Lead-free

File Size 160.05K  /  4 Page

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Amphenol Communications Solutions

Part No. 57102-G08-17LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 34 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

For 87760-0817 Found Datasheets File :: 133+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 |   

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