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AP9468GJ Q1V822HJ NJW1163A AT25320 24AA16 G30N60 X9407 44308
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    EMIF06-VID01C2

STMicroelectronics
Part No. EMIF06-VID01C2
OCR Text ...ation Figure 7. Footprint recommendations Figure 8. Marking Copper pad Diameter : 250m recommended , 300m max Dot, ST logo xx = marking z = manufacturing location yww = date code (y = year ww = week) E Solder stencil o...
Description 6 line low capacitance EMI filter and ESD protection

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    EMIF06-VID01F2 EMIF06-VID01F208

ST Microelectronics
STMicroelectronics
Part No. EMIF06-VID01F2 EMIF06-VID01F208
OCR Text ...rmation Figure 10. Footprint recommendations Figure 11. Marking Copper pad diameter: 250 m recommended, 300 m max Dot, ST logo xx = marking z = manufacturing location yww = date code (y = year ww = week) E Solder stencil o...
Description 6-line EMI filter and ESD protection for display interfaces
6-line IPAD, low capacitance EMI filter and ESD protection

File Size 153.17K  /  7 Page

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    OM3115P OM3115N OM3105N OM3105P

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. OM3115P OM3115N OM3105N OM3105P
OCR Text ...strate temperature. MOUNTING recommendations General If a protective cap is incorporated, it should be as thin as possible, because its thickness "d" forms part of the operating distance "S". A brass stud wall should not extend beyond th...
Description Hybrid integrated circuits for inductive proximity detectors

File Size 32.44K  /  8 Page

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    EMIF10-COM01C2

STMicroelectronics
Part No. EMIF10-COM01C2
OCR Text ... sub 1.1 PCB grounding recommendations In order to ensure a good efficiency in terms of ESD protection and filtering behavior, we recommend to implement microvias (100 m dia.) between the GND bumps and the GND layer. GND bumps can...
Description EMI Filter including ESD protection

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    EMIF10-COM01F208 EMIF10-COM01F2

STMicroelectronics
Part No. EMIF10-COM01F208 EMIF10-COM01F2
OCR Text ... sub 2.1 PCB grounding recommendations In order to ensure a good efficiency in terms of ESD protection and filtering behavior, we recommend to implement microvias (100 m dia.) between the GND bumps and the GND layer. GND bumps can...
Description 10-line IPAD, EMI filter including ESD protection

File Size 166.58K  /  7 Page

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    LFTVS18-1F3

STMicroelectronics
Part No. LFTVS18-1F3
OCR Text ...5 m 40 Figure 15. Footprint recommendations Copper pad Diameter: 220 m recommended 260 m maximum Solder mask opening: 300 m minimum Figure 16. Marking Dot xx = marking z = manufacturing location yww = datecode (y = year ww = week) ...
Description Low forward voltage TransiTM, transient voltage suppressor

File Size 188.75K  /  7 Page

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    NX8563LF311-BA NX8563LB533-BA NX8563LF334-BA NX8563LB334-BA NX8563LB437-BA NX8563LF437-BA NX8563LB638-BA NX8563LB326-BA

California Eastern Labs
http://
California Eastern Laboratories, Inc.
Part No. NX8563LF311-BA NX8563LB533-BA NX8563LF334-BA NX8563LB334-BA NX8563LB437-BA NX8563LF437-BA NX8563LB638-BA NX8563LB326-BA NX8563LF326-BA NX8563LB350-BA NX8563LF350-BA NX8563-AZ NX8563LB679-BA NX8563LF679-BA NX8563LB397-BA NX8563LF397-BA NX8563LF597-BA NX8563LF501-BA NX8563LB501-BA NX8563LF303-BA NX8563LB303-BA NX8563LB405-BA NX8563LF405-BA NX8563LB606-BA NX8563LF606-BA NX8563LB509-BA NX8563LF509-BA NX8563LB311-BA NX8563LB614-BA NX8563LF614-BA NX8563LB318-BA NX8563LB517-BA NX8563LF517-BA NX8563LF318-BA NX8563LB622-BA NX8563LB525-BA NX8563LF622-BA NX8563LF525-BA NX8563LB421-BA NX8563LF421-BA NX8563LF654-BA NX8563LB654-BA NX8563LB295-BA NX8563LB445-BA NX8563LB671-BA NX8563LF671-BA NX8563LB565-BA NX8563LB663-BA NX8563LF295-BA NX8563LF429-BA NX8563LB429-BA NX8563LF453-BA NX8563LB453-BA NX8563LB557-BA NX8563LF557-BA NX8563LB581-BA NX8563LB358-BA NX8563LB589-BA NX8563LB469-BA NX8563LF469-BA NX8563LF373-BA NX8563LB373-BA NX8563LB573-BA NX8563LF287-BA NX8563LF493-BA NX8563LB597-BA NX8563LF663-BA NX8563LF461-BA NX8563LB477-BA NX8563LF389-BA NX8563LB366-BA NX8563LF413-BA
OCR Text ...DWDM WAVELENGTHS BASED ON ITU-T recommendations (100 GHz GRID) REFER TO THE ORDERING INFORMATION NX8563 SERIES DESCRIPTION NEC's NX8563 Series are a 1550 nm Multiple Quantum Well (MQW) structured Distributed Feed-Back (DFB) laser dio...
Description CONVERTER DC-DC 6W 48V/12V SGL
NECs CW InGaAsP MQW DFB LASER DIODE MODULE FOR DWDM APPLICATIONS (10 mW MIN) 邻舍连续InGaAsP多量子阱激光器激光二极管模块的DWDM应用10毫瓦最小)
NECs CW InGaAsP MQW DFB LASER DIODE MODULE FOR DWDM APPLICATIONS (10 mW MIN) 邻舍连续InGaAsP多量子阱激光器激光二极管模块的DWDM应用0毫瓦最小)
CONVERTER DC-DC 6W 12V/5V SGL 邻舍连续InGaAsP多量子阱激光器激光二极管模块的DWDM应用0毫瓦最小)
CONVERTER DC-DC 6W 12V/15V SGL 邻舍连续InGaAsP多量子阱激光器激光二极管模块的DWDM应用0毫瓦最小)
DIODE ZENER SINGLE 200mW 39.13Vz 5mA-Izt 0.02518 0.05uA-Ir 30 SOD-323 3K/REEL
TVS BI-DIR 24V 1500W DO-201

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    GO1555

Gennum Corporation
Part No. GO1555
OCR Text ....................4 3. Soldering recommendations ....................................................................................5 3.1 Reflow Conditions .......................................................................................
Description Voltage Controlled Oscillator

File Size 190.67K  /  12 Page

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    INTEL[Intel Corporation]
Part No. 80960KA A80960KA-16 A80960KA-25
OCR Text ......... 10 2.2. Power Decoupling recommendations ....... 10 2.3. Connection recommendations .................. 11 2.4. Characteristic Curves ................................. 11 2.5. Test Load Circuit ...........................................
Description Embedded 32-bit microprocessor 25MHz
Embedded 32-bit microprocessor 16MHz

File Size 841.68K  /  43 Page

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    ESDA18-1F ESDA18-1F2 ESDA18-1F208 ESDA18-1X

STMicroelectronics
Part No. ESDA18-1F ESDA18-1F2 ESDA18-1F208 ESDA18-1X
OCR Text ...A18-1F2 Figure 12. Footprint recommendations Figure 13. Marking Copper pad Diameter: 250 m recommended, 300m max Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) E Solder stencil ope...
Description Transil, transient voltage suppressor

File Size 87.00K  /  8 Page

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