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  joints Datasheet PDF File

For joints Found Datasheets File :: 1460    Search Time::0.578ms    
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    MMFT107T1D MMFT107T3 MMFT107T1 MMFT107 MMFT107T1-D

ONSEMI[ON Semiconductor]
Part No. MMFT107T1D MMFT107T3 MMFT107T1 MMFT107 MMFT107T1-D
OCR Text ..., the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this...
Description Power MOSFET 250 mA, 200 Volts N-Channel SOT-223
Power MOSFET 250 mA / 200 Volts
Power MOSFET 250 mA, 200 Volts 250 mA, 200 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-261AA

File Size 78.70K  /  8 Page

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    MMFT107T1 ON2213

MOTOROLA[Motorola, Inc]
Part No. MMFT107T1 ON2213
OCR Text ..., the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this...
Description MEDIUM POWER TMOS FET 250 mA / 200 VOLTS
MEDIUM POWER TMOS FET 250 mA, 200 VOLTS
From old datasheet system

File Size 116.30K  /  6 Page

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    MMFT108T1 ON2214

MOTOROLA[Motorola, Inc]
Part No. MMFT108T1 ON2214
OCR Text ..., the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this...
Description From old datasheet system
TMOS FET TRANSISTOR N-CHANNEL - ENHANCEMENT

File Size 89.48K  /  6 Page

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    MSC2295BT1 MSC2295-BT1 MSC2295-CT1 ON2374

MOTOROLA INC
Motorola Mobility Holdings, Inc.
ON Semiconductor
MOTOROLA[Motorola, Inc]
Part No. MSC2295BT1 MSC2295-BT1 MSC2295-CT1 ON2374
OCR Text ..., the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this...
Description NPN RF Amplifier Transistors Surface Mount Si, NPN, RF SMALL SIGNAL TRANSISTOR
NPN RF Amplifier Transistors Surface Mount UHF BAND, Si, NPN, RF SMALL SIGNAL TRANSISTOR
CASE 318D3, STYLE 1 SC9
From old datasheet system

File Size 112.62K  /  4 Page

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    MURB1660CT MURB1660CT_D ON2746

MOTOROLA[Motorola, Inc]
ON Semi
Part No. MURB1660CT MURB1660CT_D ON2746
OCR Text ..., the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this...
Description From old datasheet system
ULTRAFAST RECTIFIER 16 AMPERES 600 VOLTS

File Size 103.61K  /  6 Page

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    PZTA42T1

MOTOROLA[Motorola, Inc]
Part No. PZTA42T1
OCR Text ..., the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this...
Description HIGH VOLTAGE TRANSISTOR SURFACE MOUNT

File Size 123.19K  /  6 Page

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    NXP Semiconductors N.V.
Part No. PCF84C85AT
OCR Text ... wave 15.2.2 repairing soldered joints 15.3 so and vso 15.3.1 reflow soldering 15.3.2 wave soldering 15.3.3 repairing soldered joints 16 definitions 17 life support applications 18 purchase of philips i 2 c components 1996 nov 21 3 philip...
Description Microcontroller with extended I/O 8-BIT, MROM, MICROCONTROLLER, PDSO40

File Size 112.81K  /  20 Page

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    2SC4617 ON0109

MOTOROLA[Motorola, Inc]
MOTOROLA[Motorola Inc]
Part No. 2SC4617 ON0109
OCR Text ..., the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this...
Description From old datasheet system
NPN GENERAL PURPOSE AMPLIFIER TRANSISTORS SURFACE MOUNT

File Size 128.44K  /  6 Page

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    BCP56-10T1 BCP56-16T1 ON0172 BCP56-10T3

MOTOROLA INC
ON Semiconductor
Part No. BCP56-10T1 BCP56-16T1 ON0172 BCP56-10T3
OCR Text ..., the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this...
Description 1000 mA, 80 V, NPN, Si, SMALL SIGNAL TRANSISTOR, TO-261AA
From old datasheet system
MEDIUM POWER NPN SILICON HIGH CURRENT TRANSISTOR SURFACE MOUNT

File Size 142.31K  /  6 Page

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    BF720T1

Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. BF720T1
OCR Text ..., the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this...
Description NPN Ssilicon Transistor

File Size 110.03K  /  6 Page

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For joints Found Datasheets File :: 1460    Search Time::0.578ms    
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