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  21101281-005 Datasheet PDF File

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    701-07-0052

Molex Electronics Ltd.
Part No. 701-07-0052
Description 2.54mm (.100") Pitch SL Wire-to-Wire Panel Mount Crimp Housing, Single Row, Version B
2.54mm (.100) Pitch SL Wire-to-Wire Panel Mount Crimp Housing, Single Row, Version B

File Size 166.85K  /  4 Page

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HUA FENG CIRCUIT





    Teledyne Technologies Incorporated.
Part No. TLA-18-6005
Description Low Noise Amplifier 6 GHz - 18 GHz

File Size 887.94K  /  2 Page

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    Teledyne Technologies Incorporated.
Part No. CLA-18-6005
Description Low Noise Amplifier 6 GHz - 18 GHz

File Size 887.80K  /  2 Page

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    AMPHENOL CORP
Part No. 842-800-272-005
Description 36 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 91.43K  /  2 Page

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    CGM-04-0005

Teledyne Technologies Incorporated
Part No. CGM-04-0005
Description Module Amplifier 0.5 GHz - 4 GHz

File Size 906.05K  /  2 Page

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    CGM-08-2005

Teledyne Technologies Incorporated
Part No. CGM-08-2005
Description Module Amplifier 2 GHz - 8 GHz

File Size 906.05K  /  2 Page

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    AN04-005

Lineage Power Corporation
Part No. AN04-005
Description Margining and Voltage Programming

File Size 170.84K  /  4 Page

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    705-75-0054

Molex Electronics Ltd.
Part No. 705-75-0054
Description 2.54mm (.100) Pitch SL Header, Single Row, Right Angle, .180 Pocket, Shrouded,with Press-fit Plastic Peg, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 250.14K  /  4 Page

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    DB25-005

Diotec Semiconductor
Part No. DB25-005
Description    Three-Phase Si-Bridge-Rectifiers

File Size 208.36K  /  2 Page

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    Tech
Part No. RF-005C RF-012
Description (RF-0xxC) Relay

File Size 1,764.20K  /  1 Page

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