metalized pdf Datasheet P14 Full Text Search --- IC-ON-LINE

metalized Datasheet PDF File

For metalized Found Datasheets File :: 746 Search Time::1.954ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |

				PEREGRINE[Peregrine Semiconductor Corp.]
Part No.	PE4245 PE4245-EK 4245-52 4245 4245-00 4245-01 4245-02 4245-51
OCR Text	...DS OF THE PKG. DETAIL A EXPOSED metalized FEATURE EDGE OF PLASTIC BODY EXPOSED (2X) 6 5 4 3 1.050.05 2.010.10 .20 MIN. BOTTOM VIEW 1. DIMENSIONS AND TOLERANCES ARE PER ANSi Y14.5 2. DIMENSIONS ARE IN MILLIMETERS, ANGLES...
Description	SPDT UltraCMOS RF Switch DC - 4000 MHz SPDT UltraCMOSRF Switch DC - 4000 MHz SPDT UltraCMOS⑩ RF Switch DC - 4000 MHz
File Size	274.27K / 8 Page	View it Online	Download Datasheet

				Polyfet RF Devices
Part No.	F1016
OCR Text	...nce TM F1016 PATENTED GOLD metalized SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR 20 Watts Push - Pull Package Style AQ HIGH EFFICIENCY, LINEAR, HIGH GAIN, LOW NOISE ABSOLUTE MAXIMUM RATINGS (TC = 25 C) Total Device Diss...
Description	PATENTED GOLD metalized SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR
File Size	40.45K / 2 Page	View it Online	Download Datasheet

				Polyfet RF Devices
Part No.	F2002
OCR Text	...nce TM F2002 PATENTED GOLD metalized SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR 5 Watts Single Ended Package Style AP HIGH EFFICIENCY, LINEAR, HIGH GAIN, LOW NOISE ABSOLUTE MAXIMUM RATINGS (TC = 25 C) Total Device Diss...
Description	PATENTED GOLD metalized SILICON GATE ENHANCEMENT MODE RF POWER VDMOS TRANSISTOR
File Size	36.99K / 2 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRF6622PBF IRF6622TRPBF
OCR Text	... footprint full size board with metalized back and with small clip heatsink. Notes: R is measured at TJ of approximately 90C. Surface mounted on 1 in. square Cu (still air). Mounted to a PCB with small clip heatsink (still air)...
Description	DirectFET Power MOSFET
File Size	239.76K / 9 Page	View it Online	Download Datasheet

				Amkor Technology, Inc.
Part No.	LCC
OCR Text	... co-fired ceramic base that has metalized terminals / pads on the sides and bottom of the package. An LCC package has terminals / pads on all four edges of the package. The lid for this package can be either ceramic "frit sealed" or metal "...
Description	Leadless Chip Carrier Package
File Size	455.20K / 1 Page	View it Online	Download Datasheet

				http:// VISAY[Vishay Siliconix] Vishay Intertechnology,Inc. Vishay Intertechnology, Inc.
Part No.	732P505X9600L 732P 732P105X9200L 732P105X9400L 732P105X9600L 732P106X9200L 732P106X9400L 732P106X9600L 732P205X9200L 732P205X9400L 732P205X9600L 732P206X9200L 732P206X9400L 732P305X9200L 732P305X9400L 732P305X9600L 732P306X9200L 732P505X9200L 732P505X9400L
OCR Text	metalized Polypropylene, Wrap-and-Fill FEATURES * High stability * High ripple current to 30A * Low inductance and low ESR * Excellent AC performance PERFORMANCE CHARACTERISTICS Operating Temperature: - 55C to + 105C. Capacitance Rang...
Description	From old datasheet system Film Capacitors metalized Polypropylene, Wrap-and-Fill 金属化聚丙烯薄膜电容器，总结和充
File Size	37.78K / 1 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC[ETC]
Part No.	CCSTA14N40
OCR Text	...nPakTM Package is a perforated, metalized ceramic substrate attached to the silicon using 302oC solder. All exterior metal surfaces are tinned with 63pb/37sn solder providing the user with a circuit ready part. It's small size and low profi...
Description	N-Type, ThinPak
File Size	392.17K / 4 Page	View it Online	Download Datasheet

				SKYWORKS[Skyworks Solutions Inc.]
Part No.	DSG9500-000
OCR Text	... device against the gold plated metalized substrate under proper conditions of heat and pressure so that a metallurgical bond joint between the two occurs. Procedure The beam-lead devices to be bonded should be placed on a clean, hard surfa...
Description	Planar Beam Lead PIN Diode
File Size	68.53K / 5 Page	View it Online	Download Datasheet

				EUDYNA[Eudyna Devices Inc]
Part No.	F0100209B
OCR Text	...s TiW/Pt/Au and the backside is metalized by Ti/Au. Assembling Condition SEI recommends the assembling process as shown below and affirms sufficient wirepull and die-shear strength. The heating time of one minute at the temperature of 310 ...
Description	3.3 V /5V 622 Mb/s Receiver Transimpedance Amplifier
File Size	439.19K / 6 Page	View it Online	Download Datasheet

				EUDYNA[Eudyna Devices Inc]
Part No.	F0100404B
OCR Text	...s TiW/Pt/Au and the backside is metalized by Ti/Au. Assembling Condition SEI recommends the assembling process as shown below and affirms sufficient wirepull and die-shear strength. The heating time of one minute at the temperature of 3...
Description	3.3V/5V 1.25 Gb/s Receiver Transimpedance Amplifier
File Size	459.81K / 10 Page	View it Online	Download Datasheet

For metalized Found Datasheets File :: 746 Search Time::1.954ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |