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Amphenol Communications Solutions |
| Part No. |
10080054-521LF
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| Description |
Quickie Header, Wire to Board Connector, Double Row, 14 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10080054-523LF
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| Description |
Quickie Header, Wire to Board Connector, Double Row, 20 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10080054-524LF
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| Description |
Quickie Header, Wire to Board Connector, Double Row, 24 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68405-452HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 52 Positions, 2.54 mm (0.100in)Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713086474
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30m
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| File Size |
1,475.71K /
8 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10080054-525LF
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| Description |
Quickie Header, Wire to Board Connector, Double Row, 26 Positions, Press-Fit Eject Latch Header 2.54 mm 0.76 um (30 u\\.) Gold or GXT™ Mating Plating.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713086476
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 76 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 76 Circuits1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30m
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| File Size |
1,475.71K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68695-452HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Double Row, 52 Positions, 2.54mm Pitch, Right Angle, 5.84mm (0.23in) Mating, 2.29mm (0.09in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713086478
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| Description |
2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 78 Circuits, 1.50μm (59u) Minimum
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 78 Circuits, 1.50楼矛m (59u") Minimum
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| File Size |
1,475.71K /
8 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0713085412 71308-5412
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 12 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
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| File Size |
1,475.56K /
8 Page |
View
it Online |
Download Datasheet |
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