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    2SC5004 2SC5004-T1 2SC5004NE58219 2SC5004-T2

NEC[NEC]
NEC Corp.
NEC, Corp.
Part No. 2SC5004 2SC5004-T1 2SC5004NE58219 2SC5004-T2
OCR Text ...n applied ultra super mini mold package. PACKAGE DIMENSIONS in millimeters 1.6 0.1 0.8 0.1 2 0.3 +0.1 -0 0.15 +0.1 -0.05 FEATURES * * * 0.5 High fT : 5.0 GHz TYP. (@ VCE = 5 V, IC = 5 mA, f = 1 GHz) Low Cre : 0.9 pF TYP....
Description    NPN SILICON EPITAXIAL TRANSISTOR 3 PINS ULTRA SUPER MINI MOLD
SC70/&#181;DFN, Single/Dual Low-Voltage, Low-Power &#181;P Reset Circuits
SC70/µDFN, Single/Dual Low-Voltage, Low-Power µP Reset Circuits
NPN SILICON EPITAXIAL TRANSISTOR 3 PINS ULTRA SUPER MINI MOLD NPN硅外延晶体管3引脚超超级迷你模
NPN epitaxial-type silicon transistor

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    2SC5005 2SC5005-T1 2SC5005NE58119

NEC Corp.
NEC[NEC]
Part No. 2SC5005 2SC5005-T1 2SC5005NE58119
OCR Text ...n applied ultra super mini mold package. PACKAGE DIMENSIONS in millimeters 1.6 0.1 0.8 0.1 2 1.6 0.1 1.0 0.2+0.1 -0 0.5 0.3 +0.1 -0 0.15 +0.1 -0.05 FEATURES * * * High fT : 5.5 GHz TYP. (@ VCE = 5 V, IC = 5 mA, f = 1 GHz...
Description    NPN SILICON EPITAXIAL TRANSISTOR 3 PINS ULTRA SUPER MINI MOLD
Discrete

File Size 53.49K  /  8 Page

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    Holtek Semiconductor Inc.
Part No. HT72XX
OCR Text ...ons. the space-saving sot23 package is attractive for pocket and hand held applications. the devices are capable of supplying 300ma of output current continuously. they are available with several fxed out...
Description 300mA TinyPowerTM LDO

File Size 292.06K  /  10 Page

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    HMC277MS808 HMC277MS8E

Hittite Microwave Corporation
Part No. HMC277MS808 HMC277MS8E
OCR Text ...oss: 9 db rohs compliant msop-8 package electrical specifi cations, t a = +25 c, lo = +13 dbm, if = 100 mhz* typical applications the hmc277ms8 / hmc277ms8e is ideal for: ? cellular / 3g infrastructure ? basestations & repeaters ? gsm, ...
Description GaAs MMIC SMT SINGLE BALANCED MIXER, 0.7 - 1.2 GHz

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    TOSHIBA
Part No. TPN2R503NC
OCR Text ...otprint due to a small and thin package (2) low drain-source on-resistance: r ds(on) = 2.1 m ? (typ.) (v gs = 10 v) (3) low leakage current: i dss = 10 a (max) (v ds = 30 v) (4) enhancement mode: v th = 1.3 to 2.3 v (v ds = 10 v, i...
Description Power MOSFET (N-ch single VDSS≤30V)

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    MC74LVX240DTR2G MC74LVX240MELG MC74LVX240MG MC74LVX240-11

ON Semiconductor
Part No. MC74LVX240DTR2G MC74LVX240MELG MC74LVX240MG MC74LVX240-11
OCR Text ...nd shipping information in the package dimensions section on page 2 of this data sheet. ordering information lvx240 = specific device code a = assembly location wl, l = wafer lot y = year ww, w = work week g or = pb ? free package (not...
Description Octal Bus Buffer

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    IXFR48N60P

IXYS Corporation
Part No. IXFR48N60P
OCR Text ...ernational standard isolated package l ul recognized package l silicon chip on direct-copper-bond substrate - high power dissipation - isolated mounting surface - 2500v electrical isolation l unclamped inductive switching (uis) rated l l...
Description PolarHV HiPerFET Power MOSFET ISOPLUS247

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    DTC115TN3

Cystech Electonics Corp.
Part No. DTC115TN3
OCR Text ...ments the dta115tn3 ? pb-free package equivalent circuit outline absolute maximum ratings (ta=25 c) parameter symbol limits unit collector-base voltage v cbo 50 v collector-emi...
Description NPN Digital Transistors (Built-in Resistors)

File Size 145.85K  /  4 Page

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    C8051F570-IM C8051F560-IM C8051F561-IM C8051F565-IQ C8051F566-IQ C8051F560-IQ C8051F561-IQ C8051F562-IM C8051F562-IQ C80

Silicon Laboratories
Part No. C8051F570-IM C8051F560-IM C8051F561-IM C8051F565-IQ C8051F566-IQ C8051F560-IQ C8051F561-IQ C8051F562-IM C8051F562-IQ C8051F563-IM C8051F563-IQ C8051F564-IM C8051F564-IQ C8051F565-IM C8051F566-IM C8051F567-IM
OCR Text .............. ............. 22 4. package specifications ... ................ ................ ................. .............. .............. ........... 28 4.1. qfn-40 package specifications ................ ................. .................
Description Mixed Signal ISP Flash MCU Family

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