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Amphenol Communications Solutions |
Part No. |
L177HDB44SVF
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Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L177HDB44SD1CH4R
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Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
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Tech specs |
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Official Product Page
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TT electronics Semelab Limited SEME-LAB[Seme LAB]
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Part No. |
2N3054
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Description |
Bipolar NPN Device in a Hermetically sealed TO66 Metal Package.
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File Size |
10.44K /
1 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
L177HDB44SVFM
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Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38um (15u\\) Gold, Fixed M3 Front Screwlock, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L177HDB44SOL2
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Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L77HDB44SD1CH4F
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Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 44 Socket, Flash Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L177HDB44SD1CO3R
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Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350\\), 44 Socket, 0.38um (15u\\) Gold, M3 Rear Threaded Insert, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L77HDB44S
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Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, Flash Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L77HDB44SVFC309
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Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.76m (30 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L177HDB44SD1CH3F
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Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L177HDB44SD1CO4F
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Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (.350\\), 44 Socket, 0.38um (15u\\) Gold, 4-40 Front Screwlock, Without Boardlock
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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