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  44380-1011 Datasheet PDF File

For 44380-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    Taoglas antenna solutio...
Part No. WSA.2458.A.101151
Description    Low Profile for Ease of Installation

File Size 2,332.15K  /  29 Page

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Amphenol Communications Solutions

Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Wing Shing Computer Com...
WINGS[Wing Shing Computer Components]
Part No. 2SA1011
Description PNP EPITAXIAL SILICON TRANSISTOR(LOW FREQUENCY POWER AMPLIFIER)

File Size 68.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MI1011T-01 MI1011T-02 MI1011T-03

List of Unclassifed Manufacturers
ETC
Part No. MI1011T-01 MI1011T-02 MI1011T-03
Description Thermoelectric Cooler

File Size 107.28K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs    

Official Product Page

    NL1011T-01 NL1011T-02 NL1011T-03

List of Unclassifed Manufacturers
ETC
Part No. NL1011T-01 NL1011T-02 NL1011T-03
Description Thermoelectric Cooler

File Size 132.27K  /  2 Page

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Amphenol Communications Solutions

Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-8L
Description MICROWAVE POWER GaAs FET

File Size 132.08K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-5L
Description MICROWAVE POWER GaAs FET

File Size 133.39K  /  5 Page

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Amphenol Communications Solutions

Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs    

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-4L
Description MICROWAVE POWER GaAs FET

File Size 145.86K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs    

Official Product Page

    PS11011

Mitsubishi Electric Semiconductor
POWEREX[Powerex Power Semiconductors]
Part No. PS11011
Description Application Specific Intelligent Power Module FLAT-BASE TYPE INSULATED PACKAGE
FLAT-BASE TYPE INSULATED TYPE

File Size 405.78K  /  6 Page

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Amphenol Communications Solutions

Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs    

Official Product Page

    1821011-06

Qualtek Electronics Corporation
Part No. 1821011-06
Description IEEE1394 4P/M - IEEE1394 4P/M

File Size 385.69K  /  1 Page

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Amphenol Communications Solutions

Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs    

Official Product Page

    2SA1011

Inchange Semiconductor Company Limited
Part No. 2SA1011
Description Silicon PNP Power Transistors

File Size 112.27K  /  4 Page

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Amphenol Communications Solutions

Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs    

Official Product Page

For 44380-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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