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  lapped Datasheet PDF File

For lapped Found Datasheets File :: 119    Search Time::1.687ms    
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    WPWA00210000B XPWA00210000B WPWA00210000C XPWA00210000C WPWA00210000D XPWA00210000D WPWA00210000F XPWA00210000F WPWA0021

Vishay Siliconix
Part No. WPWA00210000B XPWA00210000B WPWA00210000C XPWA00210000C WPWA00210000D XPWA00210000D WPWA00210000F XPWA00210000F WPWA00210000G XPWA00210000G WPWA00210000H XPWA00210000H WPWA00210000J XPWA00210000J WPWA00210000K XPWA00210000K WPWA00110000B XPWA00110000B WPWA00110000C XPWA00110000C WPWA00110000D XPWA00110000D WPWA00110000F XPWA00110000F WPWA00110000G XPWA00110000G WPWA00110000H XPWA00110000H WPWA00110000J XPWA00110000J WPWA01010000B XPWA01010000B WPWA01010000C XPWA01010000C WPWA01010000D XPWA01010000D WPWA01010000F XPWA01010000F WPWA01010000G XPWA01010000G WPWA01010000H XPWA01010000H WPWA01010000J XPWA01010000J WPWA01010000K XPWA01010000K WPWA01010001B XPWA01010001B WPWA01010001C XPWA01010001C WPWA01010001D XPWA01010001D WPWA01010001F XPWA01010001F WPWA01010001G XPWA01010001G WPWA01010001H XPWA01010001H WPWA01010001J XPWA01010001J WPWA00110001B XPWA00110001B WPWA00110001C XPWA00110001C WPWA00110001D XPWA00110001D WPWA00110001F XPWA00110001F WPWA00110001G XPWA00110001G WPWA00110001H XPWA00110001H WPWA00110001J XPWA00110001J WPWA00110001K XPWA00110001K WPWA00910000B XPWA00910000B WPWA00910000C XPWA00910000C WPWA00910000D XPWA00910000D WPWA00910000F XPWA00910000F WPWA00910000G XPWA009100
OCR Text ... 2 10 kA minimum aluminum None, lapped semiconductor silicon ORDERING INFORMATION Example: 100 % visual, 10 k, 1 %, 100 ppm/C TCR, aluminum pads, class H visual inspection W INSPECTION/ PACKAGING W = 100 % visually inspected parts in ...
Description Thin Film Power Resistors

File Size 101.86K  /  3 Page

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    B57220 B57220K0212A003

EPCOS
Part No. B57220 B57220K0212A003
OCR Text ...eatures I Thermistor disk with lapped, coplanar front surfaces I Front surfaces silver-plated I For clamp contacting I UL approved type (up to 125 C operating temperature) Termination D = 2,9 0,3 mm L = 1,3 0,3 mm Approx. weight 5...
Description B57220 Temperature Measurement Leadless Disks
B57220 Temperature Measurement Leadless Disks

File Size 59.12K  /  3 Page

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    B57820M0102A003 B57820M0561A005 B57820M0841A004

EPCOS
Part No. B57820M0102A003 B57820M0561A005 B57820M0841A004
OCR Text ...eatures I Thermistor disk with lapped, coplanar front surfaces I Front surfaces silver-plated I For clamp-contacting I UL approved type (up to 125 C operating temperature) Termination R 100 () 39,60 77,00 92,00 D (mm) 5,1 -1,1 5,3 0...
Description Leadless Disks

File Size 59.39K  /  3 Page

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    Philips Semiconductors / NXP Semiconductors
Part No. RX1214B350Y_2 RX1214B350Y
OCR Text ...d. The mounting surface must be lapped to a surface roughness of Ra <0.5 m and the sum of the depth of the recess and the thickness of the circuits should not exceed the specified minimum dimension between mounting face and the leads of the...
Description NPN Microwave Power Transistor
From old datasheet system

File Size 71.76K  /  12 Page

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    B57350 B57350K0102J000

EPCOS[EPCOS]
Part No. B57350 B57350K0102J000
OCR Text ...eatures I Thermistor disk with lapped, coplanar front surfaces I Front surfaces silver-plated I For clamp contacting Termination D = 3,5 0,3 mm L = 1,3 0,4 mm Approx. weight 75 mg Options Alternative resistance ratings, rated t...
Description Temperature Measurement Leadless Disks

File Size 58.96K  /  3 Page

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    CP2101 CP2102

Silicon Laboratories
Part No. CP2101 CP2102
OCR Text ..._pending is returned, the over- lapped object can then be waited on using waitfors ingleobject(), and re trieve data or cancel using getoverlappedresult() (as documented on msdn by microsoft) or si_cancelio() respec- tively. this functio...
Description    PROGRAMMERS GUIDE

File Size 149.88K  /  36 Page

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    NXP Semiconductors N.V.
PHILIPS[Philips Semiconductors]
Part No. RX1214B350Y
OCR Text ...d. The mounting surface must be lapped to a surface roughness of Ra <0.5 m and the sum of the depth of the recess and the thickness of the circuits should not exceed the specified minimum dimension between mounting face and the leads of the...
Description NPN microwave power transistor L BAND, Si, NPN, RF POWER TRANSISTOR

File Size 91.55K  /  12 Page

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    MTT1100AKMAGKWS MTT1100AKMANHWS MTT1100AKMANKWS MTT1100AKMAGHWS MTT11000FCAGHWS MTT11000FCAGKWS MTT11000FCGGHWS MTT11000

Vishay Siliconix
Part No. MTT1100AKMAGKWS MTT1100AKMANHWS MTT1100AKMANKWS MTT1100AKMAGHWS MTT11000FCAGHWS MTT11000FCAGKWS MTT11000FCGGHWS MTT11000FCGGKWS MTT11000FCGNHWS MTT11000FCGNKWS MTT11000FKAGHWS MTT11000FKANHWS MTT11000FKGGKWS MTT11000FKGNHWS MTT11000FKGNKWS MTT11000FMAGHWS MTT11000FMANHWS MTT11000FMANKWS MTT11000FMGGKWS MTT11000FMGNKWS MTT11000GCANHWS MTT11000GCANKWS MTT11000GCGGKWS MTT11000FCANHWS MTT11000FCANKWS MTT11000FKAGKWS MTT11000FKANKWS MTT11000FKGGHWS MTT11000FMAGKWS MTT11000FMGGHWS MTT11000FMGNHWS MTT11000GCAGKWS MTT11000GCGGHWS MTT11002JMAGKWS MTT11001JMAGKWS MTT1100AJMAGKWS MTT11002JMAGHWS MTT11001JMAGHWS MTT11000JMAGHWS MTT1100AJMAGHWS
OCR Text ... minimum aluminum backing none, lapped semiconduc tor silicon global part number information global part nu mber: mtt11002kmanhws global part number description: mtt 110k 10 %, 250 ppm/c, al termination, no back metal, class h, ws mode...
Description    Wire Bondable Thin Film Multi-Tap Resistor Arrays

File Size 97.92K  /  3 Page

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    MSFM

Vishay Siliconix
Part No. MSFM
OCR Text ...num (au optional) backing none, lapped silicon global part number information glo b al part num b er: msfm10001fkanhws glo b al part num b er description: msfm 10k 1 %, 100 ppm/c, al, no b ack metal, class h, ws model resistance resistan...
Description Thin Film, Top-Contact Miniature Resistor

File Size 84.88K  /  3 Page

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For lapped Found Datasheets File :: 119    Search Time::1.687ms    
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