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For joints Found Datasheets File :: 1460    Search Time::0.703ms    
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    MMBT1010LT1 MSD1010T1

Leshan Radio Company, Ltd.
MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. MMBT1010LT1 MSD1010T1
OCR Text ..., the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this...
Description PNP GENERAL PURPOSE DRIVER TRANSISTORS SURFACE MOUNT 100 mA, 15 V, PNP, Si, SMALL SIGNAL TRANSISTOR

File Size 112.56K  /  4 Page

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    MMBT1010T1 MMBT1010LT1 ON2107

ONSEMI[ON Semiconductor]
Part No. MMBT1010T1 MMBT1010LT1 ON2107
OCR Text ..., the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this...
Description From old datasheet system
Motorola Preferred Devices
PNP GENERAL PURPOSE DRIVER TRANSISTORS SURFACE MOUNT

File Size 82.10K  /  4 Page

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    DAP222 DAP222_D ON0276

MOTOROLA INC
ON Semi
MOTOROLA[Motorola, Inc]
Part No. DAP222 DAP222_D ON0276
OCR Text ..., the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this...
Description SOT-416/SC-90 PACKAGE COMMON ANODE DUAL SWITCHING DIODE SURFACE MOUNT
SOT-16/SC-0 PACKAGE COMMON ANODE
From old datasheet system

File Size 88.38K  /  6 Page

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    EMIF08-LCD04M16

STMicroelectronics
Part No. EMIF08-LCD04M16
OCR Text ...t solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placemen...
Description 8-line L-C IPAD? EMI filter and ESD protection in Micro QFN

File Size 308.75K  /  10 Page

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    BC847BTT1-D

ON Semiconductor
Part No. BC847BTT1-D
OCR Text ..., the circuit boards and solder joints tend to heat first. the components on the board are then heated by conduction. the circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes t...
Description General Purpose Transistors NPN Silicon

File Size 85.82K  /  8 Page

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    NXP Semiconductors N.V.
Part No. IP4352CX24/LF135
OCR Text ... solder to make reliable solder joints (a solder paste characteristic) while being low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classi?ed in a...
Description 9-channel SD-memory card interface filter with ESD protection to IEC 61000-4-2 level 4, NAX000, Reel Pack, SMD, Large 9 FUNCTIONS, 5 V, DATA LINE FILTER

File Size 71.55K  /  13 Page

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    PCD3310 PCD3310A PCD3310AP PCD3310AT PCD3310P PCD3310T

PHILIPS[Philips Semiconductors]
Part No. PCD3310 PCD3310A PCD3310AP PCD3310AT PCD3310P PCD3310T
OCR Text ...g or by wave Repairing soldered joints SO Reflow soldering Wave soldering Repairing soldered joints DEFINITIONS LIFE SUPPORT APPLICATIONS PCD3310; PCD3310A 1996 Nov 21 2 Philips Semiconductors Product specification Pulse a...
Description Pulse and DTMF diallers with redial

File Size 136.30K  /  28 Page

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    PCD3311 PCD3311C PCD3311CP PCD3311CT PCD3312 PCD3312C PCD3312CP PCD3312CT

PHILIPS[Philips Semiconductors]
Part No. PCD3311 PCD3311C PCD3311CP PCD3311CT PCD3312 PCD3312C PCD3312CP PCD3312CT
OCR Text ...g or by wave Repairing soldered joints SO Reflow soldering Wave soldering Repairing soldered joints 2 15 16 17 PCD3311C; PCD3312C DEFINITIONS LIFE SUPPORT APPLICATIONS PURCHASE OF PHILIPS I2C COMPONENTS 1996 Nov 21 Philips Semicon...
Description DTMF/modem/musical-tone generators

File Size 164.28K  /  28 Page

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    PCD3330-1 PCD3330-1P PCD3330-1T

PHILIPS[Philips Semiconductors]
Part No. PCD3330-1 PCD3330-1P PCD3330-1T
OCR Text ...g or by wave Repairing soldered joints SO Reflow soldering Wave soldering Repairing soldered joints DEFINITIONS LIFE SUPPORT APPLICATIONS 1997 Jan 15 Philips Semiconductors Product specification Multistandard repertory dialler/r...
Description Multistandard repertory dialler/ringer with EEPROM

File Size 144.79K  /  32 Page

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    PCD3332-2 PCD3332-2P PCD3332-2T PCD3332-3 PCD3332-3P PCD3332-3T PCD3332-S PCD3332-SP PCD3332-ST

PHILIPS[Philips Semiconductors]
Part No. PCD3332-2 PCD3332-2P PCD3332-2T PCD3332-3 PCD3332-3P PCD3332-3T PCD3332-S PCD3332-SP PCD3332-ST
OCR Text ...ve soldering Repairing soldered joints DEFINITIONS LIFE SUPPORT APPLICATIONS Pin description Supply terminals (VDD and VSS) Oscillator input/output (XTAL1 and XTAL2) Chip enable and frequency discriminator input (CE/FDI) 5.1.4 Cradle swi...
Description Multistandard pulse/tone repertory diallers/ringers

File Size 147.70K  /  32 Page

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For joints Found Datasheets File :: 1460    Search Time::0.703ms    
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