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  85040-0713 Datasheet PDF File

For 85040-0713 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    0713085410 71308-5410

Molex Electronics Ltd.
Part No. 0713085410 71308-5410
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 10 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 10 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

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Amphenol Communications Solutions

Part No. 86585-040LF
Description MINI LATCH HSG DR .125X.-250CC
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0713085408 71308-5408

Molex Electronics Ltd.
Part No. 0713085408 71308-5408
Description 2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 1.50um (59u") Minimum
2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 8 Circuits, 1.50um (59u) Minimum

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10117948-5040HLF
Description mini-SAS HD Copper Cable Assemblies, Cable Assemblies, 24AWG Wire Size, 3Gb/s Data Rate, Minisas HD : 72; Minisas : 26(x2) Contacts, 8 Signal Pairs.
Tech specs    

Official Product Page

    0713085406 71308-5406

Molex Electronics Ltd.
Part No. 0713085406 71308-5406
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Daughterboard Power Module, RightAngle, SMC, 3-Blade Module, 3 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Daughterboard Power Module, RightAngle, SMC, 3-Blade Module, 3 Circuits

File Size 1,475.56K  /  8 Page

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Amphenol Communications Solutions

Part No. 10117948-5040LF
Description mini-SAS HD Copper Cable Assemblies, Cable Assemblies, 24AWG Wire Size, 3Gb/s Data Rate, Minisas HD : 72; Minisas : 26(x2) Contacts, 8 Signal Pairs.
Tech specs    

Official Product Page

    0713085404 71308-5404

Molex Electronics Ltd.
Part No. 0713085404 71308-5404
Description 2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 4 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator Pegs

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Amphenol Communications Solutions

Part No. 10110818-5040LF
Description SFP+ Cable Assembly, 24 AWG, 4.0 meters, passive -standard raw cable, non-halogen free.
Tech specs    

Official Product Page

    71308-5450 0713085450

Molex Electronics Ltd.
Part No. 71308-5450 0713085450
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 50 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

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Amphenol Communications Solutions

Part No. 10110818-5040HFLF
Description SFP+ Cable Assembly, 24 AWG, 4.0 meters, passive -standard raw cable, halogen free.
Tech specs    

Official Product Page

    0713492080

Molex Electronics Ltd.
Part No. 0713492080
Description MOLEX Connector

File Size 420.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 77315-407-13LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    0713086470

Molex Electronics Ltd.
Part No. 0713086470
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 70 Circuits 1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 70 Circuits 1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30

File Size 1,475.71K  /  8 Page

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Amphenol Communications Solutions

Part No. 98426-S04-07-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0713086472

Molex Electronics Ltd.
Part No. 0713086472
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 72 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 72 Circuits,1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30

File Size 1,475.71K  /  8 Page

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Amphenol Communications Solutions

Part No. 98426-G04-07-133LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 14 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0713086474

Molex Electronics Ltd.
Part No. 0713086474
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 74 Circuits1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30m

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Amphenol Communications Solutions

Part No. U95Z2054071301
Description QSFP 2X2 COMBO SP FG NO LP
Tech specs    

Official Product Page

    0713086476

Molex Electronics Ltd.
Part No. 0713086476
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 76 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30mm (.130)
2.54mm (.100") Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 76 Circuits1.50楼矛m (59楼矛") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, with 3.30m

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Amphenol Communications Solutions

Part No. 89007-136LF
Description Metral® Board Connectors, Backplane Connectors, 5 Row Signal Header, Straight, Press-Fit, Wide body.
Tech specs    

Official Product Page

For 85040-0713 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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