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  44661-1011 Datasheet PDF File

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    PS11011

Mitsubishi Electric Semiconductor
POWEREX[Powerex Power Semiconductors]
Part No. PS11011
Description Application Specific Intelligent Power Module FLAT-BASE TYPE INSULATED PACKAGE
FLAT-BASE TYPE INSULATED TYPE
File Size 405.78K  /  6 Page

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Amphenol Communications Solutions
Part No. 10118085-101-12LF
Description Unshrouded Right Angle header,Surface Mount, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-4L
Description MICROWAVE POWER GaAs FET
File Size 145.86K  /  4 Page

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Amphenol Communications Solutions
Part No. 10119333-101-15LF
Description BergStik®, Board to Board connector, Unshrouded horizontal header, Surface mount, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-5L
Description MICROWAVE POWER GaAs FET
File Size 133.39K  /  5 Page

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Amphenol Communications Solutions
Part No. 10114829-10110LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 10 Positions
Tech specs 　 　

Official Product Page

    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM1011-8L
Description MICROWAVE POWER GaAs FET
File Size 132.08K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114831-10113LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 13 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    MI1011T-01 MI1011T-02 MI1011T-03

List of Unclassifed Manufacturers
ETC
Part No. MI1011T-01 MI1011T-02 MI1011T-03
Description Thermoelectric Cooler
File Size 107.28K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114831-10114LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 14 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

    NL1011T-01 NL1011T-02 NL1011T-03

List of Unclassifed Manufacturers
ETC
Part No. NL1011T-01 NL1011T-02 NL1011T-03
Description Thermoelectric Cooler
File Size 132.27K  /  2 Page

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Amphenol Communications Solutions
Part No. 10114829-10114LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 14 Positions
Tech specs 　 　

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    2SA1011

Inchange Semiconductor Company Limited
Part No. 2SA1011
Description Silicon PNP Power Transistors
File Size 112.27K  /  4 Page

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Amphenol Communications Solutions
Part No. 10114828-10115LF
Description 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 15 Positions
Tech specs 　 　

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    3021011-06

Qualtek Electronics Corporation
Part No. 3021011-06
Description USB 4P(A)/M - BLUNT CUT
File Size 374.32K  /  1 Page

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Amphenol Communications Solutions
Part No. 10114830-10111LF
Description 1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 11 Positions
Tech specs 　 　

Official Product Page

    VS1011E

ETC
Part No. VS1011E
Description MPEG AUDIO CODEC
File Size 473.55K  /  49 Page

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Amphenol Communications Solutions
Part No. 10114829-10115LF
Description 1.25mm Wire to Board Wafer, Vertical, Through Hole, 15 Positions
Tech specs 　 　

Official Product Page

    NEC, Corp.
Part No. NEZ1011-3E
Description X BAND, GaAs, N-CHANNEL, RF POWER, MESFET
File Size 23.40K  /  3 Page

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Amphenol Communications Solutions
Part No. 10114831-10115LF
Description 1.25mm Wire-to-Board Connector System WAFER THROUGH HOLE RIGHT ANGLE, 15 POSITIONS, TIN PLATING
Tech specs 　 　

Official Product Page

For 44661-1011 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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